Production method for integrated circuits

Patent metadata

Field	Value
Publication number	US-12459027-B2
Application number	US-201815871730-A
Country	US
Kind code	B2
Filing date	Jan 15, 2018
Priority date	Dec 29, 2017
Publication date	Nov 4, 2025
Grant date	Nov 4, 2025

Abstract

An integrated circuit production method. In some examples, the method includes receiving a leadframe comprising a plurality of in-production ICs in a forming machine, singulating the plurality of in-production ICs, forming leads of at least some of the plurality of in-production ICs to comply with dimensions and tolerances corresponding to an intended form factor of the plurality of in-production ICs, and separating, automatically by the forming machine, formed ICs from unformed ICs after the forming.

First claim

What is claimed is:

1 . An integrated circuit (IC) production method, comprising:
receiving, by an IC forming machine, a leadframe comprising a plurality of ICs; singulating, by the IC forming machine, the plurality of ICs; forming, by the IC forming machine, leads of at least some of the plurality of singulated ICs and separating, automatically by the IC forming machine, singulated ICs with formed leads having expected dimensions from singulated ICs with formed leads having other than the expected dimensions.

2 . The IC production method of claim 1 , wherein the forming is intended to produce formed ICs complying with the dimensions and tolerances corresponding to a pre-selected IC package.

3 . The IC production method of claim 1 , wherein the forming machine separates the singulated ICs with formed leads having expected dimensions from the singulated ICs with formed leads having other than the expected dimensions using a separation system.

4 . The IC production method of claim 1 , wherein the forming machine separates the singulated ICs with formed leads having expected dimensions from the singulated ICs with formed leads having other than the expected dimensions without human intervention.

5 . The IC production method of claim 1 , wherein the expected dimensions include a minimum and/or maximum distance between leads of the in-production ICs.

6 . The IC production method of claim 1 , wherein the forming leads includes bending each lead in at least one direction.

7 . The IC production method of claim 1 , wherein the forming leads includes bending each lead in at least two directions.

8 . An integrated circuit (IC) production method, comprising:
receiving, by an IC forming machine, a leadframe comprising a plurality of in-production ICs; singulating, by the IC forming machine, the plurality of in-production ICs; forming, by the IC forming machine, leads of at least some of the plurality of in-production ICs to comply with intended dimensions and tolerances corresponding to the plurality of in-production ICs; and separating, automatically by the forming machine, formed ICs from unformed ICs after the forming, wherein the formed ICs fall via gravity through a void in the forming machine and the unformed ICs are prevented from falling through the void in the forming machine.

9 . The IC production method of claim 8 , wherein the intended dimensions include a minimum and/or maximum distance between leads of the in-production ICs.

10 . The IC production method of claim 8 , wherein the forming leads includes bending each lead in at least one direction.

11 . The IC production method of claim 8 , wherein the forming leads includes bending each lead in at least two directions.

12 . An integrated circuit (IC) production method, comprising:
receiving, by an IC forming machine, a leadframe comprising a plurality of in-production ICs; singulating, by the IC forming machine, the plurality of in-production ICs; forming, by the IC forming machine, leads of at least some of the plurality of in-production ICs to comply with intended dimensions and tolerances corresponding to the plurality of in-production ICs; and separating, automatically by the forming machine, formed ICs from unformed ICs after the forming, wherein the unformed ICs fall via gravity through a void in the forming machine and the formed ICs are prevented from falling through the void in the forming machine.

13 . The IC production method of claim 12 , wherein the intended dimensions include a minimum and/or maximum distance between leads of the in-production ICs.

14 . The IC production method of claim 12 , wherein the forming leads includes bending each lead in at least one direction.

15 . The IC production method of claim 12 , wherein the forming leads includes bending each lead in at least two directions.

16 . A method of making integrated circuit (ICs), comprising:
singulating ICs from a leadframe; forming leads of the singulated ICs; and automatically separating the singulated ICs having formed leads and first dimensions from the singulated ICs having formed leads and other than the first dimensions after the forming without human intervention to perform the separating.

17 . The method of claim 16 , wherein the singulating and the forming are implemented in a same physical component.

18 . The method of claim 16 , wherein the singulating and the forming are implemented in an upper die configured to interact with a lower die to implement the singulating and the forming.

19 . A method of making integrated circuit (ICs), comprising:
singulating ICs from a leadframe; forming leads of the singulated ICs; and automatically separating the singulated ICs having formed leads and first dimensions from the singulated ICs having formed leads and other than the first dimensions after the forming without human intervention to perform the separating, wherein an aperture based means is used for automatically separating the singulated ICs having first dimensions from the singulated ICs having other than the first dimensions.

20 . A method of making integrated circuit (ICs), comprising:
singulating in-production ICs from a leadframe; forming the in-production ICs according to intended dimensions upon which the forming is at least partially based by means for forming the in-production ICs; and automatically separating formed ICs from unformed ICs by a means for forming the in-production ICs, after the forming without human intervention to perform the separating, wherein the means for the automatically separating the formed ICs is detachably coupled to at least a portion of the means for forming the in-productions ICs.

21 . A method of making integrated circuit (ICs), comprising:
singulating ICs from a leadframe; forming leads of the singulated ICs; and automatically separating the singulated ICs having formed leads and first dimensions from the singulated ICs having formed leads and other than the first dimensions after the forming without human intervention to perform the separating wherein a transporting means advances the singulated ICs having the first dimensions to a first location in a forming machine and the singulated ICs having other than the first dimensions to a second location in the forming machine.

22 . A method of making integrated circuit (ICs), comprising:
singulating in-production ICs from a leadframe; forming the in-production ICs according to intended dimensions upon which the forming is at least partially based; and automatically separating formed ICs from unformed ICs after the forming without human intervention to perform the separating, wherein the formed ICs fall via gravity through a void in a forming machine and the unformed ICs are prevented from falling through the void in the forming machine.

23 . A method of making integrated circuit (ICs), comprising:
singulating in-production ICs from a leadframe; forming the in-production ICs according to intended dimensions upon which the forming is at least partially based; and automatically separating formed ICs from unformed ICs after the forming without human intervention to perform the separating, wherein the unformed ICs fall via gravity through a void in a forming machine and the formed ICs are prevented from falling through the void in the forming machine.

24 . A method of making an integrated circuit (IC), comprising:
singulating the IC from a l

Assignees

• Texas Instruments Inc

Inventors

• Lugue Jefferson Ochoa
• Binegas Christopher Frederick Abrenica

Classifications

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/014 Primary

  using batch processing · CPC title

• H10W72/0198

  batch processes · CPC title

• B21D43/025

  Fault detection, e.g. misfeed detection · CPC title