Method and system for manufacturing flexible transparent conductive film with embedded metal material

Patent metadata

Field	Value
Publication number	US-12464650-B2
Application number	US-202017640371-A
Country	US
Kind code	B2
Filing date	Dec 24, 2020
Priority date	Nov 26, 2020
Publication date	Nov 4, 2025
Grant date	Nov 4, 2025

Abstract

The present disclosure provides a method and a system for manufacturing a flexible transparent conductive film with an embedded metal material. The method comprises the steps of sequentially printing metal nanowire grids and metal grids with a large aspect ratio on a printing substrate through an electric field driven micro-nano 3D printing method, and forming a composite conductive electrode of the metal grids and the metal nanowire grids; performing conductive treatment on the composite conductive electrode to obtain an electrode material; and embedding the electrode material into a photoresist, separating the photoresist embedded with the electrode material from the printing substrate, and removing the printing substrate to obtain a conductive film, wherein the metal nanowire grids are formed by printing the metal nanowires, and the metal grids with a large aspect ratio are formed by printing nano metal paste.

First claim

What is claimed is:

1 . A method for manufacturing a film with an embedded metal material, comprising the steps of:
sequentially printing metal nanowire grids and metal grids with a large aspect ratio on a printing substrate using an electric field driven micro-nano 3D printing device with a printing needle, and forming a composite conductive electrode of the metal grids and the metal nanowire grids, wherein the printing needle used for electric field driven micro-nano 3D printing comprises a metal needle and an insulating tube, wherein the insulating tube sleeves the outside of the metal needle, the central axis of the metal needle and the central axis of the insulating tube are located on the same straight line, an outlet of the insulating tube is of a necking structure, and the inner diameter of the outlet of the necking structure is less than that of the metal needle; and performing conductive treatment on the composite conductive electrode to obtain an electrode material; and embedding the electrode material into a photoresist, separating the photoresist embedded with the electrode material from the printing substrate, and removing the printing substrate to obtain a conductive film, wherein the metal nanowire grids are formed by printing metal nanowires; the metal grids with a large aspect ratio are formed by printing nano metal paste, and the large aspect ratio is that the ratio range of the wire heights to the wire widths of the grid wires of the metal grids is 0.3-30.

2 . The method for manufacturing a film with an embedded metal material according to claim 1 , wherein during printing, the distance between the printing needle and the printing substrate is 40-200 μm, and the power supply voltage is 800-1700 V.

3 . The method for manufacturing a film with an embedded metal material according to claim 1 , wherein during printing, the printing substrate is fixed in a negative pressure mode.

4 . The method for manufacturing a film with an embedded metal material according to claim 1 , wherein the photoresist is laid on the surface of a transfer base, the electrode material on the surface of the printing substrate is immersed into the photoresist laid on the surface of the transfer base, then the photoresist is solidified, and the solidified photoresist is separated from the printing substrate; and
the mode of curing the photoresist is ultraviolet irradiation curing.

5 . The method for manufacturing a film with an embedded metal material according to claim 1 , wherein after the printing substrate is removed, a protective film is covered on the surface of the photoresist.

Assignees

• Univ Qingdao Technology
• Qingdao 5D Intelligent Additive Mfg Tech
• Qingdao 5D Intelligent Additive Manufacturing Tech Co Ltd

Inventors

• Zhu Xiaoyang
• Qi Ximeng
• Lan Hongbo
• Li Hongke
• Li Zhenghao
• Xu Quan
• Zhao Jiawei

Classifications

• H05K1/028

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• H05K1/0274

  Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42) · CPC title

• B33Y30/00 Primary

  Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

• B33Y10/00

  Processes of additive manufacturing · CPC title

• H05K2201/09681

  Mesh conductors, e.g. as a ground plane · CPC title