Two component (2K) curable adhesive composition

Patent metadata

Field	Value
Publication number	US-12454635-B2
Application number	US-202217838724-A
Country	US
Kind code	B2
Filing date	Jun 13, 2022
Priority date	Dec 13, 2019
Publication date	Oct 28, 2025
Grant date	Oct 28, 2025

Abstract

The present invention is directed to a curable and debondable two-part (2K) hybrid adhesive composition comprising: i) a first part comprising: a) epoxy resin; b) (meth)acrylate monomer; c) an electrolyte; d) a solubilizer; and e) a filler; and, ii) a second part comprising: a) a curing agent consisting of at least one compound possessing at least two epoxide reactive groups per molecule; b) an accelerator; and, c) a filler.

First claim

What is claimed is:

1. A curable and debondable two-part hybrid adhesive composition comprising:
a first part comprising:
a) epoxy resin;
b) (meth)acrylate monomer;
c) an electrolyte;
d) a solubilizer; and
e) a filler in an amount of from 1 to 40% by weight of the total weight of the first part;
f) a co-polymerizable acid; and

a second part comprising:
a) a compound possessing at least two epoxide reactive groups per molecule;
b) an accelerator; and
c) filler in an amount of from 10 to 30% by weight of the total weight of the second part, wherein said filler in the first part and said filler in the second part can be same or different and are independently selected from the group consisting of calcium carbonate, calcium oxide, talcum, fumed silica, wollastonite, barium sulphate and mixtures thereof, and whose presence in either or both of the first part and the second part adjusts the viscosity thereof.

2. A curable and debondable two-part hybrid adhesive composition according to claim 1 , wherein said epoxy resin is selected from the group consisting of bis-phenol A epoxy resin, bis-phenol F epoxy resin, mixture of bis-phenol A epoxy resin and bis-phenol F epoxy resin, cycloaliphatic epoxy resin and mixtures thereof.

3. A curable and debondable two-part hybrid adhesive composition according to claim 1 , wherein said epoxy resin is present in an amount of from 15 to 60% by weight of the total weight of the first part.

4. A curable and debondable two-part hybrid adhesive composition according to claim 1 , wherein said (meth)acrylate monomer is selected from the group consisting of methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl(meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, n-pentyl (meth)acrylate, n-hexyl (meth)acrylate, cyclohexyl (meth)acrylate, n-heptyl (meth)acrylate, n-octyl(meth)acrylate, 2-ethylhexyl-(meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate, dodecyl (meth)acrylate, phenyl (meth)acrylate, tolyl (meth)acrylate, benzyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 3-methoxybutyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl(meth)acrylate, stearyl (meth)acrylate, glycidyl (meth)acrylate, isobornyl (meth)acrylate, 2-aminoethyl (meth)acrylate, y-(meth)acryloyloxypropyl trimethoxysilane, (meth)acrylic acid-ethylene oxide adduct, trifluoromethylmethyl (meth)acrylate, 2-trifluoromethylethyl (meth)acrylate, 2-perfluoro ethylethyl (meth)acrylate, 2-perfluoroethyl-2-perfluorobutylethyl (meth)acrylate, 2-perfluoroethyl (meth)acrylate, perfluoromethyl (meth)acrylate, diperfluoromethylmethyl (meth)acrylate, 2-perfluoromethyl-2-perfluoroethylmethyl (meth)acrylate, 2-perfluorohexylethyl (meth)acrylate, 2-perfluorodecylethyl (meth)acrylate, 2-perfluorohexadecylethyl (meth)acrylate, ethoxylated trimethylolpropane triacrylate, trimethylol propane trimethacrylate, dipentaerythritol monohydroxypentacrylate, pentaerythritol triacrylate, ethoxylated trimethylolpropane triacrylate, 1,6-hexanedioldiacrylate, neopentyl glycoldiacrylate, pentaerythritol tetraacrylate, 1,2-butylene glycoldiacrylate, trimethylopropane ethoxylate tri(meth)acrylate, glyceryl propoxylate tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, dipentaerythritol monohydroxy penta(meth)acrylate, tri propylene glycol di(meth)acrylate, neopentylglycol propoxylate di(meth)acrylate, 1,4-butanediol di(meth)acrylate, polyethyleneglycol di(meth)acrylate, triethyleneglycol di(meth)acrylate, butylene glycol di(meth)acrylate, ethoxylated bisphenol A di(meth)acrylate, and mixtures thereof.

5. A curable and debondable two-part hybrid adhesive composition according to claim 1 , wherein said (meth)acrylate monomer is present in an amount of from 5 to 50% by weight of the total weight of the first part.

6. A curable and debondable two-part hybrid adhesive composition according to claim 1 , wherein said electrolyte is selected from the group consisting of 11-ethyl-3-methylimidazolium methansulfonate, 1-ethyl-3-methylimidazolium methyl sulfate, 1-hexyl-3-methylimidazolium 2-(2-fluoroanilino)-pyridinate, 1-hexyl-3-methylimidazolium imide, 1-butyl-1-methyl-pyrrolidinium 2-(2-fluoroanilino)-pyridinate, 1-butyl-1-methyl-pyrrolidinium imide, trihexyl (tetradecyl) phospholium 2-(2-fluoroanilino)-pyridinate, cyclohexyltrimethylammonium bis (trifluormethylsulfonyl) imide, di(2-hydroxyethyl) ammonium trifluoroaetate, N, N-dimethyl (2-hydroxyethyl) ammonium octanoate, methyltrioctylammonium bis(trifluoromethylsulfonyl) imide, N-ethyl-N—N—N—N-tetramethylguanidinium trifluoromethanesulfonate, guanidinium trifluoromethanesulfonate, 1-butyl-4-methylpyridinium bromide, 1-buthyl-3-methylpyridinium tetrafluoroborate, 1-butyl-3-hydroxymethylpyridinium ethylsulfate, 1-butyl-1-methylpyrrolidinium bis(trifluoromethylsulfonyl) imide, 1-butyl-methylpyrrolidinium tris (pentafluoroethyl) trifluorophosphate, 3-methyl imidazolium ethylsulfate, 1-ethyl-3-methylimidazolium chloride, 1-ethyl-3-ethyl-methylimidazolium bromide, 1-butyl-3-methylimidazolium chloride, 1-hexyl-3-methylimidazolium chloride, 1-octyl-3-methylimidazolium chloride, 1-methyl-3-octylimidazolium chloride, 1-propyl-3-methylimidazolium iodide, 1-butyl-3-methylimidazolium tetrafluoroborate, 1-butyl-3-methylimidazolium trifluoromethanesulfonate, 1-butyl-3-methylimidazolium hexafluorophosphate, 1-butyl-2,3-dimethylimidazolium tetrafluoroborate, 1-butyl-2,3-dimethylimidazolium hexafluorophosphate, 1-butylimidazol, 1-methylimidazolium tetrafluoroborate, tetrabutylphosphonium tris (pentafluoroethyl) trifluorophosphate, trihexyl (tetradecyl) phosphonium tetrafluoroborate and mixtures thereof.

7. A curable and debondable two-part hybrid adhesive composition according to claim 1 , wherein said electrolyte is present in an amount of from 2.5 to 25% by weight of the total weight of the composition.

8. A curable and debondable two-part hybrid adhesive composition according to claim 1 , wherein said solubilizer is selected from: polyphosphazenes; polymethylenesulfides; polyoxyalkylene glycols; polyethylene imines; silicone surfactants and fluorinated silicone surfactants; co-polymers of functionalized polyalkysiloxanes and epoxy resins; polyhydric alcohols; and, sugars.

9. A curable and debondable two-part hybrid adhesive composition according to claim 1 , wherein said solubilizer is present in an amount of from 0.5 to 20% by weight of the total weight of the first part.

10. A curable and debondable two-part hybrid adhesive composition according to claim 1 , wherein said first part further comprises a toughener.

11. A curable and debondable two-part hybrid adhesive composition according to claim 1 , wherein said curing agent comprises at least one polyamine having at least two amine hydrogens reactive toward epoxide groups, said polyamine being further characterized by containing primary and/or secondary amine groups and having an equivalent weight per primary or secondary amine group of not more than 150 g/eq.

12. A curable and debondable two-part hybrid adhesive composition according to claim 1 , wherein said accelerator is selected from the group consisting of tertiary amines, quaternary ammonium salts, amidines, guanidines and mixtures thereof.

13. A curable and debondable two-part hybrid adhesive composition according to claim 1 , wherein said accelerator is present in an amount of from 0.1 to 15% by weight of the total weight of the second part.

14. A bonded structure comprising
a first material layer having an electrically conductive surface;
a second material layer having an electrically conductive surface;
wherein a cured debondable two-part hybrid adhesi

Assignees

• Henkel Ag & Co Kgaa

Inventors

• Stapf Stefanie
• Moeller Thomas
• Lieske Alexandra
• Gutierrez Diaz Jordan
• Grevey Chloe

Classifications

• C09J133/10

  Homopolymers or copolymers of methacrylic acid esters · CPC title

• C09J2301/502

  process for debonding adherents · CPC title

• C09J2301/408

  additives as essential feature of the adhesive layer · CPC title

• B32B2037/1215

  Hot-melt adhesive · CPC title

• C08K3/013

  Fillers, pigments or reinforcing additives · CPC title