Component carrier with inductive element included in layer build-up, and manufacturing method

Patent metadata

Field	Value
Publication number	US-12464649-B2
Application number	US-202217663965-A
Country	US
Kind code	B2
Filing date	May 18, 2022
Priority date	May 18, 2021
Publication date	Nov 4, 2025
Grant date	Nov 4, 2025

Abstract

A component carrier includes a stack with at least one electrically insulating layer structure, a structured electrically conductive layer assembled to the stack, where a part of the structured electrically conductive layer is configured as an inductive element, and a magnetic matrix embedded in the stack. The magnetic matrix at least partially surrounds the inductive element. Further, a manufacturing method is described.

First claim

The invention claimed is:

1 . A component carrier, comprising:
a stack comprising at least one electrically insulating layer structure; a structured electrically conductive layer assembled to the stack, wherein the structured electrically conductive layer comprises a first portion being patterned so that a discontinuous layer is formed as a patterned portion divided from a second portion of the structured electrically conductive layer, when observed along a cross section of the patterned portion, wherein a part of the structured electrically conductive layer is configured as an inductive element; and a magnetic matrix embedded in the stack, wherein the magnetic matrix at least partially surrounds the inductive element, wherein the second portion of the structured electrically conductive layer surrounds the magnetic matrix when observed along a cross section of the inductive element, and wherein the magnetic matrix comprises: (i) a first part on which the structured electrically conductive layer structure is formed and functions as the inductive element, (ii) a second part at least partially filling a gap between the structured electrically conductive layer structure forming the inductive element, and (iii) a third part covering the structured electrically conductive layer structure forming the inductive element; and an extension of the first part of the magnetic matrix and the third part of the magnetic matrix in at least one of the directions of main extension of the stack is larger than an extension of the second part of the magnetic matrix in said direction.

2 . The component carrier according to claim 1 ,
wherein the inductive element is sandwiched between the first part of the magnetic matrix and the third part of the magnetic matrix, wherein the inductive element is essentially encapsulated by the magnetic matrix, wherein the second part of the magnetic matrix at least partially fills a space in the inductive element.

3 . The component carrier according to claim 2 ,
wherein the first part of the magnetic matrix is embedded in a cavity of the stack.

4 . The component carrier according to claim 2 ,
wherein the third part of the magnetic matrix is embedded in a further electrically insulating layer structure of the stack.

5 . The component carrier according to claim 2 , further comprising:
at least one via that extends through the first magnetic matrix and/or the third magnetic matrix in order to electrically connect the inductive element.

6 . The component carrier according to claim 1 ,
wherein the inductive element comprises one or more windings arranged in a coil-like structure.

7 . The component carrier according to claim 1 ,
wherein a further electrically conductive layer structure is arranged directly on top of the magnetic matrix; or wherein a further electrically conductive layer structure is arranged on top of the magnetic matrix with at least one further electrically insulating layer structure in between.

8 . The component carrier according to claim 7 ,
wherein a via is electrically connected to the further electrically conductive layer structure.

9 . The component carrier according to claim 8 , further comprising:
at least one further via that extends through the further electrically insulating layer structure in order to electrically connect to a part of the structured electrically conductive layer which part is not the inductive element.

10 . The component carrier according to claim 1 ,
wherein the structured electrically conductive layer is a discontinuous layer.

11 . The component carrier according to claim 1 , wherein the magnetic matrix comprises at least one of the following features:
wherein the magnetic matrix continuously fills a volume around the inductive element between windings of the inductive element; wherein the magnetic matrix comprises at least one of the group consisting of a rigid solid, a sheet, and a paste; wherein the magnetic matrix comprises one of the group which consists of: electrically conductive, electrically insulating, partially electrically conductive and partially electrically insulating; wherein the relative magnetic permeability μ r of the magnetic matrix is in a range from 2 to 10 6 ; wherein the magnetic matrix comprises at least one material of the group consisting of a ferromagnetic material, a ferrimagnetic material, a permanent magnetic material, a soft magnetic material, a ferrite, a metal oxide, a dielectric matrix, a prepreg with magnetic particles therein, and an alloy; wherein the magnetic matrix comprises a planar shape; wherein a direction of main extension of the magnetic matrix is oriented essentially parallel to a direction of main extension of the stack.

12 . The component carrier according to claim 1 ,
wherein the inductive element comprises an inductance per area in the range of 10 to 10000 nH/mm 2 .

13 . The component carrier according to claim 1 , further comprising:
an electronic component assembled to the stack, wherein the magnetic matrix is arranged below the electronic component.

14 . The component carrier according to claim 1 , further comprising at least one of the following features:
the extension of the first part of the magnetic matrix or the third part of the magnetic matrix in at least one of the directions of main extension of the stack is larger than the extension of the second part of the magnetic matrix in said direction; a shift between at least two of the first part of the magnetic matrix, the second part of the magnetic matrix, and the third part of the magnetic matrix, in at least one of the directions of main extension of the stack, is 100 μm or less.

15 . A method of manufacturing a component carrier, the method comprising:
providing a stack comprising at least one electrically insulating layer structure; assembling an electrically conductive layer to the stack; structuring the electrically conductive layer, so that a part of the structured electrically conductive layer is configured as an inductive element; wherein the structured electrically conductive layer comprises a first portion being patterned so that a discontinuous layer is formed as a patterned portion divided from a second portion of the structured electrically conductive layer, when observed along a cross section of the patterned portion, and assembling a magnetic matrix to the stack, so that the magnetic matrix at least partially surrounds the inductive element, wherein the second portion of the structured electrically conductive layer surrounds the magnetic matrix, when observed along the cross section of the inductive element, and wherein the magnetic matrix comprises: (i) a first part on which the structured electrically conductive layer structure is formed and functions as the inductive element, (ii) a second part at least partially filling a gap between the structured electrically conductive layer structure forming the inductive element, and (iii) a third part covering the structured electrically conductive layer structure forming the inductive element; and an extension of the first part of the magnetic matrix and the third part of the magnetic matrix in at least one of the directions of main extension of the stack is larger than an extension of the second part of the magnetic matrix in said direction.

16 . The method according to claim 15 , wherein the method further comprises:
forming a cavity in at least one electrically insulating layer structure of the stack; arranging a first part of the magnetic matrix at least parti

Assignees

• At & S Austria Tech & Systemtechnik Ag

Inventors

• Mayr Günther

Classifications

• H05K2201/1003

  Non-printed inductor · CPC title

• H05K2201/08

  Magnetic details · CPC title

• H05K3/10

  in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H01F2027/2809

  on stacked layers · CPC title