Integrated photodetector waveguide structure with alignment tolerance
US-2015364619-A1 · Dec 17, 2015 · US
US12453206B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12453206-B2 |
| Application number | US-202318196760-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 12, 2023 |
| Priority date | Jul 14, 2021 |
| Publication date | Oct 21, 2025 |
| Grant date | Oct 21, 2025 |
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Disclosed is a method of manufacturing a III-V group nanorod solar cell so that a substrate can be reused. The method may includes a first growth process of forming an etch stop layer on a substrate, a second growth process of growing a sacrificial layer on the etch stop layer, a third growth process of forming, on the sacrificial layer, a pattern layer including an opening at each location at which each nanorod solar cell is able to be grown, a fourth growth process of growing the nanorod solar cells on the sacrificial layer through the openings within the pattern layer, a forming process of forming a solar cell protection layer on outsides of the nanorod solar cells, a first etching process of etching the sacrificial layer and the pattern layer, and a second etching process of etching the etch stop layer.
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What is claimed is: 1. A method of manufacturing a plurality of nanorod solar cells so that a substrate is able to be reused, the method comprising: a first growth process of forming an etch stop layer on a substrate; a second growth process of growing a sacrificial layer on the etch stop layer; a third growth process of forming, on the sacrificial layer, a pattern layer comprising an opening at each location at which each nanorod solar cell is able to be grown; a fourth growth process of growing the nanorod solar cells on the sacrificial layer through the openings within the pattern layer; a forming process of forming a solar cell protection layer on outsides of the nanorod solar cells; a first etching process of etching the sacrificial layer and the pattern layer; and a second etching process of etching the etch stop layer. 2. The method of claim 1 , wherein the nanorod solar cell is implemented as gallium arsenide (GaAs). 3. The method of claim 2 , wherein the substrate is implemented as a component identical with the component of the nanorod solar cell. 4. The method of claim 1 , wherein the solar cell protection layer is implemented as a component that is transparent and that has a non-conductive characteristic. 5. A method of manufacturing a plurality of nanorod solar cells so that a substrate is able to be reused, the method comprising: a first growth process of forming an etch stop layer on a substrate; a second growth process of growing a sacrificial layer on the etch stop layer; a third growth process of forming, on the sacrificial layer, a pattern layer comprising an opening at each location at which each nanorod solar cell is able to be grown; a fourth growth process of growing the nanorod solar cells on the sacrificial layer through the openings within the pattern layer; a first etching process of etching the sacrificial layer and the pattern layer; a forming process of forming a solar cell protection layer on outsides of the nanorod solar cells after the nanorod solar cells on which the first etching process has been performed are disposed to have a preset interval; and a second etching process of etching the etch stop layer. 6. The method of claim 5 , wherein the solar cell protection layer is a silicon compound. 7. The method of claim 5 , wherein in the first etching process, the sacrificial layer and the pattern layer are etched by an HF mixture. 8. A method of manufacturing a plurality of nanorod solar cells so that a substrate is able to be reused, the method comprising: a first growth process of sequentially growing, on a substrate, a first layer implemented as a component having a lattice constant identical with a lattice constant of a nanorod solar cell to be manufactured, a second layer implemented as a component identical with a component of the substrate, and a third layer implemented as the same component as the first layer; a second growth process of growing, on the third layer, a pattern layer comprising an opening at each location at which each nanorod solar cell is able to be grown; a third growth process of growing the nanorod solar cells on the third layer through the openings within the pattern layer; a forming process of forming a solar cell protection layer on outsides of the nanorod solar cells; a first etching process of etching the third layer and the pattern layer; and a second etching process of etching the first layer and the second layer. 9. The method of claim 8 , wherein the nanorod solar cell and the substrate are implemented as indium phosphide (InP). 10. The method of claim 8 , wherein the first layer is implemented as indium gallium arsenide (InGaAs). 11. The method of claim 8 , wherein the solar cell protection layer is implemented as a component that is transparent and that has a non-conductive characteristic. 12. The method of claim 8 , wherein the forming process is performed after the nanorod solar cells on which the first etching process has been performed are disposed to have a preset interval.
Solar cells from Group III-V materials · CPC title
comprising only Group III-V materials, e.g. GaAs · CPC title
for photovoltaic cells · CPC title
for thin-film devices · CPC title
The active layers comprising only Group III-V materials, e.g. GaAs or InP · CPC title
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