Imaging systems with image sensors having multiple radiation detectors

Patent metadata

Field	Value
Publication number	US-12457809-B2
Application number	US-202318239970-A
Country	US
Kind code	B2
Filing date	Aug 30, 2023
Priority date	Mar 24, 2021
Publication date	Oct 28, 2025
Grant date	Oct 28, 2025

Abstract

Disclosed herein is an imaging system, comprising: an image sensor which comprises: a system printed circuit board (system PCB); M group printed circuit boards (group PCBs (i), i=1, . . . , M) mounted on a mounting surface of the system PCB; and Ni radiation detectors mounted on the group PCB (i), for i=1, . . . , M, wherein M and Ni, i=1, . . . , M are integers greater than 1, wherein the image sensor is configured to scan a scene in a scanning direction, and wherein, for each group PCB (i), there is not a plane which (A) is parallel to a normal direction of the mounting surface of the system PCB, (B) is parallel to the scanning direction, (C) divides all active areas of the Ni radiation detectors into 2 groups of active areas, and (D) does not intersect any active area of all the active areas of the Ni radiation detectors.

First claim

What is claimed is:

1. An imaging system, comprising:
an image sensor which comprises:
a system printed circuit board (system PCB);
M group printed circuit boards (group PCBs (i), i=1, . . . , M) mounted on a mounting surface of the system PCB; and
Ni radiation detectors mounted on the group PCB (i), for i=1, . . . , M,

wherein M and Ni are integers greater than 1,
wherein the image sensor is configured to scan a scene in a scanning direction, and
wherein, for each group PCB (i), there is not a plane which (A) is parallel to a normal direction of the mounting surface of the system PCB, (B) is parallel to the scanning direction, (C) divides all active areas of the Ni radiation detectors into 2 groups of active areas, and (D) does not intersect any active area of all the active areas of the Ni radiation detectors.

2. The imaging system of claim 1 , wherein all Ni, i=1, . . . , M are the same.

3. The imaging system of claim 1 , wherein the M group PCBs and the system PCB comprise a semiconductor.

4. The imaging system of claim 1 , wherein each of the M group PCBs has a shape of a rectangle.

5. The imaging system of claim 1 , wherein the M group PCBs are arranged in a row extending in the scanning direction.

6. The imaging system of claim 1 , wherein all active areas of all the Ni radiation detectors, i=1, . . . , M overlap in the normal direction such that all the active areas of all the Ni radiation detectors, i=1, . . . , M form one piece of active area in the normal direction.

7. The imaging system of claim 1 , further comprising a radiation source configured to generate a radiation beam whose boundary does not intersect any active area of all active areas of the Ni radiation detectors, i=1, . . . , M as the image sensor scans the scene.

8. The imaging system of claim 7 , wherein radiation of the radiation beam aims at each and every point of all the active areas of all the Ni radiation detectors, i=1, . . . , M.

9. The imaging system of claim 7 , further comprising a mask which allows some radiation of the radiation source to pass through the mask resulting in the radiation beam.

10. The imaging system of claim 1 , wherein, for each group PCB (i), i=1, . . . , M, no two active areas of the Ni radiation detectors overlap in the normal direction.

11. The imaging system of claim 1 , wherein, for each group PCB (i), i=1, . . . , M, (A) the Ni radiation detectors of the group PCB (i) overlap in the normal direction such that all active areas of the Ni radiation detectors form one piece of active area in the normal direction, and (B) a plane parallel to the normal direction and perpendicular to the scanning direction intersects all active areas of the Ni radiation detectors.

12. The imaging system of claim 1 ,
wherein the M group PCBs overlap in the normal direction such that all the M group PCBs form one piece of printed circuit board in the normal direction, and
wherein a plane parallel to the normal direction and parallel to the scanning direction intersects all the M group PCBs.

13. The imaging system of claim 12 , further comprising an input/output port on each of the M group PCBs.

14. The imaging system of claim 13 , wherein an input/output port on a first group PCB of the M group PCBs is sandwiched between the first group PCB and a second group PCB of the M group PCBs.

15. The imaging system of claim 13 , wherein an input/output port on a first group PCB of the M group PCBs overlaps an active area on a second group PCB of the M group PCBs in the normal direction.

16. The imaging system of claim 1 , wherein for each group PCB (i), i=1, . . . , M, each radiation detector of the Ni radiation detectors on the group PCB (i) comprises (A) a radiation absorption layer and (B) an electronics layer which comprises multiple application specific integrated circuits (ASICs).

17. The imaging system of claim 16 , wherein the radiation absorption layer and the electronics layer are electrically connected to each other by vias.

18. The imaging system of claim 16 , wherein the radiation absorption layer comprises multiple diodes.

19. The imaging system of claim 16 , wherein the radiation absorption layer comprises a semiconductor.

20. The imaging system of claim 16 , wherein the electronics layer comprises an electronic system configured for processing signals generated by radiation incident on the radiation absorption layer.

Assignees

• Shenzhen Xpectvision Tech Co Ltd

Inventors

• Cao Peiyan
• Liu Yurun

Classifications

• G01T1/24

  with semiconductor detectors · CPC title

• H10F39/80

  Constructional details of image sensors · CPC title

• G01T1/243

  Modular detectors, e.g. arrays formed from self contained units (constructional or manufacturing details H10W90/00) · CPC title

• G01T1/20182

  Modular detectors, e.g. tiled scintillators or tiled photodiodes (stacked detectors G01T1/20181) · CPC title

• H04N25/41

  Extracting pixel data from a plurality of image sensors simultaneously picking up an image, e.g. for increasing the field of view by combining the outputs of a plurality of sensors · CPC title