Catalyst solution for electroless plating devoid of an amine

Patent metadata

Field	Value
Publication number	US-12460301-B2
Application number	US-202217654923-A
Country	US
Kind code	B2
Filing date	Mar 15, 2022
Priority date	Mar 15, 2022
Publication date	Nov 4, 2025
Grant date	Nov 4, 2025

Abstract

A catalyst solution for electroless plating is provided. The catalyst solution is printable and devoid of an amine. The catalyst solution comprises a catalytic metal salt, a solvent, and an epoxy.

First claim

What is claimed is:

1 . A method of directly writing a desired pattern of metal on a surface of a substrate, the method comprising:
selectively applying a printable catalyst solution devoid of an amine to a surface of a substrate in the desired pattern, the catalyst solution comprising a catalytic metal salt, a solvent, and an epoxy; drying the catalyst solution in the desired pattern on the surface of the substrate; and electroless plating the substrate in a metal aqueous solution, wherein the solvent comprises at least one of tetrahydrofuran, and toluene, and wherein the catalytic metal salt comprises one of a chloride, a sulfate, and a nitrate.

2 . The method of claim 1 further comprising:
generating the substrate using additive manufacturing.

3 . The method of claim 1 , wherein selectively applying the catalyst solution comprises aerosol jetting the catalyst solution onto the surface of the substrate.

4 . The method of claim 3 , wherein the aerosol jetting is done at a deposition speed in a range of 20 millimeter/second to 40 millimeter/second.

5 . The method of claim 1 , wherein the electroless plating is performed at a temperature in a range of 50 degrees Celsius to 80 degrees Celsius and a plating rate in a range of 150 Å/minute to 325 Å/minute.

6 . The method of claim 1 , wherein the electroless plating is performed at a temperature in a range of 65 degrees Celsius to 75 degrees Celsius and at a plating rate of 250 Å/minute.

7 . The method of claim 1 , wherein the electroless plating is performed for a time in a range of 15 minutes to 3 hours.

8 . The method of claim 1 , wherein the electroless plating is performed for a time in a range of 15 minutes to 1 hour.

9 . The method of claim 1 , wherein drying the catalyst solution in the desired pattern on the surface of the substrate comprises drying the catalyst solution in the desired pattern on the surface of the substrate within an oven.

10 . The method of claim 1 , wherein drying the catalyst solution in the desired pattern on the surface of the substrate drives off the solvent and dries the epoxy.

11 . The method of claim 1 , wherein the metal aqueous solution comprises at least one of nickel, cobalt, iron, or copper.

12 . The method of claim 1 , wherein the metal aqueous solution comprises at least one of nickel, cobalt, iron, copper, gold, silver, palladium, platinum, rhodium, or ruthenium.

13 . The method of claim 1 , wherein the catalytic metal salt comprises at least one of palladium, platinum, rhodium, iridium, osmium, ruthenium, copper, nickel, or silver.

14 . The method of claim 1 , wherein the catalytic metal salt comprises palladium acetate.

15 . The method of claim 1 , wherein the substrate comprises a non-conductive material.

16 . The method of claim 1 , wherein the surface is at least one of a curved surface or a complex surface.

17 . The method of claim 1 , wherein the substrate comprises a composite or a polymer.

18 . The method of claim 1 , wherein drying the catalyst solution in the desired pattern on the surface of the substrate partially cures the epoxy.

19 . The method of claim 1 , wherein drying the catalyst solution in the desired pattern on the surface of the substrate is performed at a temperature in a range of 75 degrees Celsius to 135 degrees Celsius.

20 . The method of claim 1 , wherein drying the catalyst solution in the desired pattern on the surface of the substrate is performed for a time in a range of 5 minutes to 30 minutes.

21 . The method of claim 1 further comprising:
modifying a time and a temperature of the electroless plating to control a thickness of a metal film deposited during the electroless plating.

22 . A method of directly writing a desired pattern of metal on a surface of a substrate, the method comprising:
selectively applying a printable catalyst solution devoid of an amine to a surface of a substrate in the desired pattern, the catalyst solution comprising a catalytic metal salt, a solvent, and an epoxy; drying the catalyst solution in the desired pattern on the surface of the substrate; and electroless plating the substrate in a metal aqueous solution, wherein the solvent comprises at least one of tetrahydrofuran, and toluene, wherein the catalytic metal salt comprises one of a chloride, a sulfate, and a nitrate, and wherein the metal aqueous solution comprises at least one of nickel, cobalt, iron, gold, silver, palladium, platinum, rhodium, and ruthenium.

23 . A method of directly writing a desired pattern of metal on a surface of a substrate, the method comprising:
selectively applying a printable catalyst solution devoid of an amine to a surface of a substrate in the desired pattern, the catalyst solution comprising a catalytic metal salt, a solvent, and an epoxy; drying the catalyst solution in the desired pattern on the surface of the substrate; and electroless plating the substrate in a metal aqueous solution, wherein the solvent comprises at least one of tetrahydrofuran, and toluene, wherein the catalytic metal salt comprises one of a chloride, a sulfate, and a nitrate, and wherein the catalytic metal salt comprises at least one of platinum, rhodium, iridium, osmium, ruthenium, copper, nickel, and silver.

Assignees

• Boeing Co

Inventors

• Bartlett Katharine Anne
• Johnston Scott R
• Farwig Zachlyn Nell
• Norris Jr Joseph A

Classifications

• C23C18/1608

  from pretreatment step, i.e. selective pre-treatment · CPC title

• B01J2531/824

  Palladium · CPC title

• B01J31/2226

  Anionic ligands, i.e. the overall ligand carries at least one formal negative charge · CPC title

• B01J31/0208

  Ketones or ketals · CPC title

• B01J31/0204

  Ethers · CPC title