Radio frequency module

Patent metadata

Field	Value
Publication number	US-12469943-B2
Application number	US-202218271272-A
Country	US
Kind code	B2
Filing date	Jan 7, 2022
Priority date	Jan 8, 2021
Publication date	Nov 11, 2025
Grant date	Nov 11, 2025

Abstract

A radio frequency module is disclosed comprising: a radio frequency circuit block which comprises a stack of at least two metal plates and a plurality of radio frequency waveguides defined by channels in the metal plates so as to carry radio frequency signals within the circuit block; and one or more radio frequency processing components arranged within the circuit block to interact with the signals carried by the waveguides.

First claim

The invention claimed is:

1 . A radio frequency module comprising:
a radio frequency circuit block having an inside and an outside, the radio frequency block comprising a stack of at least two metal plates and a plurality of radio frequency waveguides defined by channels in one or more of the at least two metal plates so as to carry radio frequency signals within the circuit block; one or more radio frequency processing components arranged within the circuit block to interact with the signals carried by the waveguides; and one or more flexible printed circuit boards extending from the outside to the inside of the radio frequency circuit block, wherein each of the one or more radio frequency processing components is mounted on one of the one or more flexible printed circuit boards within the radio frequency circuit block.

2 . The radio frequency module of claim 1 , further comprising one or more support circuit boards, each of the one or more support circuit boards being in electrical communication with at least one of the one or more radio frequency processing components.

3 . The radio frequency module of claim 2 , wherein at least one of the one or more support circuit boards is stacked in series with the at least two metal plates.

4 . The radio frequency module of claim 3 , wherein all of the one or more support circuit boards are stacked in series with the at least two metal plates.

5 . The radio frequency module of claim 1 , wherein the circuit block comprises a stack of at least three of the at least two metal plates.

6 . The radio frequency module of claim 5 , wherein each adjacent pair of the at least two metal plates in the stack defines a mutual plate boundary, and at least one of the one or more radio frequency processing components is located at each of at least two of the mutual plate boundaries.

7 . The radio frequency module of claim 1 , wherein at least three of the at least two metal plates define at least part of at least one of the waveguides.

8 . The radio frequency module of claim 2 wherein each metal plate of the stack overlaps with all the others by at least 90% surface area in plan view, and each of one or more of the one or more support circuit boards also overlaps with all of the metal plates of the stack by at least 90% surface area in plan view.

9 . The radio frequency module of claim 1 , wherein one or more of the one or more flexible printed circuit boards has a curvature with a radius of less than 100 mm.

10 . The radio frequency module of claim 2 , wherein each of the one or more support circuit boards is in electrical communication with at least one of the one or more radio frequency processing components via one of said one or more flexible printed circuit boards extending from the support circuit board into the radio frequency circuit block.

11 . The radio frequency module of claim 1 , wherein the radio frequency module is one or more of a receiver module, a heterodyne receiver module, a transmitter module, a transceiver module, and an amplifier module.

12 . The radio frequency module of claim 1 , further comprising a plurality of mounting rods, each mounting rod passing through a series of aligned apertures in all of the at least two metal plates.

13 . The radio frequency module of claim 3 further comprising a plurality of mounting rods, each mounting rod passing through a series of aligned apertures in all of the at least two metal plates, wherein, each of the plurality of mounting rods also passes through a corresponding mounting aperture in each of the one or more support circuit boards stacked in series with the at least two metal plates.

14 . The radio frequency module of claim 1 , wherein each of the at least two metal plate has a same form factor as the other metal plates.

15 . The radio frequency module of claim 3 14 , wherein each of the at least two metal plates has a same form factor as the other metal plates, and some or all of the at least one of the one or more support circuit boards stacked in series with the at least two metal plates have the same form factor as the at least two metal plates.

16 . The radio frequency module of claim 1 , wherein each of the at least two metal plates of the stack overlaps with all the others by at least 90% surface area in plan view.

17 . The radio frequency module of claim 1 , wherein the major surface of each of the at least two metal plates has a surface area of not more than 25 cm 2 .

18 . The radio frequency module of claim 3 , wherein the depth of the stack of at least two metal plates, in combination with the at least one or more support circuit boards stacked in series with the at least two metal plates, is no more than 10 cm.

19 . The radio frequency module of claim 1 , wherein the radio frequency signals have frequencies in the range 10 GHz to 400 GHz.

20 . The radio frequency module of claim 1 , wherein one or more of the one or more radio frequency processing components are coupled to one or more of the waveguides using one or more microstrip circuits located within the radio frequency circuit block.

21 . The radio frequency module of claim 1 , wherein the one or more radio frequency processing components comprise one or more of: a passive component, a discrete diode, a combination of discrete diodes, a resistor or resistor network, an inductor, and a capacitor.

22 . The radio frequency module of claim 1 , wherein the one or more radio frequency processing components comprise one or more of: a transmission line or waveguide directional coupler; a transmission line or waveguide hybrid coupler; a transmission line or waveguide power divider; and a transmission line or waveguide power combiner.

23 . The radio frequency module of claim 1 , wherein the one or more radio frequency processing components comprise one or more of: an active component, a transistor, an amplifier integrated circuit, a mixer integrated circuit, a filter integrated circuit, and a MEMS device.

24 . The radio frequency module of claim 1 , wherein the one or more radio frequency processing components are arranged to implement within the circuit block one or more of: an amplifier, a mixer, a frequency multiplier, and a phase shifter.

25 . A phased array comprising a plurality of the radio frequency modules of claim 1 .

26 . A method of constructing a radio frequency module comprising:
stacking a plurality of metal plates to form a radio frequency circuit block having an inside and outside, the radio frequency circuit block comprising a plurality of radio frequency waveguides defined by channels in at least one of the plurality of metal plates so as to carry radio frequency signals within the radio frequency circuit block, while disposing one or more radio frequency processing components within the circuit block to interact with the signals carried by the waveguides; and providing one or more flexible printed circuit boards extending from the inside to the outside of the radio frequency circuit block, wherein each of the one or more radio frequency processing components is mounted on one of the one or more flexible printed circuit boards within the radio frequency circuit block.

27 . The method of claim 26 , further comprising mounting one or more support circuit boards stacked in series with the plurality of metal plates, each support circuit board being in electrical co

Assignees

• Res & Innovation Uk

Inventors

• Parow-Souchon Kai
• Henry Manju

Classifications

• H05K1/0277

  Bendability or stretchability details (H05K1/038, H05K3/4691 take precedence) · CPC title

• H05K1/0243

  Printed circuits associated with mounted high frequency components · CPC title

• H05K1/02

  Details · CPC title

• H01P3/14

  flexible · CPC title

• H05K1/144

  Stacked arrangements of planar printed circuit boards · CPC title