Thermal conductive sheet and method for manufacturing same
US-2022018617-A1 · Jan 20, 2022 · US
Thermally conductive sheet and method for manufacturing same
US12466984B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12466984-B2 |
| Application number | US-202117918217-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 27, 2021 |
| Priority date | May 29, 2020 |
| Publication date | Nov 11, 2025 |
| Grant date | Nov 11, 2025 |
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- Title
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Abstract
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The present invention is a thermally conductive sheet comprising a plurality of unit layers, each comprising a silicone resin and a thermally conductive filler, the plurality of unit layers being laminated such that the plurality of unit layers are adhered to each other, wherein a volume content of the silicone resin is 32% by volume or less, and a compressive load at a sheet area of 25.4 mm×25.4 mm when the thermally conductive sheet is 30% compressed from a direction perpendicular to an adhesion plane on which the plurality of unit layers are adhered to each other is 7.0 kgf or less. According to the present invention, it is possible to improve the thermal conductivity and enhance the softness of a thermally conductive sheet using a silicone resin as a matrix component and composed of a large number of unit layers laminated as compared with the conventional one.
First claim
Opening claim text (preview).
The invention claimed is: 1 . A thermally conductive sheet comprising a plurality of unit layers, each comprising a silicone resin and a thermally conductive filler, the plurality of unit layers being laminated such that the plurality of unit layers are adhered to each other, wherein a volume content of the silicone resin is 32% by volume or less, wherein the thermally conductive filler comprises an anisotropic filler, wherein the anisotropic filler is oriented in a thickness direction of the sheet, wherein the anisotropic filler comprises a flaky material, wherein a normal direction of a flaky plane of the flaky material faces in a lamination direction of the plurality of unit layers, wherein a content of the flaky material is 120 parts by mass or more per 100 parts by mass of the silicone resin, and a compressive load at a sheet area of 25.4 mm×25.4 mm when the thermally conductive sheet is 30% compressed from a direction perpendicular to an adhesion plane on which the plurality of unit layers are adhered to each other is 7.0 kgf or less. 2 . The thermally conductive sheet according to claim 1 , wherein the plurality of unit layers are laminated along one direction along a plane direction of the sheet. 3 . The thermally conductive sheet according to claim 1 , wherein the thermally conductive filler further comprises a non-anisotropic filler. 4 . The thermally conductive sheet according to claim 1 , wherein the anisotropic filler further comprises a fibrous material. 5 . The thermally conductive sheet according to claim 1 , wherein the unit layers that are adjacent are firmly adhered directly to each other. 6 . The thermally conductive sheet according to claim 1 , wherein the anisotropic filler is boron nitride, and a content of the boron nitride is 180 parts by mass or more per 100 parts by mass of the silicone resin. 7 . The thermally conductive sheet according to claim 1 , wherein the thermal conductivity of the thermally conductive sheet in the thickness direction is 10.5 W/(m·K) or more.
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Classifications
Organics · CPC title
characterised by their materials · CPC title
the coupling element being an additional piece, e.g. thermal standoff · CPC title
the heat-exchange apparatus employing plate-like or laminated conduits · CPC title
Additives containing two or more different additives of the same subgroup in C08K · CPC title
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- What does patent US12466984B2 cover?
- The present invention is a thermally conductive sheet comprising a plurality of unit layers, each comprising a silicone resin and a thermally conductive filler, the plurality of unit layers being laminated such that the plurality of unit layers are adhered to each other, wherein a volume content of the silicone resin is 32% by volume or less, and a compressive load at a sheet area of 25.4 mm×25…
- Who is the assignee on this patent?
- Sekisui Polymatech Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification B32B27/08. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Nov 11 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).