Thermal management with variable conductance heat pipe
US-2020008321-A1 · Jan 2, 2020 · US
Optical transceiver
US12471251B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12471251-B2 |
| Application number | US-202118266095-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 26, 2021 |
| Priority date | Jan 6, 2021 |
| Publication date | Nov 11, 2025 |
| Grant date | Nov 11, 2025 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
An optical transceiver includes a case including a heat sink, one or more heat generating bodies disposed in the case, one or more heat conducting portions protruding from an inner wall surface of the case and thermally contacting the one or more heat generating bodies, and a heat pipe that transfers heat from the one or more heat conducting portions to the heat sink.
First claim
Opening claim text (preview).
What is claimed is: 1 . An optical transceiver comprising: a case including: a lower case having a box-like shape and an upper opening; an upper case that closes the upper opening; and a heat sink disposed on an upper surface of the upper case; one or more heat generating bodies disposed in the lower case; one or more heat conducting portions protruding from an inner wall surface of the upper case and thermally contacting the one or more heat generating bodies; and a heat pipe, disposed in a groove in the inner wall surface of the upper case, that transfers heat from the one or more heat conducting portions to the heat sink, wherein the heat pipe includes: an accommodation portion disposed in the groove; and a protruding portion protruding from the groove and including the one or more heat conducting portions, and the protruding portion is disposed in an internal space enclosed by the lower case and the upper case. 2 . The optical transceiver according to claim 1 , wherein the protruding portion is bent at an obtuse angle with respect to the accommodation portion. 3 . The optical transceiver according to claim 1 , wherein the protruding portion does not contact the case in the internal space. 4 . The optical transceiver according to claim 1 , further comprising: a circuit board accommodated in the internal space; a partition wall dividing the internal space; and an optical module held in the partition wall and including a receiving receptacle that connects to an optical fiber. 5 . The optical transceiver according to claim 4 , wherein the circuit board is connected to the optical module and includes the one or more heat generating bodies. 6 . The optical transceiver according to claim 1 , wherein the heat sink includes a flat base plate and fins standing on the flat base plate, and each of the fins has a circular shape in a plan view.
Assignees
Inventors
Classifications
for cooling by change of state · CPC title
Arrangements for heating · CPC title
Transceivers · CPC title
the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements · CPC title
with heat sinks or radiation fins · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US12471251B2 cover?
- An optical transceiver includes a case including a heat sink, one or more heat generating bodies disposed in the case, one or more heat conducting portions protruding from an inner wall surface of the case and thermally contacting the one or more heat generating bodies, and a heat pipe that transfers heat from the one or more heat conducting portions to the heat sink.
- Who is the assignee on this patent?
- Fujikura Ltd
- What technology area does this patent fall under?
- Primary CPC classification H05K7/20336. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 11 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).