Cutting device, cutting method, and storage medium

Patent metadata

Field	Value
Publication number	US-12459146-B2
Application number	US-202318389224-A
Country	US
Kind code	B2
Filing date	Nov 14, 2023
Priority date	Dec 2, 2022
Publication date	Nov 4, 2025
Grant date	Nov 4, 2025

Abstract

A cutting device including: a cutting blade; a tape setting stage on which a tape member is to be mounted; and at least one processor. In producing a masking tape by cutting out a pattern selected by a user from the tape member mounted on the tape setting stage with the cutting blade, the at least one processor detects a region of a nail based on an image of a fingertip acquired with a camera, and adjusts a position at which the pattern is to be cut out such that the pattern is located within a region to be applied to the region of the nail having been detected.

First claim

The invention claimed is:

1 . A cutting device comprising:
a cutting blade; a tape setting stage on which a tape member is to be mounted; and at least one processor, wherein in producing a masking tape by cutting out a pattern selected by a user from the tape member mounted on the tape setting stage with the cutting blade, the at least one processor detects a region of a nail based on an image of a fingertip acquired with a camera, and adjusts a position at which the pattern is to be cut out such that the pattern is located within a region to be applied to the region of the nail having been detected.

2 . The cutting device according to claim 1 , wherein the at least one processor
detects an outer shape of a finger together with the region of the nail based on the image of the fingertip acquired with the camera, and cuts off the masking tape from the tape member mounted on the tape setting stage with the cutting blade such that an outer shape of the masking tape becomes a shape corresponding to the outer shape of the finger having been detected.

3 . The cutting device according to claim 1 , wherein in adjusting the position at which the pattern is to be cut out, the at least one processor adjusts at least any of a position, an orientation, and a size of the pattern.

4 . The cutting device according to claim 1 , wherein in adjusting the position at which the pattern is to be cut out, the at least one processor adjusts the position at which the pattern is to be cut out such that the pattern is not located out of the region to be applied to the region of the nail having been detected.

5 . The cutting device according to claim 1 , further comprising:
a finger stage on which the fingertip is to be arranged to acquire the image of the fingertip with the camera; and a partition that isolates the finger stage from a space in which the cutting blade is provided.

6 . The cutting device according to claim 1 , further comprising:
a finger stage on which the fingertip is to be arranged to acquire the image of the fingertip with the camera; and a rest to rest a finger different from a finger for which the fingertip is to be arranged on the finger stage.

7 . The cutting device according to claim 1 , wherein the camera and the cutting blade are moved integrally.

8 . A cutting method to be executed by a computer of a cutting device, the method comprising:
producing that is producing a masking tape by cutting out a pattern selected by a user from a tape member mounted on a tape setting stage with a cutting blade, wherein the producing includes
detecting that is detecting a region of a nail based on an image of a fingertip acquired with a camera, and
adjusting that is adjusting a position at which the pattern is to be cut out such that the pattern is located within a region to be applied to the region of the nail having been detected in the detecting.

9 . The cutting method according to claim 8 ,
wherein in the detecting, an outer shape of a finger is detected together with the region of the nail based on the image of the fingertip acquired with the camera, and wherein the producing includes cutting off that is cutting off the masking tape from the tape member mounted on the tape setting stage with the cutting blade such that an outer shape of the masking tape becomes a shape corresponding to the outer shape of the finger having been detected.

10 . The cutting method according to claim 8 , wherein in the adjusting that is adjusting the position at which the pattern is to be cut out, at least any of a position, an orientation, and a size of the pattern is adjusted.

11 . The cutting method according to claim 8 , wherein in the adjusting that is adjusting the position at which the pattern is to be cut out, the position at which the pattern is to be cut out is adjusted such that the pattern is not located out of the region to be applied to the region of the nail having been detected.

12 . A non-transitory storage medium having stored thereon a program readable by a computer of a cutting device that includes a cutting blade and a tape setting stage on which a tape member is to be mounted, the program causing the computer to execute
producing that is producing a masking tape by cutting out a pattern selected by a user from the tape member mounted on the tape setting stage with the cutting blade, wherein the producing includes
detecting that is detecting a region of a nail based on an image of a fingertip acquired with a camera, and
adjusting that is adjusting a position at which the pattern is to be cut out such that the pattern is located within a region to be applied to the region of the nail having been detected in the detecting.

13 . The storage medium according to claim 12 ,
wherein in the detecting, an outer shape of a finger is detected together with the region of the nail based on the image of the fingertip acquired with the camera, and wherein the producing includes cutting off that is cutting off the masking tape from the tape member mounted on the tape setting stage with the cutting blade such that an outer shape of the masking tape becomes a shape corresponding to the outer shape of the finger having been detected.

14 . The storage medium according to claim 12 , wherein in the adjusting that is adjusting the position at which the pattern is to be cut out, at least any of a position, an orientation, and a size of the pattern is adjusted.

15 . The storage medium according to claim 12 , wherein in the adjusting that is adjusting the position at which the pattern is to be cut out, the position at which the pattern is to be cut out is adjusted such that the pattern is not located out of the region to be applied to the region of the nail having been detected.

Assignees

• Casio Computer Co Ltd

Inventors

• Hori Masahiro

Classifications

• A45D29/004

  Masking devices for applying polish to the finger nails · CPC title

• B26D1/045

  for thin material, e.g. for sheets, strips or the like · CPC title

• B26D5/007 Primary

  Control means comprising cameras, vision or image processing systems · CPC title

• B26D1/25 Primary

  with a non-circular cutting member · CPC title