Reversable attachment system

Patent metadata

Field	Value
Publication number	US-12463176-B2
Application number	US-202218145944-A
Country	US
Kind code	B2
Filing date	Dec 23, 2022
Priority date	Dec 23, 2022
Publication date	Nov 4, 2025
Grant date	Nov 4, 2025

Abstract

A reversable attachment system includes an adhesion layer, an inter-substrate bond structure, a mating layer and an extension actuator. The adhesion layer is configured to attach to a first substrate. The inter-substrate bond structure is coupled to the adhesion layer. The mating layer is configured to attach to a second substrate. The extension actuator is configured to attach to the second substrate and expand in response to an absorption of a gas. The inter-substrate bond structure is configured to form an initial thermocompression bond with the mating layer in response to an applied pressure and an applied heat. The expansion of the extension actuator in response to absorbing the gas detaches the inter-substrate bond structure from the mating layer.

First claim

What is claimed is:

1 . A reversable attachment system comprising:
an adhesion layer configured to attach to a first substrate; an inter-substrate bond structure coupled to the adhesion layer; a mating layer configured to attach to a second substrate; and an extension actuator configured to attach to the second substrate and expand in response to an absorption of a gas, wherein the inter-substrate bond structure is configured to form an initial thermocompression bond with the mating layer in response to an applied pressure and an applied heat, and the expansion of the extension actuator in response to absorbing the gas detaches the inter-substrate bond structure from the mating layer.

2 . The reversable attachment system according to claim 1 , wherein the first substrate defines a plane, and the expansion is perpendicular to the plane.

3 . The reversable attachment system according to claim 1 , wherein the extension actuator remains responsive to the gas after exposure to one or more semiconductor processing chemicals used in fabrication of the extension actuator.

4 . The reversable attachment system according to claim 1 , further comprising:
a blocking chemical configured to inhibit the extension actuator from absorbing the gas.

5 . The reversable attachment system according to claim 1 , further comprising:
a plurality of the inter-substrate bond structures arranged in a plurality of rows; and a plurality of the extension actuators disposed between the rows.

6 . The reversable attachment system according to claim 5 , wherein the plurality of the extension actuators are configured as a plurality of bars between the rows.

7 . The reversable attachment system according to claim 1 , wherein the inter-substrate bond structure comprises:
an outer gas-permeable layer coupled to the adhesion layer, wherein the outer gas-permeable layer is configured to expand and create a fracture in the inter-substrate bond structure in response to another absorption of the gas; and an outer bond layer coupled to the outer gas-permeable layer, wherein the outer bond layer is configured to form the initial thermocompression bond with the mating layer on the second substrate.

8 . The reversable attachment system according to claim 1 , wherein:
the extension actuator comprises one of palladium, vanadium, niobium, and titanium; and the gas comprises hydrogen.

9 . The reversable attachment system according to claim 1 , wherein the first substrate comprises one of a semiconductor die, a semiconductor tile, or a semiconductor wafer.

10 . A method for fabricating a reversable attachment system comprising:
forming an adhesion layer on a first substrate; forming an inter-substrate bond structure on the adhesion layer; forming a mating layer on a second substrate; and forming an extension actuator on the second substrate, wherein the extension actuator is configured to expand in response to an absorption of a gas; wherein the inter-substrate bond structure is configured to form an initial thermocompression bond with the mating layer in response to an applied pressure and an applied heat, and the expansion of the extension actuator in response to absorbing the gas detaches the inter-substrate bond structure from the mating layer.

11 . The method according to claim 10 , wherein the first substrate defines a plane, and the expansion is perpendicular to the plane.

12 . The method according to claim 10 , wherein the extension actuator remains responsive to the gas after exposure to one or more semiconductor processing chemicals used in fabrication of the extension actuator.

13 . The method according to claim 10 , further comprising:
inhibiting the extension actuator from absorbing the gas with a blocking chemical.

14 . The method according to claim 10 , further comprising:
forming a plurality of the inter-substrate bond structures arranged in a plurality of rows; and forming a plurality of the extension actuators between the rows.

15 . The method according to claim 14 , wherein the plurality of the extension actuators are configured as a plurality of bars between the rows.

16 . The method according to claim 10 , further comprising:
forming an outer gas-permeable layer of the inter-substrate bond structure, wherein the outer gas-permeable layer is coupled to the adhesion layer, and the outer gas-permeable layer is configured to expand and create a fracture in the inter-substrate bond structure in response to another absorption of the gas; and forming an outer bond layer of the inter-substrate bond structure, wherein the outer bond layer is coupled to the outer gas-permeable layer, and the outer bond layer is configured to form the initial thermocompression bond with the mating layer on the second substrate.

17 . The method according to claim 10 , wherein:
the extension actuator comprises one of palladium, vanadium, niobium, and titanium; and the gas comprises hydrogen.

18 . A method of reworking an inter-substrate thermocompression bond, comprising:
forming an adhesion layer on a first substrate; forming an inter-substrate bond structure on the adhesion layer; forming a mating layer on a second substrate; forming an extension actuator on the second substrate, wherein the extension actuator is configured to expand in response to an absorption of a gas; forming an initial thermocompression bond between the inter-substrate bond structure on the first substrate and the mating layer on the second substrate in response to an applied pressure and an applied heat; exposing the extension actuator to the gas, wherein the expansion of the extension actuator in response to absorbing the gas detaches the inter-substrate bond structure from the mating layer; and separating the first substrate from the second substrate.

19 . The method according to claim 18 , further comprising:
removing the gas from the extension actuator, wherein the extension actuator returns to an original size in response to the removing of the gas; and forming another thermocompression bond between the inter-substrate bond structure on the first substrate and the mating layer on the second substrate in response to an additional applied pressure and an additional applied heat.

20 . The method according to claim 18 , further comprising:
forming another thermocompression bond between another inter-substrate bond structure on a third substrate and the mating layer on the second substrate in response to an additional applied pressure and an additional applied heat.

Assignees

• Boeing Co

Inventors

• Brewer Peter D
• Tang Yan
• Chang Chia-Ming
• Terterian Sevag
• Abijaoude Charbel
• Vajo John J

Classifications

• H10W72/07232

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/241

  Dispositions, e.g. layouts · CPC title

• H10W72/222

  Multilayered bumps, e.g. a coating on top and side surfaces of a bump core · CPC title

• H10W72/072

  of bump connectors · CPC title