Electronic device enclosure having a molded structure and a porous metallic structure

Patent metadata

Field	Value
Publication number	US-12470645-B2
Application number	US-202318223337-A
Country	US
Kind code	B2
Filing date	Jul 18, 2023
Priority date	Jul 20, 2022
Publication date	Nov 11, 2025
Grant date	Nov 11, 2025

Abstract

Electronic devices are disclosed that include metal members bonded to members including a polymer material via a porous metallic layer. The polymer material may at least partially fill and mechanically interlock with pores of the porous metallic layer to form an interlock region.

First claim

What is claimed is:

1 . An electronic device comprising:
a display; and an enclosure defining an internal cavity and including:
a housing comprising:
a first metal housing member defining a first portion of an exterior surface of the housing;
a first metallic coating defining a first pore network and disposed along an interior surface of the first metal housing member;
a second metal housing member defining a second portion of the exterior surface of the housing;
a second metallic coating defining a second pore network and disposed along an interior surface of the second metal housing member; and
a dielectric member defining a third portion of the exterior surface of the housing and extending into pores of the first pore network and the second pore network; and

a front cover coupled to the housing and defining a transparent window positioned over the display.

2 . The electronic device of claim 1 , wherein:
the electronic device includes wireless communication circuitry within the internal cavity; the first metal housing member is operably coupled to the wireless communication circuitry; and each of the first metallic coating and the second metallic coating has an average porosity that ranges from 30% to 70% by volume.

3 . The electronic device of claim 2 , wherein each of the first metallic coating and the second metallic coating is formed from metal particles that are bonded together.

4 . The electronic device of claim 2 , wherein:
each of the first metal housing member and the second metal housing member is formed from a first titanium-based material; and each of the first metallic coating and the second metallic coating is formed from a second titanium-based material.

5 . The electronic device of claim 2 , wherein each of the first pore network and the second pore network has an average pore diameter in a range from 20 micrometers to 100 micrometers.

6 . The electronic device of claim 5 , wherein:
the dielectric member is formed from a polymer composite comprising a thermoplastic polymer material and discontinuous fibers dispersed in the thermoplastic polymer material; and at least some of the fibers have a width less than the average pore diameter of each of the first pore network and the second pore network.

7 . The electronic device of claim 1 , wherein the electronic device further comprises a rear cover coupled to the housing and positioned over a wireless charging component.

8 . An electronic device comprising:
an enclosure defining an internal cavity and including:
a first enclosure structure comprising:
a first metal enclosure member defining a first portion of an exterior surface of the enclosure; and
a first metallic coating bonded to an interior surface of the first metal enclosure member and defining a first set of interconnected pores;

a second enclosure structure comprising:
a second metal enclosure member defining a second portion of the exterior surface of the enclosure; and
a second metallic coating bonded to an interior surface of the second metal enclosure member and defining a second set of interconnected pores; and

a dielectric member defining a third portion of the exterior surface of the enclosure and extending into each of the first and the second sets of interconnected pores; and
sensor circuitry positioned within the internal cavity and operatively coupled to the first metal enclosure member.

9 . The electronic device of claim 8 , wherein:
each of the first metallic coating and the second metallic coating has a thickness in a range from 50 micrometers to less than 1 millimeter; a first depth of the dielectric member within the first set of interconnected pores is greater or equal to half the thickness of the first metallic coating; and a second depth of the dielectric member within the second set of interconnected pores is greater or equal to half the thickness of the second metallic coating.

10 . The electronic device of claim 8 , wherein:
the first metallic coating is partially embedded in the first metal enclosure member; and the second metallic coating is partially embedded in the second metal enclosure member.

11 . The electronic device of claim 8 , wherein:
the interior surface of the first metal enclosure member comprises:
a first portion that extends inward from the first portion of the exterior surface of the enclosure; and
a second portion that is opposite the first portion of the exterior surface of the enclosure;
the interior surface of the second metal enclosure member comprises:
a first portion that extends inward from the second portion of the exterior surface of the enclosure; and
a second portion that is opposite the second portion of the exterior surface of the enclosure; and
the dielectric member extends over the first and the second portions of the interior surface of the first metal enclosure member and the first and the second portions of the interior surface of the second metal enclosure member.

12 . The electronic device of claim 11 , wherein:
a third portion of the interior surface of the first metal enclosure member partially defines an interlock feature; and the dielectric member extends over the third portion of the interior surface of the first metal enclosure member.

13 . The electronic device of claim 11 , wherein the first metal enclosure member includes:
a first layer formed of a titanium alloy, defining the first portion of the exterior surface of the enclosure, and defining a first region of the first portion of the interior surface of the first metal enclosure member; and a second layer formed of an aluminum alloy, bonded to the first layer, defining a second region of the first portion of the interior surface of the first metal enclosure member, and defining the second portion of the interior surface of the first metal enclosure member.

14 . The electronic device of claim 13 , wherein the first metallic coating is formed from a titanium-based material.

15 . A housing for an electronic device, the housing comprising:
a first housing member formed from a first metal material defining a first portion of an exterior surface of the housing; a second housing member formed from a second metal material defining a second portion of the exterior surface of the housing; a third housing member formed from a polymer-based material defining a third portion of the exterior surface of the housing; a first metallic layer bonded to an interior surface of the first housing member and defining a first pore network, a first portion of the polymer-based material of the third housing member extending into the first pore network; and a second metallic layer bonded to an interior surface of the second housing member and defining a second pore network, a second portion of the polymer-based material of the third housing member extending into the second pore network.

16 . The electronic device of claim 15 , wherein the first and the second portions of the polymer-based material of the third housing member fill at least 75% of the first pore network and the second pore network.

17 . The electronic device of claim 15 , wherein:
the interior surface of the first housing member defines:
a first portion extending from the first portion of the exterior surface of the housing; and
a second portion partially defining a first interlock feature;
the interior surface of the second housing member defines:
a first portion extending from the second portion of the exterior surface of the housing; and
a second portion partially defin

Assignees

• Apple Inc

Inventors

• Hooton Lee E
• Williams Alexander W

Classifications

• H05K5/03

  Covers · CPC title

• H05K5/04

  Metal casings · CPC title

• G06F1/1656

  Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203) · CPC title

• H04M1/0202 Primary

  Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets (constructional features of telephone transmitters or receivers, e.g. of speakers or microphones H04M1/03) · CPC title

• H04M1/18 Primary

  Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment (H04M1/19 takes precedence) · CPC title