Oscillator and method of manufacturing first oscillator and second oscillator

Patent metadata

Field	Value
Publication number	US-12463590-B2
Application number	US-202418646093-A
Country	US
Kind code	B2
Filing date	Apr 25, 2024
Priority date	Apr 27, 2023
Publication date	Nov 4, 2025
Grant date	Nov 4, 2025

Abstract

An oscillator includes a resonator element, a temperature control element that controls a temperature of the resonator element, a microcontroller that stores a temperature control program and controls an operation of the temperature control element based on the temperature control program, and an interface circuit, in which the temperature control program is rewritable via the interface circuit.

First claim

What is claimed is:

1 . An oscillator comprising:
a resonator element; a temperature control element that controls a temperature of the resonator element; a microcontroller that stores a temperature control program and controls an operation of the temperature control element based on the temperature control program; an interface circuit; and a first temperature sensor, wherein the temperature control program is rewritable via the interface circuit, the microcontroller performs, based on the temperature control program, control based on a value obtained by multiplying a difference between a set temperature and a measured temperature measured by the first temperature sensor by a gain, and performs, in a start period after the temperature control element starts to operate, any one of
maximum power suppression control in which power consumption by the temperature control element is limited to a preset upper limit value or less, or
high-speed start control in which the gain is switched from a first value to a second value smaller than the first value.

2 . The oscillator according to claim 1 , further comprising:
a second temperature sensor, wherein a distance between the resonator element and the second temperature sensor is larger than a distance between the resonator element and the first temperature sensor, and the microcontroller performs, based on the temperature control program, control such that the set temperature is higher as a temperature measured by the second temperature sensor is lower.

3 . A method of manufacturing a first oscillator and a second oscillator, wherein
the first oscillator includes a first resonator element, a first temperature control element that controls a temperature of the first resonator element, a first microcontroller, and a first interface circuit, and the second oscillator includes a second resonator element, a second temperature control element that controls a temperature of the second resonator element, a second microcontroller, and a second interface circuit, the method comprising:
causing the first microcontroller to store a first temperature control program for controlling an operation of the first temperature control element via the first interface circuit; and
causing the second microcontroller to store a second temperature control program, which is different from the first temperature control program, for controlling an operation of the second temperature control element via the second interface circuit.

4 . The method according to claim 3 , wherein
the first oscillator further includes a first temperature sensor, the second oscillator further includes a second temperature sensor, the first temperature control program causes the first microcontroller to perform control based on a value obtained by multiplying a difference between a first set temperature and a measured temperature measured by the first temperature sensor by a gain, and perform, in a start period after the first temperature control element starts to operate, maximum power suppression control in which power consumption by the first temperature control element is limited to a preset upper limit value or less, and the second temperature control program causes the second microcontroller to perform control based on a value obtained by multiplying a difference between a second set temperature and a measured temperature measured by the second temperature sensor by a gain, and perform, in a start period after the second temperature control element starts to operate, high-speed start control in which the gain to be multiplied to the difference between the second set temperature and the measured temperature measured by the second temperature sensor is switched from a first value to a second value smaller than the first value.

5 . The method according to claim 4 , wherein
the first oscillator further includes a third temperature sensor, a distance between the first resonator element and the third temperature sensor is larger than a distance between the first resonator element and the first temperature sensor, and the first temperature control program causes the first microcontroller to perform control such that the first set temperature is higher as a temperature measured by the third temperature sensor is lower.

6 . The method according to claim 4 , wherein
the second oscillator further includes a fourth temperature sensor, a distance between the second resonator element and the fourth temperature sensor is larger than a distance between the second resonator element and the second temperature sensor, and the second temperature control program causes the second microcontroller to perform control such that the second set temperature is higher as a temperature measured by the fourth temperature sensor is lower.

7 . The method according to claim 3 , further comprising:
causing the first microcontroller to store a first temperature compensation program for performing temperature compensation on a frequency of a first oscillation signal generated by causing the first resonator element to oscillate via the first interface circuit.

8 . The method according to claim 7 , wherein
the first temperature compensation program causes the first microcontroller to perform at least one of high-order function compensation using a polynomial equation of second-order or higher or neural network compensation using a neural network.

9 . The method according to claim 3 , further comprising:
causing the second microcontroller to store a second temperature compensation program for performing temperature compensation on a frequency of a second oscillation signal generated by causing the second resonator element to oscillate via the second interface circuit.

10 . The method according to claim 9 , wherein
the second temperature compensation program causes the second microcontroller to perform at least one of high-order function compensation using a polynomial equation of second-order or higher or neural network compensation using a neural network.

11 . The oscillator according to claim 1 , wherein
the microcontroller further stores a temperature compensation program and performs temperature compensation on a frequency of an oscillation signal generated by causing the resonator element to oscillate based on the temperature compensation program, and the temperature compensation program is rewritable via the interface circuit.

12 . The oscillator according to claim 11 , wherein
the microcontroller performs at least one of high-order function compensation using a polynomial equation of second-order or higher or neural network compensation using a neural network, based on the temperature compensation program.

Assignees

• Seiko Epson Corp

Inventors

• Uno Tomohiro
• Sudo Yasuhiro
• Seo Kentaro

Classifications

• G06N3/08

  Learning methods · CPC title

• G06N3/04

  Architecture, e.g. interconnection topology · CPC title

• H03B5/32

  being a piezoelectric resonator (selection of piezoelectric material H10N30/00) · CPC title

• H03B5/36

  active element in amplifier being semiconductor device ({H03B5/323, H03B5/326} , H03B5/38 take precedence) · CPC title

• H03H9/19

  consisting of quartz · CPC title