Multilayer structure

US12459234B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12459234-B2
Application numberUS-202117915027-A
CountryUS
Kind codeB2
Filing dateMar 10, 2021
Priority dateMar 30, 2020
Publication dateNov 4, 2025
Grant dateNov 4, 2025

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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A multilayer structure includes a resin layer, and a glass layer laminated on the resin layer via an adhesive layer, wherein a thickness of the glass layer is 10 μm or more and 300 μm or less, and an arithmetic mean waviness Wa of an interface of the resin layer and the adhesive layer is 10 μm or less.

First claim

Opening claim text (preview).

The invention claimed is: 1 . A multilayer structure comprising: a resin layer; and a glass layer laminated on the resin layer via an adhesive layer, wherein a thickness of the glass layer is 10 μm or more and 300 μm or less, and an arithmetic mean waviness Wa of an interface of the resin layer and the adhesive layer is 10 μm or less. 2 . The multilayer structure according to claim 1 , wherein a thickness of the resin layer is 20 μm or more and 1000 μm or less. 3 . The multilayer structure according to claim 1 , wherein the resin layer is transparent. 4 . The multilayer structure according to claim 1 , wherein the resin layer is a decorative layer. 5 . The multilayer structure according to claim 4 , wherein the decorative layer is black. 6 . The multilayer structure according to claim 1 , further comprising: a metal layer laminated, via a second adhesive layer, on a side of the resin layer opposite to a side on which the glass layer is laminated. 7 . The multilayer structure according to claim 6 , wherein the metal layer is a ferromagnetic material. 8 . The multilayer structure according to claim 1 , further comprising: a buffer layer laminated via a second adhesive layer on a side of the resin layer opposite to a side on which the glass layer is laminated.

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What does patent US12459234B2 cover?
A multilayer structure includes a resin layer, and a glass layer laminated on the resin layer via an adhesive layer, wherein a thickness of the glass layer is 10 μm or more and 300 μm or less, and an arithmetic mean waviness Wa of an interface of the resin layer and the adhesive layer is 10 μm or less.
Who is the assignee on this patent?
Nitto Denko Corp
What technology area does this patent fall under?
Primary CPC classification B32B17/10. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 04 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).