Solid state lamp using light emitting strips

Patent metadata

Field	Value
Publication number	US-12455049-B2
Application number	US-202519030127-A
Country	US
Kind code	B2
Filing date	Jan 17, 2025
Priority date	Feb 22, 2011
Publication date	Oct 28, 2025
Grant date	Oct 28, 2025

Abstract

A solid state lamp includes a connector and a bulb portion with multiple strips.

First claim

What is claimed is:

1. A solid-state lamp comprising:
a base configured to electrically connect the solid-state lamp to a power source, the base defining an axis;
an envelope configured to transmit light, the envelope extending along the axis; and
multiple strips inside the envelope, each of the strips extending from a first end to a second end opposite the first end, each of the strips comprising:
a light-transmissive substrate layer of a dielectric material, the substrate layer having a top surface and an opposing bottom surface continuously extending from the first end to the second end;
a plurality of bare light-emitting diode (LED) dies arranged along the top surface of the substrate layer between the first and second ends of the strip;
conductors arranged to provide electrical power to the bare LED dies; and
a wavelength-converting encapsulant encapsulating the bare LED dies; and
a light-diffusing layer arranged over the encapsulant;

multiple connectors mechanically attached to the strips, the connectors providing electrical connections for the strips; and
a driver configured to receive electrical power from the base and control electrical power provided to the bare LED dies; wherein each of the strips is individually distinct and spaced apart from the other strips.

2. The solid-state lamp of claim 1 , wherein the light-diffusing layer has a pattern on an outside surface of the strip that diffuses light.

3. The solid-state lamp of claim 1 , further comprising a support structure extending along the axis, the support structure comprising a wire frame providing electrical power and support to the first and second ends of the strips, the wire frame comprising a first portion attached to the first ends of the strips and a second portion attached to the second ends of the strips.

4. The solid-state lamp of claim 3 , wherein, in each of the strips, the substrate layer comprises a side surface between the top surface and the bottom surface, the side surface including long side surfaces extending from the first end to the second end, and short side surfaces at the first and second ends of the strip, the corresponding connector covering a portion of the long side surfaces of the substrate layer.

5. The solid-state lamp of claim 4 , wherein each of the bare LED dies has a reflector arranged perpendicular to the top surface of the substrate layer.

6. The solid-state lamp of claim 4 , wherein each of the bare LED dies has a reflector arranged parallel to the top surface of the substrate layer.

7. The solid-state lamp of claim 6 , wherein the reflector is arranged to reflect light from within the corresponding bare LED die in directions away from the top surface of the substrate layer.

8. The solid-state lamp of claim 6 , wherein the reflector comprises an electrode of the corresponding bare LED die.

9. The solid-state lamp of claim 4 , wherein each of the bare LED dies are flip-chip LED dies.

10. The solid-state lamp of claim 4 , wherein each of the bare LED dies has a wire bond pad on a face of the corresponding bare LED die facing away from the top surface of the substrate layer.

11. The solid-state lamp of claim 4 , wherein each of the bare LED dies has a pair of electrodes on a face of the corresponding bare LED die facing away from the top surface of the substrate layer.

12. The solid-state lamp of claim 4 , wherein the envelope is selected from multiple different envelopes configured to provide different light output patterns, and the solid-state lamp is configured to couple with the different envelopes to provide corresponding light output patterns.

13. The solid-state lamp of claim 12 , wherein the envelope is a replaceable envelope.

14. The solid-state lamp of claim 4 , wherein the envelope is a bulb-shaped envelope.

15. The solid-state lamp of claim 4 , wherein the encapsulant comprises a mixture of a phosphor and a binder.

16. The solid-state lamp of claim 15 , wherein the binder comprises a silicone.

17. The solid-state lamp of claim 15 , wherein the mixture of a phosphor and a binder is in contact with the bare LED dies.

18. The solid-state lamp of claim 17 , wherein the mixture of a phosphor and a binder is in contact with the top surface of the substrate layer between the bare LED dies.

19. The solid-state lamp of claim 15 , wherein the bare LED dies emit light with a first efficacy when driven at a first drive current density and emit light with a second efficacy when driven at a second drive current density, the second drive current density being higher than the first drive current density but the second efficacy being lower than the first efficacy, and the driver is configured to drive the bare LED dies at the first drive current density, wherein the first efficacy is up to 30% higher than the second efficacy.

20. The solid-state lamp of claim 15 , wherein a density of the phosphor varies within the mixture of the phosphor and the binder.

21. The solid-state lamp of claim 15 , wherein a thickness of the encapsulant varies along the top surface of the substrate layer between the first and second ends of the strip.

22. The solid-state lamp of claim 15 , further comprising a phosphor layer disposed on the bottom surface of the substrate layer.

23. The solid-state lamp of claim 15 , wherein portions of the long side surfaces are free of the encapsulant.

24. The solid-state lamp of claim 4 , wherein the encapsulant on the top surface of the substrate layer provides a first light emission surface through which the strip outputs a first intensity of light during operation, and a side of the strip opposite the first light emission surface provides a second light emission surface through which the strip outputs a second intensity of light during operation, and the first intensity of light is higher than the second intensity of light.

25. The solid state lamp of claim 24 , wherein the first light emission surface is a primary light emission surface and the second light emission surface is a light leakage surface.

26. The solid-state lamp of claim 4 , wherein the top surface faces a first side of the strip and a bottom surface of the substrate layer opposite the top surface faces a second side of the strip, and the strip outputs first light from the first side having a first spectral power distribution (SPD) and outputs second light from the second side having a second SPD different from the first SPD.

27. The solid-state lamp of claim 4 , wherein the substrate layer is a transparent substrate layer.

28. The solid-state lamp of claim 4 , wherein the strips are further supported by the envelope.

29. The solid-state lamp of claim 4 , wherein the envelope is a clear envelope.

30. The solid-state lamp of claim 4 , wherein the envelope comprises perforations.

31. The solid-state lamp of claim 4 , wherein each of the strips is supported by leads.

32. The solid-state lamp of claim 31 , wherein the leads comprise wires.

33. The solid-state lamp of claim 4 , wherein each of the strips is supported by a first lead and a second lead.

34. The solid-state lamp of claim 33 , wherein the first lead is arranged at the first end of the strip and the second lead is arranged at the second end of the strip.

35. The solid-state lamp

Assignees

• Quarkstar Llc

Inventors

• Steele Robert V
• Lerman Louis
• York Allan Brent
• Dau Wilson
• Teng Jacqueline
• Lerman George

Classifications

• H10W90/00

  Package configurations · CPC title

• F21V23/02

  the elements being transformers, impedances {or power supply units, e.g. a transformer with a rectifier} · CPC title

• F21V7/06

  with parabolic curvature · CPC title

• F21V3/02

  characterised by the shape · CPC title

• F21K9/237

  Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases (F21K9/238 takes precedence) · CPC title