Tool Set for Manufacturing Adhesive Patches, Method of Manufacturing an Adhesive Patch and Adhesive Layering
US-2022258374-A1 · Aug 18, 2022 · US
US12459151B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12459151-B2 |
| Application number | US-202017613542-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 26, 2020 |
| Priority date | May 27, 2019 |
| Publication date | Nov 4, 2025 |
| Grant date | Nov 4, 2025 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A tool set for manufacturing adhesive patches, by processing laminate web. The tool set includes a cutting tool having a cutting face lying in a cutting plane, and an embossing tool having a pressing face lying in a pressing plane, where the cutting plane and the pressing plane are parallel. The embossing tool is configured to press an edge area shape of the adhesive patch to be manufactured, and the cutting tool is configured to cut out the adhesive patch to be manufactured by cutting in edge area or outside the edge area. Furthermore, a method of manufacturing adhesive patches. The method essentially includes a feeding step, a pressing step and cutting step. Lastly an adhesive layering having a backing layer and an adhesive matrix layer. The backing layer having a larger size than the adhesive matrix layer.
Opening claim text (preview).
The invention claimed is: 1 . A method of manufacturing adhesive patches using a tool set, wherein the tool set comprises: a cutting tool; and an embossing tool, wherein the cutting tool and the embossing tool are coaxially moveable relative to each other, the method comprising the steps of: a) feeding a laminate web comprising a backing layer, a support layer, and an adhesive matrix layer arranged between the backing layer and the support layer, as input material; b) pressing an edge area of the adhesive patch to be manufactured on the backing layer thereby pressing out adhesive matrix material under the edge area and bending the edge area around the adhesive matrix layer; and c) cutting out the adhesive patch to be manufactured by cutting the backing layer outside the edge area. 2 . The tool set for manufacturing adhesive patches of claim 1 , wherein the cutting tool has a cutting face lying in a cutting plane; and the embossing tool has a pressing face lying in a pressing plane, wherein the cutting plane and the pressing plane are parallel, wherein the embossing tool is configured to press an edge area shape of the adhesive patch to be manufactured, and wherein the cutting tool is configured to cut out the adhesive patch to be manufactured by cutting along the edge area. 3 . The tool set according to claim 2 , wherein the cutting face and the pressing face have a ring shape. 4 . The tool set according to claim 2 , wherein the cutting face and/or the pressing face have a recessed height offset in the cutting position, whereon, the laminate web is arranged, and wherein the cutting face has a protruding height offset in relation to the pressing face at least in the cutting position, whereby the height offset of the cutting face in relation to the pressing face is of the height of a backing layer of the laminate web. 5 . The tool set according to claim 2 , wherein the inner edge of the cutting face and the outer edge of the pressing face have essentially the same dimension, wherein the inner dimension of the pressing face is between 80% to 98% of the inner and outer dimensions of the cutting face, and wherein the dimensions are preferably diameters. 6 . The method according to claim 1 , wherein cutting is performed by cutting up to the support layer. 7 . The method according to claim 1 , further comprising the steps of: d) removing, in particular peeling, the support layer; e) transferring and connecting the adhesive patch to a release liner; and f) packaging. 8 . An adhesive layering manufactured by the method according to claim 1 comprising: a backing layer; and an adhesive matrix layer, wherein the adhesive matrix layer is arranged on one side of the backing layer, and wherein the backing layer has a larger size than the adhesive matrix layer. 9 . The adhesive layering according to claim 8 , wherein the backing layer overlaps the adhesive matrix layer. 10 . The adhesive layering according to claim 8 , wherein the overlapping area of the backing layer is an edge area of the backing layer, and wherein the edge area is contact with less of the adhesive matrix material than the rest of the backing layer. 11 . The adhesive layering according to claim 9 , wherein the overlapping area covers the perimeter of the adhesive matrix layer and is bend around the adhesive matrix layer. 12 . The adhesive layering according to claim 9 , wherein the area of the adhesive layering in the overlapping area has an embossing, wherein the embossing forms the covering and bending of the backing layer around the adhesive matrix layer; and wherein the embossing forms a pressed-out area of the adhesive matrix material in contact with the overlapping area. 13 . The adhesive patch intermediate product comprising: at least one adhesive layering according to claim 8 ; and a support layer, wherein the at least one adhesive layering is arranged on the support layer, wherein the adhesive matrix layer of the adhesive layering is arranged between the support layer and the backing layer of the adhesive layering, and wherein the overlapping area is in loose contact with the support layer. 14 . The adhesive patch product comprising: an adhesive layering according to claim 8 ; and a release liner, wherein the adhesive matrix layer is arranged between the backing layer and the release liner, and wherein the overlapping area is in loose contact with the release liner. 15 . The tool set according to claim 2 , wherein the cutting face is arranged circumferential to the pressing face. 16 . The tool set according to claim 2 , wherein the cutting tool and the embossing tool are moveable in a stroking manner. 17 . The tool set according to claim 2 , wherein the cutting face and the pressing face have a recessed height offset in the maximum stroke deflection position to a basis plane.
Apparatus or processes for manufacturing adhesive dressings or bandages · CPC title
combining cutting and embossing operations · CPC title
wherein the cutting member reciprocates in, or substantially in, a direction parallel to the cutting edge · CPC title
by pushing out · CPC title
using a press, e.g. of the ram type (presses in general B30B) · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.