Three-dimensional shaping device

US12459206B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12459206-B2
Application numberUS-202117381742-A
CountryUS
Kind codeB2
Filing dateJul 21, 2021
Priority dateJul 23, 2020
Publication dateNov 4, 2025
Grant dateNov 4, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A three-dimensional shaping device includes: a shaping table; a layer forming unit configured to form a powder layer on the shaping table; a head configured to eject a liquid containing a binder from a nozzle to a shaping region; and a control unit configured to control movement of the head with respect to the shaping table and driving of the head by applying a voltage. The control unit executes a first flushing operation when an area of the shaping region is equal to or greater than the threshold value, and executes a second flushing operation when the area of the shaping region is less than the threshold value.

First claim

Opening claim text (preview).

What is claimed is: 1 . A three-dimensional shaping device, comprising: a shaping table; a layer forming unit configured to form a powder layer on the shaping table; a liquid supply system comprising: a pressure increase control liquid tank; a pressure reduction control liquid tank; and a head configured to eject a liquid containing a binder from a nozzle to a shaping on the powder layer, wherein the head includes a pressure chamber communicating with the nozzle, a supply path couples the pressure increase control liquid tank and the head and is configured to supply the liquid from the pressure increase control liquid tank to the pressure chamber, a circulation path couples the pressure chamber and the nozzle and is configured to flow the liquid from the pressure chamber to the nozzle for circulation, and a differential pressure control is performed by the pressure increase control liquid tank and the pressure reduction control liquid tank so that a slight negative pressure from an atmospheric pressure is applied to the nozzle of the head; and a control unit configured to control movement of the head with respect to the shaping table and driving of the head by applying a voltage, and to control the head to execute a flushing operation at a flushing position which is a position different from a shaping region, wherein the control unit is configured to calculate an area of the shaping region based on slice data for a single layer of shaping data acquired by the control unit to control movement of the head and drive the head; control the head to execute a first flushing operation when the area of the shaping region of the single layer is equal to or greater than a threshold value; control the head to execute a second flushing operation under a flushing condition different from that of the first flushing operation when the area of the shaping region of the single layer is less than the threshold value; and control a flow of the liquid through the head such that q 2 /q 1 is equal to or greater than 0.05 and equal to or less than 20, where q 1 is a flow rate of the liquid flowing into the circulation path per unit time, and q 2 is a maximum flow rate of the liquid ejected from the nozzle per unit time. 2 . The three-dimensional shaping device according to claim 1 , wherein a frequency of a waveform input to the head in the second flushing operation is higher than a frequency of a waveform input to the head in the first flushing operation. 3 . The three-dimensional shaping device according to claim 1 , wherein a voltage to be applied to the head in the second flushing operation is higher than a voltage to be applied to the head in the first flushing operation. 4 . The three-dimensional shaping device according to claim 1 , wherein an ejection speed of the liquid from the head in the second flushing operation is faster than an ejection speed of the liquid from the head in the first flushing operation. 5 . The three-dimensional shaping device according to claim 1 , wherein a droplet size of the liquid ejected from the head in the second flushing operation is larger than a droplet size of the liquid ejected from the head in the first flushing operation. 6 . The three-dimensional shaping device according to claim 1 , wherein q 2 /q 1 is 0.05. 7 . The three-dimensional shaping device according to claim 1 , wherein when the area of the shaping region of the single layer is equal to or greater than the threshold value, the control unit is configured to perform flushing interval acquisition processing and acquire a flushing internal, when the flushing interval is less than the threshold value, the flushing operation is completed, or when the flushing interval is equal to or greater than the threshold value, the control unit executes the first flushing operation.

Assignees

Inventors

Classifications

  • Rapid manufacturing of 3D objects by additive depositing, agglomerating or laminating of material (selective deposition modelling of metallic powder B22F10/00; rapid manufacturing of 3D objects in general and in particular of plastics B29C64/00) · CPC title

  • for controlling or regulating additive manufacturing processes · CPC title

  • Heads; Nozzles · CPC title

  • Process control · CPC title

  • Nozzles · CPC title

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What does patent US12459206B2 cover?
A three-dimensional shaping device includes: a shaping table; a layer forming unit configured to form a powder layer on the shaping table; a head configured to eject a liquid containing a binder from a nozzle to a shaping region; and a control unit configured to control movement of the head with respect to the shaping table and driving of the head by applying a voltage. The control unit execute…
Who is the assignee on this patent?
Seiko Epson Corp
What technology area does this patent fall under?
Primary CPC classification B29C64/393. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 04 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).