Hybrid immersion cooling system

Patent metadata

Field	Value
Publication number	US-12464672-B1
Application number	US-202318193432-A
Country	US
Kind code	B1
Filing date	Mar 30, 2023
Priority date	Mar 30, 2022
Publication date	Nov 4, 2025
Grant date	Nov 4, 2025

Abstract

A system including a computing device including a chassis and one or more components. The computing device also including a chip assembly positioned within the chassis. The chip assembly including at least one component of the one or more components of the computing device and a pressure chamber adjacent to the at least one component, wherein the pressure chamber is hermetically sealed and contains a fluid mixture configured to facilitate convective cooling of the at least one component.

First claim

What is claimed is:

1 . A system, comprising:
a computing device comprising a chassis and one or more components; an immersion box within the chassis of the computing device and surrounding the one or more components of the computing device, wherein the immersion box is filled with a fluid; a chip assembly positioned within the immersion box, the chip assembly comprising:
at least one component of the one or more components of the computing device; and
a pressure chamber adjacent to the at least one component, wherein the pressure chamber is hermetically sealed and contains a fluid mixture configured to facilitate convective cooling of the chip assembly including the at least one component; and
a cooling chamber positioned within the immersion box and surrounding the pressure chamber, wherein the immersion box comprises a cooling jacket positioned within walls of the immersion box, the cooling jacket configured to receive coolant from a cold coolant line and allow the coolant to flow through the cooling jacket to facilitate cooling of the one or more components within the immersion box, and wherein the cooling chamber is in fluid communication with the cooling jacket.

2 . The system of claim 1 , wherein the fluid mixture comprises a plurality of metal particles in suspension.

3 . The system of claim 1 , wherein the at least one component comprises a high thermal design power component.

4 . The system of claim 1 , wherein the fluid mixture is configured to facilitate one or more of single-phase cooling or two-phase cooling of the at least one component.

5 . The system of claim 1 ,
wherein the cooling chamber is configured to receive the coolant from the cooling jacket to facilitate cooling of the pressure chamber, and wherein a warm coolant return line is configured to receive the coolant from the cooling chamber.

6 . The system of claim 1 , wherein the chip assembly comprises a first chip assembly, the pressure chamber comprises a first pressure chamber, the cooling chamber comprises a first cooling chamber, and the fluid mixture comprises a first fluid mixture, and wherein the system further comprises:
a plurality of chip assemblies that includes the first chip assembly, wherein each chip assembly of the plurality of chip assemblies is positioned within the chassis, each chip assembly comprising:
a corresponding component of the one or more components of the computing device; and
a corresponding pressure chamber adjacent to the corresponding component, wherein the corresponding pressure chamber is hermetically sealed and contains a corresponding fluid mixture configured to facilitate convective cooling of the corresponding component.

7 . The system of claim 1 ,
wherein the cooling chamber is configured to allow the coolant to flow through the cooling chamber to facilitate cooling of the pressure chamber, wherein the cooling jacket is configured to:
receive the coolant from the cooling chamber; and
facilitate cooling of the one or more components within the immersion box, and
wherein a warm coolant return line is configured to receive the coolant from the cooling jacket.

8 . The system of claim 1 ,
wherein the cooling chamber is configured to allow the coolant to flow through the cooling chamber to facilitate cooling of the pressure chamber, the cooling jacket configured to receive coolant from a cold coolant line, in parallel with the cooling chamber, and allow the coolant to flow through the cooling jacket to facilitate cooling of the one or more components within the immersion box, and wherein a warm coolant return line is configured to receive the coolant from the cooling jacket and the cooling chamber.

9 . The system of claim 1 , wherein the fluid filling the immersion box is configured to facilitate single-phase cooling of the one or more components within the immersion box.

10 . The system of claim 1 , wherein the pressure chamber comprises one or more fins on an exterior of the pressure chamber to facilitate heat transfer from the pressure chamber to the coolant.

11 . A chip assembly, comprising:
at least one component of a plurality of components of a computing device; and a pressure chamber adjacent to the at least one component, wherein the pressure chamber is hermetically sealed and contains a fluid mixture configured to facilitate convective cooling of the chip assembly including the at least one component, wherein the pressure chamber is surrounded by a cooling chamber positioned within an immersion box that surrounds the at least one component, wherein the immersion box is filled with a fluid and comprises a cooling jacket positioned within walls of the immersion box, the cooling jacket configured to receive coolant from a cold coolant line and allow the coolant to flow through the cooling jacket to facilitate cooling of the at least one component, and wherein the cooling chamber is in fluid communication with the cooling jacket.

12 . The chip assembly of claim 11 , wherein the fluid mixture comprises a plurality of metal particles in suspension.

13 . The chip assembly of claim 11 , wherein the at least one component comprises a high thermal design power component.

14 . The chip assembly of claim 11 , wherein the chip assembly is positioned within a chassis of the computing device.

15 . The chip assembly of claim 11 , wherein the chip assembly is positioned outside a chassis of the computing device.

16 . A method comprising:
receiving, by a cooling jacket positioned within walls of an immersion box, coolant from a cold coolant line to allow the coolant to flow through the cooling jacket to facilitate cooling within the immersion box, wherein the immersion box surrounds one or more components of a computing device; and cooling at least one component of the one or more components of the computing device via a chip assembly positioned within a chassis of the computing device, wherein the chip assembly comprises:
at least one component of the one or more components of the computing device; and
a pressure chamber adjacent to the at least one component, wherein the pressure chamber is hermetically sealed and contains a fluid mixture configured to facilitate convective cooling of the chip assembly including the at least one component,
wherein the pressure chamber is surrounded by a cooling chamber positioned within the immersion box, wherein the immersion box is filled with a fluid, and wherein the cooling chamber is in fluid communication with the cooling jacket.

17 . The method of claim 16 , wherein the fluid mixture comprises a plurality of metal particles in suspension.

18 . The method of claim 16 , wherein the fluid mixture is configured to facilitate one or more of single-phase cooling or two-phase cooling of the at least one component.

19 . The method of claim 16 , wherein the fluid mixture is configured to mitigate a Leidenfrost effect between the fluid mixture and a wall of the pressure chamber adjacent to the at least one component.

20 . The method of claim 16 , further comprising receiving, by the cooling chamber, the coolant from the cooling jacket to facilitate cooling of the pressure chamber.

Assignees

• Equinix Inc

Inventors

• Pichai Tikhon Suresh
• Truong My Dinh
• Asay Douglas James
• Mar David Buck
• Shah Bhavin Raju

Classifications

• H05K7/20772

  within server blades for removing heat from heat source · CPC title

• H05K7/20236 Primary

  by immersion · CPC title

• H05K7/2029

  using a liquid coolant with phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title

• H05K7/20809

  within server blades for removing heat from heat source · CPC title

• H05K7/20409

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title