Multilayer circuit board manufacturing apparatus and multilayer circuit board manufacturing method

Patent metadata

Field	Value
Publication number	US-12457694-B2
Application number	US-202217935340-A
Country	US
Kind code	B2
Filing date	Sep 26, 2022
Priority date	Sep 30, 2021
Publication date	Oct 28, 2025
Grant date	Oct 28, 2025

Abstract

Disclosed are a multilayer circuit board manufacturing apparatus and a multilayer circuit board manufacturing method. The present disclosure includes: a plurality of uncoilers configured to supply a plurality of different members; and a compressing machine configured to bond the members, which are supplied from the respective uncoilers, to each other. The compressing machine includes: a belt that rotates in contact with one surface of one of the plurality of members; and a pressing device which is located inside the belt and spaced apart from the belt, and presses the belt toward the member in a non-contact manner.

First claim

What is claimed is:

1. A multilayer circuit board manufacturing apparatus comprising:
a plurality of uncoilers configured to supply a plurality of different members; and
a compressing machine configured to bond the members, which are supplied from the respective uncoilers, to each other,
wherein the compressing machine comprises:
a belt that rotates in contact with one surface of one of the plurality of members; and
a pressing device including a fluid pressing unit configured to supply a fluid pressure on the belt, the fluid pressing unit being disposed inside the belt and spaced apart from the belt, and the fluid pressure presses the belt opposite from and toward the member in a non-contact manner.

2. The multilayer circuit board manufacturing apparatus of claim 1 , wherein the compressing machine further comprises a belt roller which is located inside the belt and rotates the belt.

3. The multilayer circuit board manufacturing apparatus of claim 1 , wherein the pressing device further comprises:
a fluid outlet which is located adjacent to the fluid pressing unit and collects the fluid.

4. The multilayer circuit board manufacturing apparatus of claim 3 , wherein the pressing device comprises a fluid inlet which is connected to the fluid pressing unit and guides the fluid to the fluid pressing unit.

5. The multilayer circuit board manufacturing apparatus of claim 4 , wherein the fluid inlet is provided in plurality, and the plurality of fluid inlets are connected to the fluid pressing unit and spaced a certain distance from each other.

6. The multilayer circuit board manufacturing apparatus of claim 1 , further comprising a recoiler configured to wind a multilayer circuit board in which the plurality of members passing through the compressing machine are laminated.

7. The multilayer circuit board manufacturing apparatus of claim 6 , further comprising a curing device configured to cure the multilayer circuit board that is wound around the recoiler.

8. The multilayer circuit board manufacturing apparatus of claim 7 , wherein the curing device comprises:
an oven in which the multilayer circuit board wound around the recoiler is located;
a support which is located inside the oven and supports the multilayer circuit board; and
a heating section which is located in the oven and provides heat to the multilayer circuit board.

9. The multilayer circuit board manufacturing apparatus of claim 7 , wherein the curing device comprises:
an unwinding roller which the multilayer circuit board wound around the recoiler is disposed on and unwound from;
a heating unit configured to heat the multilayer circuit board that is unwound from the unwinding roller; and
a winding roller configured to wind the multilayer circuit board that has passed through the heating unit.

10. The multilayer circuit board manufacturing apparatus of claim 9 , wherein the heating unit comprises:
a heating chamber configured to provide a space in which the multilayer circuit board moves; and
a heating portion which is located inside the heating chamber and heats the multilayer circuit board.

Assignees

• Haesung Ds Co Ltd

Inventors

• Lee Sang Min

Classifications

• H05K2203/068

  Features of the lamination press or of the lamination process, e.g. using special separator sheets · CPC title

• H05K2203/1105

  Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating · CPC title

• H05K2201/0195

  Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure · CPC title

• H05K2203/1545

  Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path · CPC title

• H05K3/4611 Primary

  by laminating two or more circuit boards (H05K3/4652 takes precedence) · CPC title