Prepolymer, resin composition comprising the same and article made therefrom

Patent metadata

Field	Value
Publication number	US-12454611-B2
Application number	US-202318193854-A
Country	US
Kind code	B2
Filing date	Mar 31, 2023
Priority date	Mar 1, 2023
Publication date	Oct 28, 2025
Grant date	Oct 28, 2025

Abstract

A prepolymer and a resin composition containing the prepolymer are provided. The prepolymer is obtained from a prepolymerization reaction of a mixture, the mixture at least including dicyclopentadiene-ethylidenenorbornene copolymer and acenaphthylene in a weight ratio of between 1:1 and 5:1. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dielectric constant, dissipation factor, copper foil peeling strength, X-axis coefficient of thermal expansion and glass transition temperature.

First claim

What is claimed is:

1. A prepolymer obtained from a prepolymerization reaction of a mixture, the mixture at least comprising dicyclopentadiene-ethylidenenorbornene copolymer and acenaphthylene in a weight ratio of between 1:1 and 5:1.

2. The prepolymer of claim 1 , wherein the prepolymerization reaction is performed in the presence of a reaction initiator at 80° C. to 90° C. for 4 to 6 hours, and the prepolymerization reaction has a conversion rate of between 10% and 90%.

3. A resin composition comprising the prepolymer of claim 1 .

4. The resin composition of claim 3 , comprising 120 parts by weight of the prepolymer and 10 to 30 parts by weight of a vinyl group-containing polyphenylene ether resin.

5. The resin composition of claim 3 , further comprising inorganic filler, curing accelerator, flame retardant, polymerization inhibitor, solvent, silane coupling agent, coloring agent, toughening agent or a combination thereof.

6. An article made from the resin composition of claim 3 , comprising a prepreg, a resin film, a laminate or a printed circuit board.

7. The article of claim 6 , having a copper foil peeling strength as measured by reference to IPC-TM-650 2.4.8 of greater than or equal to 2.2 lb/in.

8. The article of claim 6 , having an X-axis coefficient of thermal expansion as measured by reference to IPC-TM-650 2.4.24.5 of less than or equal to 7.98 ppm/° C.

Assignees

• Elite Material Co Ltd

Inventors

• Yu Yi-Fei
• Lee Ching-Huan
• Hsieh Chen-Yu

Classifications

• C08L45/00

  Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers (of cyclic anhydrides or imides C08L35/00; of cyclic esters of polyfunctional acids C08L31/00) · CPC title

• C08F236/20

  unconjugated · CPC title

• C08F279/00

  Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 · CPC title

• C08F232/08

  having condensed rings (coumarone-indene polymers C08F244/00) · CPC title

• C08J5/244 Primary

  using glass fibres · CPC title