Thermally conductive silicone compositions

Patent metadata

Field	Value
Publication number	US-12466952-B2
Application number	US-202118003206-A
Country	US
Kind code	B2
Filing date	Jun 24, 2021
Priority date	Jun 25, 2020
Publication date	Nov 11, 2025
Grant date	Nov 11, 2025

Abstract

The present invention relates to organopolysiloxane compositions comprising an organopolysiloxane having, per molecule, at least two alkenyl groups, an organopolysiloxane having, per molecule, at least two SiH units, a hydrosilylation catalyst, and a thermally conductive filler, the thermally conductive filler comprising at least 40% by weigh of metallic silicon, and a specific particle size distribution. The invention further relates to a silicone elastomer which can be obtained by cross-linking and/or curing the composition, as well as its use as a thermally conductive material for coating or filling, in particular for the automotive field, in particular for the field of electric vehicles.

First claim

The invention claimed is:

1 . An organopolysiloxane composition X comprising:
at least one organopolysiloxane A having per molecule at least two silicon-bonded C 2 -C 6 alkenyl groups, at least one organopolysiloxane B having per molecule at least two SiH units, a catalytically effective amount of at least one hydrosilylation catalyst C, and a thermally conductive filler D, wherein said thermally conductive filler D comprises at least 40% by weight of metallic silicon, said thermally conductive filler D comprises between 3% and 22% of particles having a diameter of less than or equal to 2 μm, and the particle size distribution is such that the ratio d90/d10 of said filler is greater than or equal to 20.

2 . The organopolysiloxane composition X as claimed in claim 1 , wherein the total weight of the thermally conductive filler D in the organopolysiloxane composition X is between 80% and 95%.

3 . The organopolysiloxane composition X as claimed in claim 1 , wherein said thermally conductive filler D comprises between 3% and 20%, optionally between 6% and 18%, of particles having a diameter of less than or equal to 2 μm.

4 . The organopolysiloxane composition X as claimed in claim 1 , wherein the particle size distribution is such that the ratio d90/d10 of said filler is greater than or equal to 30.

5 . The organopolysiloxane composition X as claimed in claim 1 , wherein said thermally conductive filler D comprises at least 70% by weight of metallic silicon.

6 . The organopolysiloxane composition X as claimed in claim 1 , wherein said thermally conductive filler D comprises 100% by weight of metallic silicon.

7 . The organopolysiloxane composition X as claimed in claim 1 , wherein the thermally conductive filler D comprises not only metallic silicon but also a thermally conductive filler selected from the group consisting of an alumina filler, an aluminum trihydrate filler, an aluminum filler, a silica filler, a zinc oxide filler, an aluminum nitride filler, a boron nitride filler, and mixtures thereof.

8 . The organopolysiloxane composition X as claimed in claim 1 , comprising:
from 5% to 30%, optionally from 8% to 15%, of an organopolysiloxane A having per molecule at least two silicon-bonded C 2 -C 6 alkenyl groups, from 0.1% to 10%, optionally from 0.5% to 5%, of an organopolysiloxane B having per molecule at least two SiH units, from 2 ppm to 400 ppm, optionally from 5 ppm to 200 ppm, of a hydrosilylation catalyst C, from 70% to 95%, optionally from 80% to 95%, of a thermally conductive filler D, from 0.1% to 5%, optionally from 1% to 3%, of an agent for treating the thermally conductive filler E, from 100 ppm to 3000 ppm, optionally from 100 ppm to 2000 ppm, of a crosslinking inhibitor F.

9 . A two-component system P which is a precursor of the organopolysiloxane composition X as defined in claim 1 comprising the constituents A, B, C, and D, said two-component system P comprising two separate parts, P1 and P2, which are intended for mixing to form said organopolysiloxane composition X, and wherein one of the parts, P1 or P2, comprises the catalyst C and does not comprise the organopolysiloxane B, whereas the other part, P1 or P2, comprises the organopolysiloxane B and does not comprise the catalyst C.

10 . A silicone elastomer obtainable by crosslinking and/or curing the organopolysiloxane composition X as defined in claim 1 .

11 . A process for preparing a silicon elastomer, said process comprising:
a) supplying a two-component system P comprising all of the components of the organo-polysiloxane composition X as defined in claim 1 ; b) mixing the two parts of said two-component system P to give the organopolysiloxane composition X; and c) crosslinking and/or curing said organopolysiloxane composition X to give said silicone elastomer.

12 . A product comprising the silicone elastomer as defined in claim 10 wherein said product comprises a thermally conductive coating or filling material, optionally in an electronics field, in an electrical application, and/or in an automotive field.

13 . An intermediate composition comprising:
at least one organopolysiloxane A having per molecule at least two silicon-bonded C 2 -C 6 alkenyl groups, and a thermally conductive filler D, wherein said thermally conductive filler D comprises at least 40% by weight of metallic silicon, said thermally conductive filler D comprises between 3% and 22% of particles having a diameter of less than or equal to 2 μm, and the particle size distribution is such that the ratio d90/d10 of said filler is greater than or equal to 20.

Assignees

• Elkem Silicones France Sas

Inventors

• Pelle Aurelie
• Fauvre Lucile
• Dubois Julie

Classifications

• C08K2201/001

  Conductive additives · CPC title

• C08K2003/2227

  of aluminium · CPC title

• C08K2003/023

  Silicon · CPC title

• C08K3/22

  of metals · CPC title

• C08K3/02

  Elements · CPC title