Photonic communication platform and related circuits

Patent metadata

Field	Value
Publication number	US-12470304-B2
Application number	US-202318190940-A
Country	US
Kind code	B2
Filing date	Mar 27, 2023
Priority date	Mar 28, 2022
Publication date	Nov 11, 2025
Grant date	Nov 11, 2025

Abstract

Photonic interposers that enable low-power, high-bandwidth inter-chip (e.g., board-level and/or rack-level) as well as intra-chip communication are described. Described herein are techniques, architectures and processes that improve upon the performance of conventional computers. Some embodiments provide photonic interposers that use photonic tiles, where each tile includes programmable photonic circuits that can be programmed based on the needs of a particular computer architecture. Some tiles are instantiations of a common template tile that are stitched together in a 1D or a 2D arrangement. Some embodiments described herein provide a programmable physical network designed to connect pairs of tiles together with photonic links.

First claim

What is claimed is:

1 . A photonic interposer comprising:
a bus waveguide; a plurality of photonic transmitters coupled to the bus waveguide; a plurality of photonic receivers coupled to the bus waveguide; and a controller configured to:
dither a photonic component of a first photonic transmitter of the plurality of photonic transmitters at a first frequency;
dither a photonic component of a first photonic receiver of the plurality of photonic receivers at the first frequency; and
lock the first photonic transmitter to the first photonic receiver.

2 . The photonic interposer of claim 1 , wherein each of the plurality of photonic transmitters comprises a resonant modulator and each of the plurality of photonic receivers comprises a resonant drop filter coupled to the bus waveguide, wherein:
dithering the photonic component of the first photonic transmitter comprises dithering the resonant modulator of the first photonic transmitter, and dithering the photonic component of the first photonic receiver comprises dithering the resonant drop filter of the first photonic receiver.

3 . The photonic interposer of claim 1 , wherein each of the plurality of photonic transmitters comprises a resonant add filter coupled to the bus waveguide and each of the plurality of photonic receivers comprises a resonant drop filter coupled to the bus waveguide, wherein:
dithering the photonic component of the first photonic transmitter comprises dithering the resonant add filter of the first photonic transmitter, and dithering the photonic component of the first photonic receiver comprises dithering the resonant drop filter of the first photonic receiver.

4 . The photonic interposer of claim 1 , wherein the first frequency is between 1 KHz and 1000 KHz.

5 . The photonic interposer of claim 1 , further comprising a plurality of photonics tiles that are instantiations of a template photonic tile, each of the plurality of photonics tiles comprising a photonic transmitter of the plurality of photonic transmitters and a photonic receiver of the plurality of photonic receivers, wherein the bus waveguide traverses more than one photonic tile.

6 . The photonic interposer of claim 1 , wherein the first photonic transmitter comprises a resonant modulator configured to modulate light received from a laser using input data, wherein the photonic interposer further comprises:
a Mach-Zehnder interferometer (MZI) coupled to the resonant modulator, the MZI having a first output and a second output; and a resonant add filter coupled to the bus waveguide, wherein the controller is configured to transmit the modulated light along the bus waveguide either in a first direction or in a second direction by selectively coupling either the first output or the second output of the MZI to the resonant add filter.

7 . The photonic interposer of claim 6 , further comprising a heater thermally coupled to the resonant modulator and a first monitoring detector coupled to the first output of the MZI, wherein the controller is further configured to lock the resonant modulator to the laser by:
applying a first ramped signal to the heater; and maximizing an output produced by the first monitoring detector.

8 . The photonic interposer of claim 7 , wherein selectively couple either the first output or the second output of the MZI to the resonant add filter comprises:
applying a second ramped signal to the MZI; and minimizing the output produced by the first monitoring detector.

9 . The photonic interposer of claim 8 , wherein selectively couple either the first output or the second output of the MZI to the resonant add filter further comprises:
applying a third ramped signal to the resonant add filter; and minimizing the output produced by a second monitoring detector coupled to the second output of the MZI.

10 . The photonic interposer of claim 6 , wherein the resonant add filter comprises a second order filter.

11 . The photonic interposer of claim 1 , further comprising:
an encoder, coupled to the first photonic transmitter, configured to perform an Xb/Yb encoding scheme; a decoder, coupled to the first photonic receiver, configured to perform an Xb/Yb decoding scheme; and clock recovery circuitry configured to time the first photonic receiver using an output of the decoder.

12 . The photonic interposer of claim 11 , further comprising a first local oscillator coupled to the encoder and a second local oscillator coupled to the decoder.

13 . The photonic interposer of claim 11 , further comprising an equalizer coupled to the first photonic receiver, wherein the equalizer is configured to perform a linear combination of the output of the first photonic receiver.

14 . The photonic interposer of claim 13 , wherein the equalizer is further configured to determine a characteristic of an optical channel during runtime, and is configured to adjust the number of taps associated with the equalizer based on the characteristic of the optical channel determined by the equalizer.

15 . The photonic interposer of claim 13 , wherein the equalizer is further configured to determine a characteristic of an optical channel during runtime, and is configured to adjust coefficients associated with the equalizer based on the characteristic of the optical channel determined by the equalizer.

16 . The photonic interposer of claim 11 , further comprising a plurality of photonics tiles that are instantiations of a template photonic tile, wherein:
the first photonic transmitter is part of a first photonic tile of the plurality of photonics tiles, and the first photonic receiver is part of a second photonic tile of the plurality of photonics tiles.

Assignees

• Lightmatter Inc

Inventors

• Dorta-Quinones Carlos
• Braid Ryan
• Kopa Anthony
• Gould Michael
• Bowman Nathaniel
• Buckenmaier Karl C
• Stadolnik Iii Joseph
• Gupta Shashank
• Carr James
• Harris Nicholas C
• Bunandar Darius

Classifications

• H04J14/0212

  using optical switches or wavelength selective switches [WSS] · CPC title

• H04B10/808

  Electrical power feeding of an optical transmission system · CPC title

• H04B10/803

  Free space interconnects, e.g. between circuit boards or chips · CPC title

• H04B10/40

  Transceivers · CPC title

• H04B10/07953

  Monitoring or measuring OSNR, BER or Q · CPC title