Composition for encapsulation

Patent metadata

Field	Value
Publication number	US-12454620-B2
Application number	US-202017611397-A
Country	US
Kind code	B2
Filing date	Jun 5, 2020
Priority date	Jun 5, 2019
Publication date	Oct 28, 2025
Grant date	Oct 28, 2025

Abstract

The present disclosure relates to a composition for encapsulating an organic electronic element and an organic electronic device comprising the same, and provides an encapsulation composition which can form an encapsulation structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifespan of the organic electronic device and implementing endurance reliability of the encapsulation structure at high temperature and high humidity, and has high shape retainability, and an organic electronic device comprising the same.

First claim

The invention claimed is:

1. An encapsulation composition comprising:
a non-reactive olefin-based compound; and
a reactive olefin-based compound included in a range of 10 to 150 parts by weight relative to 100 parts by weight of the non-reactive olefin-based compound,
wherein the reactive olefin-based compound has an active energy ray-curable functional group, and
wherein the active energy ray-curable functional group includes a vinyl group, an acryloyl group or a methacryloyl group.

2. The encapsulation composition according to claim 1 , wherein the non-reactive olefin-based compound has a weight average molecular weight in a range of 500 g/mol to 100,000 g/mol.

3. The encapsulation composition according to claim 1 , wherein the non-reactive olefin-based compound is included in a range of 40 to 90 wt % in the encapsulation composition.

4. The encapsulation composition according to claim 1 , wherein the reactive olefin-based compound has a weight average molecular weight in a range of 1,000 g/mol to 50,000 g/mol.

5. The encapsulation composition according to claim 1 , wherein the reactive olefin-based compound has one or more reactive functional groups at the end of the reactive olefin-based compound.

6. The encapsulation composition according to claim 1 , wherein the active energy ray-curable functional group is a radical-curable functional group.

7. The encapsulation composition according to claim 1 , wherein the non-reactive olefin-based compound or the reactive olefin-based compound comprises an isobutylene monomer as a polymerization unit.

8. The encapsulation composition according to claim 1 , wherein the reactive olefin-based compound is included in a range of 50 wt % or less in the encapsulation composition.

9. The encapsulation composition according to claim 1 , wherein the reactive olefin-based compound is included in a range of 25 to 90 parts by weight relative to 100 parts by weight of the non-reactive olefin-based compound.

10. The encapsulation composition according to claim 1 , further comprising a curable monomer.

11. The encapsulation composition according to claim 10 , wherein the curable monomer has a weight average molecular weight of 50 g/mol or more and less than 1,000 g/mol.

12. The encapsulation composition according to claim 10 , wherein the curable monomer comprises an epoxy compound, an oxetane compound or an acrylate monomer.

13. The encapsulation composition according to claim 10 , wherein the curable monomer is included in an amount of 10 to 60 parts by weight relative to 100 parts by weight of the non-reactive olefin-based compound.

14. The encapsulation composition according to claim 1 , further comprising an inorganic filler.

15. The encapsulation composition according to claim 14 , wherein the inorganic filler is included in an amount of 0.1 parts by weight to 300 parts by weight relative to 100 parts by weight of the non-reactive olefin-based compound.

16. The encapsulation composition according to claim 1 , further comprising a cationic initiator or a radical initiator.

17. The encapsulation composition according to claim 1 , further comprising a moisture adsorbent.

18. An organic electronic device comprising:
a substrate;
an organic electronic element formed on the substrate; and
a side encapsulation layer formed on the periphery of the substrate so as to surround the side surfaces of the organic electronic element and containing the encapsulation composition according to claim 1 .

19. A method for manufacturing an organic electronic device, comprising steps of:
applying the encapsulation composition of claim 1 on the periphery of a substrate, on which an organic electronic element is formed, so as to surround the side surfaces of the organic electronic element, and
curing the encapsulation composition.

Assignees

• Lg Chemical Ltd

Inventors

• Kim So Young
• Lee Seung Min
• Han Eun Gu
• Yang Se Woo

Classifications

• H10K50/8426

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• C09D123/22

  Copolymers of isobutene; Butyl rubber {; Homo- or copolymers of other iso-olefines} · CPC title

• C08L23/22

  Copolymers of isobutene; Butyl rubber; Homopolymers or copolymers of other iso-olefins · CPC title

• C08J7/0427

  with only one layer of a composition containing a polymer binder (with more layers C08J7/042) · CPC title

• H10K85/151

  Copolymers · CPC title