Display device capable of effectively dissipating heat of board

Patent metadata

Field	Value
Publication number	US-12455469-B2
Application number	US-202118573922-A
Country	US
Kind code	B2
Filing date	Nov 4, 2021
Priority date	Jun 23, 2021
Publication date	Oct 28, 2025
Grant date	Oct 28, 2025

Abstract

Disclosed is a display device. The display device according to an aspect of the present disclosure may include: a display panel; a frame which is located in a rearward direction of the display panel, and to which the display panel is coupled; a first board including an IC chip and coupled to a rear of the frame; and a shield plate spaced apart from the first board, covering the first board, and coupled to the frame, wherein the shield plate comprises a recessed portion which protrudes toward the first board and which is in contact with the IC chip.

First claim

The invention claimed is:

1. A display device comprising:
a display panel;
a frame which is located in a rearward direction of the display panel, and to which the display panel is coupled;
a first board including an IC chip and coupled to a rear of the frame;
a second board coupled to a rear of the frame;
a back cover covering a rear of the first board and a rear of the second board, and coupled to a rear of the frame; and
a shield plate located between the first board and the back cover, covering the first board, and coupled to the frame,
wherein the shield plate comprises a recessed portion which protrudes toward the first board and which is in contact with the IC chip,
wherein the back cover comprises:
a first heat dissipation plate located between the second board and the back cover and coupled to the back cover;
a second heat dissipation plate located between the second board and the first heat dissipation plate, coupled to the back cover, and having an area larger than an area of the first heat dissipation plate; and
a third heat dissipation plate which is located between the second board and the second heat dissipation plate, which has an area larger than the area of the second heat dissipation plate, and which covers the second heat dissipation plate,
wherein the second heat dissipation plate covers a front of the first heat dissipation plate, and overlaps with the second board,
wherein the third heat dissipation plate overlaps with the second board and is spaced rearward from the second board,
wherein the first heat dissipation plate comprises metal, and
wherein the second heat dissipation plate comprises graphene resin.

2. The display device of claim 1 , further comprising:
a substrate located between the display panel and the frame and including a plurality of light sources to provide light to the display panel; and
a connector connected to the substrate and located between the first board and the substrate through an opening of the frame.

3. The display device of claim 2 , wherein the connector overlaps at least a portion of the IC chip.

4. The display device of claim 3 , further comprising a chip supporter located between the frame and the first board, and supporting the IC chip,
wherein the chip supporter comprises:
a plate located between the frame and the first board; and
a step which forms a rising step from the plate toward the IC chip,
wherein the step contacts a rear surface of the first board on which the IC chip is mounted.

5. The display device of claim 4 , wherein the chip supporter further comprises a hole formed to penetrate the plate,
wherein the hole is located adjacent to the step, and faces a rear surface of the IC chip.

6. The display device of claim 1 , wherein the third heat dissipation plate comprises metal.

7. The display device of claim 6 , wherein the back cover comprises:
a first ventilation hole which is located adjacent to an upper side of the first board, and which is formed long along the upper side of the first board; and
a second ventilation hole which is located adjacent to a lower side of the first board, and which is formed long along the lower side of the first board.

8. The display device of claim 6 , wherein the back cover comprises:
a third ventilation hole which is located adjacent to an upper side of the second board, and which is formed long along the upper side of the second board; and
a fourth ventilation hole which is located adjacent to a lower side of the second board, and which is formed long along the lower side of the second board.

Assignees

• Lg Electronics Inc

Inventors

• Kong Junhee
• CHO Dongwoo
• Yoo Byungchun
• Jeon Sungho

Classifications

• G02F1/133382

  Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell · CPC title

• G02F1/133334

  Electromagnetic shields · CPC title

• G02F1/133612

  Electrical details · CPC title

• G02F1/133605

  including specially adapted reflectors · CPC title

• G06F1/20

  Cooling means · CPC title