Indirect evaporative cooling apparatus and cooling system including the same

Patent metadata

Field	Value
Publication number	US-12460868-B2
Application number	US-202218071891-A
Country	US
Kind code	B2
Filing date	Nov 30, 2022
Priority date	Nov 30, 2021
Publication date	Nov 4, 2025
Grant date	Nov 4, 2025

Abstract

The present disclosure relates to an indirect evaporative cooling apparatus and a cooling system including the same, and more particularly, to an indirect evaporative cooling apparatus including a plurality of evaporation modules each including a first module and a second module, and a cooling system including the same. According to the present disclosure, it is possible to provide an indirect evaporative cooling device that maximizes cooling efficiency and space efficiency, and a cooling system including the same.

First claim

What is claimed is:

1 . An indirect evaporative cooling apparatus comprising a plurality of evaporation modules each of which comprises a first module and a second module disposed to face the first module,
wherein each of a plurality of first modules and a plurality of second modules comprises:
a heat transfer plate configured to provide heat transfer;
a hydrophilic plate disposed to face the heat transfer plate and formed of a porous material capable of absorbing water;
a hydrophobic plate disposed to face the hydrophilic plate on an opposite side of the heat transfer plate and having pores, working fluid flowing through the hydrophobic plate on a side opposite to a side facing the hydrophilic plate; and
a water supply device configured to supply water to the hydrophilic plate,
wherein in each of the evaporation modules, a first flow path through which the working fluid flows is formed between the first module and the second module, wherein a second flow path through which a cooling target fluid flows is formed between two of the evaporation modules adjacent to each other.

2 . The indirect evaporative cooling apparatus of claim 1 ,
wherein, in each of the evaporation modules, the hydrophobic plate of the first module and the hydrophobic plate of the second module are disposed to face each other, and the heat transfer plate of the first module and the heat transfer plate of the second module are respectively disposed at outermost sides of the evaporation module.

3 . The indirect evaporative cooling apparatus of claim 1 , wherein in each of the evaporation modules, the first module and the second module are disposed to be spaced apart from each other.

4 . The indirect evaporative cooling apparatus of claim 3 , wherein the first module and the second module are arranged to be spaced apart from each other by the water supply device of the first module and the water supply device of the second module.

5 . The indirect evaporative cooling apparatus of claim 4 ,
wherein the water supply device of the first module is configured to support at least one of the heat transfer plates, the hydrophilic plate, and the hydrophobic plate of the first module, and the water supply device of the second module is configured to support at least one of the heat transfer plate, the hydrophilic plate, and the hydrophobic plate, and wherein the water supply device of the first module and the water supply device of the second module are stacked on each other.

6 . The indirect evaporative cooling apparatus of claim 1 ,
wherein in each of the evaporation modules, the water supply device of the first module and the water supply device of the second module each include a water supply member having a water supply flow path formed therein, wherein the hydrophilic plate of the first module is exposed to the water supply flow path of the first module, and the hydrophilic plate of the second module is exposed to the water supply flow path of the second module, wherein the hydrophobic plate of the first module is spaced apart from the water supply flow path of the first module, and the hydrophobic plate of the second module is spaced apart from the water supply flow path of the second module.

7 . The indirect evaporative cooling apparatus of claim 6 , wherein each of the hydrophilic plates comprises a protrusion formed in the each hydrophilic plate and protruding toward the water supply flow path.

8 . The indirect evaporative cooling apparatus of claim 6 , wherein the water supply member of the first module and the water supply member of the second module are stacked on each other, and the water supply flow path of the first module and the water supply flow path of the second module communicate with each other.

9 . The indirect evaporative cooling apparatus of claim 1 , wherein each of the plurality of first modules and the plurality of second modules further comprises a mesh member which is disposed to face the hydrophobic plate on an opposite side of the heat transfer plate, and through which the working fluid is able to pass.

10 . The indirect evaporative cooling apparatus of claim 9 , wherein a leak prevention member is provided between the mesh member adjacent thereto and the hydrophobic plate.

11 . The indirect evaporative cooling apparatus of claim 1 , wherein the first flow path and the second flow path are formed in directions crossing each other.

12 . The indirect evaporative cooling apparatus of claim 1 , wherein a plurality of pattern protrusions is formed on a surface of each of the plurality of hydrophilic plates.

13 . The indirect evaporative cooling apparatus of claim 1 , wherein a maximum radius (r) of the pores of the hydrophobic plate satisfies equation r≤2σ/ρgH, where σ is a surface tension coefficient of water, ρ is a density of water, g is an acceleration of gravity, H is a height of the cooling apparatus.

14 . The indirect evaporative cooling apparatus of claim 13 , wherein, when the height (H) of the cooling apparatus is fixed, the lower a position of the hydrophobic plate, the smaller the radius (r) of the pores of the hydrophobic plate.

15 . The indirect evaporative cooling apparatus of claim 1 ,
wherein the working fluid is air, and the outlet of the first flow path communicates with an outdoor space, and and wherein the cooling target fluid is water or air, and an inlet and an outlet of the second flow path communicate with an indoor space.

16 . The indirect evaporative cooling apparatus of claim 15 ,
wherein a portion of indoor air is introduced into the second flow path, and wherein a remaining portion of the indoor air is introduced to the first flow path.

17 . The indirect evaporative cooling apparatus of claim 15 ,
wherein indoor air flows through the second flow path, and wherein at least a portion of the indoor air discharged from the second flow path is introduced to the first flow path.

18 . An indirect evaporative cooling system comprising:
the cooling apparatus of claim 1 ; a first pipe having an inlet communicating with an outdoor space and an outlet communicating with an inlet of the first flow path; a second pipe having an inlet communicating with an indoor space and an outlet communicating with an inlet of the second flow path; a third pipe having an inlet communicating with an outlet of the second flow path, and an outlet communicating with the indoor space; and a fourth pipe having an inlet communicating with the outlet of the first flow path, and an outlet communicating with an outdoor space.

19 . The indirect evaporative cooling system of claim 18 ,
wherein the first pipe comprises an 1-1-th pipe having an inlet communicating with the outdoor space, and an 1-2-th pipe having an outlet communicating with the inlet of the first flow path, wherein the second pipe is connected to a bypass pipe that branches a portion of a fluid, wherein a first switching apparatus is disposed between an outlet of the 1-1-th pipe, an inlet of the 1-2-th pipe, and the bypass pipe, and wherein the first switching apparatus is configured to selectively communicate the 1-2-th pipe with the 1-1-th pipe or the bypass pipe.

20 . The indirect evaporative cooling system of claim 18 ,
wherein the first pipe comprises a 1-1-th pipe having an inlet communicating with the outdoor space, and a 1-2-th pipe having an outlet communicating with the inlet of the first flow path, wherein the third pipe is connected to a bypass pipe that branches a portion of a flu

Assignees

• Korea Inst Mach & Materials

Inventors

• Kim Jungchul
• Kim Dong Ho
• Yoon Seok Ho
• Kim Young

Classifications

• F28D1/0366

  the conduits being formed by spaced plates with inserted elements (F28D1/0358 takes precedence) · CPC title

• F28F2245/02

  hydrophilic · CPC title

• F28F2245/04

  hydrophobic · CPC title

• F28F25/10

  for feeding gas or vapour · CPC title

• F28F3/08

  Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning · CPC title