MEMS switch, preparation method thereof, and electronic apparatus

Patent metadata

Field	Value
Publication number	US-12466723-B2
Application number	US-202218028567-A
Country	US
Kind code	B2
Filing date	Apr 27, 2022
Priority date	Apr 27, 2022
Publication date	Nov 11, 2025
Grant date	Nov 11, 2025

Abstract

A MEMS switch, a preparation method thereof, and an electronic apparatus. The MEMS switch includes: a substrate, a coplanar waveguide line structure disposed on a side of the substrate, an isolation structure disposed on a side of the coplanar waveguide line structure away from the substrate, a film bridge disposed on a side of the isolation structure away from the substrate. The coplanar waveguide line structure includes a first wire, a first DC bias line, a second wire, a second DC bias line and a third wire arranged at intervals sequentially. The second wire is one of an RF signal transmission line and a ground line, the first wire and the third wire are the other of the RF signal transmission line and the ground line. The film bridge is crossed between the first wire and third wire, and is connected with the first wire and the third wire respectively.

First claim

The invention claimed is:

1 . A Micro-Electro-Mechanical System (MEMS) switch, comprising: a substrate, a coplanar waveguide line structure disposed on a side of the substrate, an isolation structure disposed on a side of the coplanar waveguide line structure away from the substrate, and a film bridge disposed on a side of the isolation structure away from the substrate; wherein
the coplanar waveguide line structure comprises a first wire, a first Direct Current (DC) bias line, a second wire, a second DC bias line and a third wire that are arranged at intervals sequentially; the second wire is one of a Radio Frequency (RF) signal transmission line and a ground line, and the first wire and the third wire are the other one of the RF signal transmission line and the ground line; the film bridge is crossed between the first wire and the third wire, and is connected with the first wire and the third wire, respectively; wherein the isolation structure comprises a first isolation layer disposed on a side of the first DC bias line away from the substrate, and a second isolation layer disposed on a side of the second DC bias line away from the substrate; wherein the film bridge comprises: a middle region, and a first connection region and a second connection region arranged on two sides of the middle region in the first direction, the first connection region is configured to be connected with the first wire, the second connection region is configured to be connected with the third wire, the middle region comprises: a first sub-region, a second sub-region and a third sub-region connected sequentially, there is a first overlapping region between an orthographic projection of the first sub-region on the substrate and an orthographic projection of the first DC bias line on the substrate, there is a second overlapping region between an orthographic projection of the second sub-region on the substrate and an orthographic projection of the second wire on the substrate, there is a third overlapping region between an orthographic projection of the third sub-region on the substrate and the orthographic projection of the first DC bias line on the substrate, and the first overlapping region, the second overlapping region and the third overlapping region are spaced along the first direction.

2 . The MEMS switch according to claim 1 , wherein the first DC bias line and the second DC bias line each comprise: a first bias line segment, a second bias line segment, and a third bias line segment connected sequentially; the first bias line segment and the third bias line segment each extend in a second direction, the second bias line segment extends in a first direction, wherein the second direction intersects the first direction.

3 . The MEMS switch according to claim 1 , wherein in a direction perpendicular to a plane of the MEMS switch, a thickness of the second wire is greater than or equal to a thickness of the first isolation layer, and the thickness of the second wire is greater than or equal to a thickness of the second isolation layer;
or in a direction perpendicular to a plane of the MEMS switch, a thickness of the second wire is greater than or equal to a sum of a thickness of the first DC bias line and a thickness of the first isolation layer, and the thickness of the second wire is greater than or equal to a sum of a thickness of the second DC bias line and a thickness of the second isolation layer.

4 . The MEMS switch according to claim 1 , wherein when the second wire is an RF signal transmission line, the substrate has a center line extending in a second direction, the second wire is symmetrically disposed about the center line, the first and second DC bias lines are symmetrically disposed about the center line, and the first and third wires are symmetrically disposed about the center line;
or when the second wire is a ground line, the second wire is symmetrically disposed about a center point, the first and second DC bias lines are symmetrically disposed about the center point, and the first and third wires are symmetrically disposed about the center point, wherein the center point is a geometric center of the substrate.

5 . The MEMS switch according to claim 1 , wherein an orthographic projection of the first isolation layer on the substrate is located within a spacing region between an orthographic projection of the first wire on the substrate and an orthographic projection of the second wire on the substrate, and an orthographic projection of the second isolation layer on the substrate is located within a spacing region between the orthographic projection of the second wire on the substrate and an orthographic projection of the third wire on the substrate.

6 . The MEMS switch according to claim 1 , wherein the film bridge extends in a first direction, a size of the first isolation layer in a second direction and a size of the second isolation layer in the second direction are both greater than a size of the film bridge in the second direction, wherein the second direction intersects the first direction.

7 . The MEMS switch according to claim 1 , wherein when the second wire is an RF signal transmission line, the isolation structure further comprises: a third isolation layer that is disposed on a surface of the RF signal transmission line away from the substrate; or, disposed on a surface of the film bridge close to the substrate.

8 . The MEMS switch according to claim 7 , wherein when the third isolation layer is disposed on the surface of the RF signal transmission line away from the substrate, the third isolation layer, the first isolation layer, and the second isolation layer are an integrated structure connecting to each other; or, when the third isolation layer is disposed on the surface of the film bridge close to the substrate, the first isolation layer, the third isolation layer, and the second isolation layer are spaced in a first direction;
or the film bridge extends in the first direction, and a size of the third isolation layer in the first direction greater than or equal to a size of the RF signal transmission line in the first direction; or, a size of the third isolation layer in the second direction is smaller than a size of the RF signal transmission line in the second direction, and the second direction intersects the first direction; or, a thickness of the third isolation layer is less than or equal to a thickness of the RF signal transmission line in a direction perpendicular to a plane of the MEMS switch.

9 . The MEMS switch according to claim 1 , wherein in a plane parallel to the MEMS switch, when the second wire is an RF signal transmission line, a shape of the RF signal transmission line is a long strip shape; or, when the second wire is a ground line, the ground line is shaped as a polyline shape.

10 . The MEMS switch according to claim 9 , wherein the ground line comprises a first ground line segment, a second ground line segment, and a third ground line segment connected sequentially, the first ground line segment, the second ground line segment, and the third ground line segment each have a stepped shape.

11 . The MEMS switch according to claim 1 , wherein at least one of the first sub-region, the third sub-region, the first connection region and the second connection region has a size in a second direction equal to a size of the second sub-region in the second direction; or, at least one of the first sub-region and the third sub-region has a size in a second direction larger than a size of at least one of the second sub-region, the first connection region and the second connection region in the second direction, wherein the second direction intersects the first di

Assignees

• Beijing Boe Technology Dev Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Shi Yingli
• Zhou Chao
• Li Yanzhao

Classifications

• H01P1/122

  Waveguide switches · CPC title

• H01H59/0009 Primary

  making use of micromechanics · CPC title

• B81C2201/0105

  Sacrificial layer · CPC title

• B81C1/00142

  Bridges (deformable micromirrors G02B26/0841) · CPC title

• B81B2203/0353

  Holes · CPC title