Electronic device comprising camera module with a multi-layer ceramic condenser (MLCC) disposed in a hole in a metal plate under a rigid printed circuit board (RPCB)

Patent metadata

Field	Value
Publication number	US-12470799-B2
Application number	US-202418405268-A
Country	US
Kind code	B2
Filing date	Jan 5, 2024
Priority date	Jul 6, 2021
Publication date	Nov 11, 2025
Grant date	Nov 11, 2025

Abstract

A camera module according to an embodiment of the present disclosure may comprise: a rigid printed circuit board (RPCB), a metal plate coupled to the lower surface of the RPCB and having one or more holes formed therein, a multi-layer ceramic condenser (MLCC) disposed in the one or more holes in the RPCB, and an image sensor disposed on the metal plate. With reference to the lower surface of the RPCB, the MLCC may be formed to have a height less than the height of the metal plate. A camera module structure according to an embodiment of the present disclosure may comprise: a flexible printed circuit board (FPCB), an RPCB coupled to the lower surface of the FPCB and having one or more first holes formed therein, a metal plate coupled to the lower surface of the RPCB and having one or more second holes formed in areas corresponding to the first holes, respectively, an MLCC disposed in the first holes and the second holes below the FPCB, and an image sensor disposed on the metal plate. The MLCC may be disposed in at least one of spaces formed through the first holes and the second holes. According to various embodiments of the present disclosure, a different camera module structure may be utilized such that no separate space is necessary to mount a laminated ceramic capacitor, and space utilization may be improved.

First claim

What is claimed is:

1 . A camera module comprising:
a rigid printed circuit board (RPCB); a metal plate coupled to a lower surface of the RPCB and having one or more holes formed therein; a multi-layer ceramic condenser (MLCC) disposed in the one or more holes under the RPCB; and an image sensor disposed on the metal plate, wherein a height of the MLCC is less than a height of the metal plate with reference to a lower surface of the RPCB.

2 . The camera module of claim 1 , wherein the one or more holes are formed by applying etching to the metal plate.

3 . The camera module of claim 1 , wherein the MLCC is coupled to a lower surface of the RPCB.

4 . The camera module of claim 1 , wherein the image sensor is disposed on an etching area formed by applying etching to the metal plate.

5 . The camera module of claim 4 , wherein the one or more holes are formed around the etching area.

6 . The camera module of claim 1 , wherein the etching area has a shape and a size corresponding to a shape and a size of the image sensor.

7 . The camera module of claim 1 , further comprising a housing,
wherein the RPCB is disposed under the housing.

8 . The camera module of claim 1 , wherein the RPCB is coupled to a lower surface of a flexible printed circuit board (FPCB) and comprises one or more first holes,
wherein the metal plate is coupled to a lower surface of the RPCB and comprises one or more second holes formed in areas corresponding to the first holes, respectively, wherein the MLCC is disposed in the first holes and the second holes under the FPCB, wherein the image sensor is disposed on the metal plate, and wherein the MLCC is disposed in at least one space of spaces formed through the first holes and the second holes.

9 . The camera module of claim 8 , wherein the second holes are formed by applying etching to the metal plate.

10 . The camera module of claim 8 , wherein the MLCC is coupled to a lower surface of the FPCB.

11 . The camera module of claim 8 , wherein the image sensor is disposed on an etching area formed by applying etching to the metal plate.

12 . The camera module of claim 8 , wherein the first holes and the second holes are formed around the etching area.

13 . The camera module of claim 12 , wherein the etching area has a shape and a size corresponding to a shape and a size of the image sensor.

14 . The camera module of claim 8 , further comprising a housing,
wherein the FPCB is disposed under the housing.

15 . The camera module of claim 8 , wherein a height of the MLCC is less than a height of the metal plate with reference to a lower surface of the FPCB.

16 . An electronic device comprising:
a camera module; and at least one processor electrically connected with the camera module; the camera module comprising: a rigid printed circuit board (RPCB); a metal plate coupled to a lower surface of the RPCB and having one or more holes formed therein; a multi-layer ceramic condenser (MLCC) disposed in the one or more holes under the RPCB; and an image sensor disposed on the metal plate, wherein a height of the MLCC is less than a height of the metal plate with reference to a lower surface of the RPCB, and wherein one or more of the at least one processor is configured to obtain image through the image sensor.

17 . The electronic device of claim 16 , wherein the one or more holes are formed by applying etching to the metal plate.

18 . The electronic device of claim 16 , wherein the MLCC is coupled to a lower surface of the RPCB.

19 . The electronic device of claim 16 , wherein the image sensor is disposed on an etching area formed by applying etching to the metal plate.

20 . The electronic device of claim 19 , wherein the one or more holes are formed around the etching area.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Sewon

Classifications

• H05K2201/10636

  Leadless chip, e.g. chip capacitor or resistor · CPC title

• H05K2201/10151

  Sensor · CPC title

• H05K2201/10015

  Non-printed capacitor · CPC title

• H05K1/183

  associated with components mounted in and supported by recessed areas of the PCBs · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title