Foldable electronic device comprising heat-dissipating structure

Patent metadata

Field	Value
Publication number	US-12453056-B2
Application number	US-202118039656-A
Country	US
Kind code	B2
Filing date	Apr 13, 2021
Priority date	May 18, 2020
Publication date	Oct 21, 2025
Grant date	Oct 21, 2025

Abstract

A heat dissipating structure of a foldable electronic device is provided. The electronic device includes a first housing including a first component, a second housing including a second component, a hinge assembly rotatably coupling the first and second housings, a hinge housing accommodating the hinge assembly and disposed between the first and second housings, a flexible display disposed from one region of the first housing to a region of the second housing across the hinge assembly, and foldable depending on a rotation of the hinge assembly, a first plate disposed between the flexible display and the first housing, a second plate disposed between the flexible display and the second housing, and a first heat dissipating structure disposed between the first component and thermally coupled to one end of the hinge housing, and providing a first heat transfer path for transferring heat generated from the first component to the hinge housing.

First claim

The invention claimed is:

1 . A foldable electronic device comprising:
a housing including a first housing portion, a second housing portion, and a hinge housing portion at least partially disposed between the first housing portion and the second housing portion; a hinge module accommodated in the housing and coupled with the first housing portion and the second housing portion; a flexible display accommodated in the first housing portion and the second housing portion; a first PCB accommodated in the first housing portion; a second PCB accommodated in the second housing portion; a flexible printed circuit board (FPCB) at least partially disposed between the hinge housing portion and the flexible display, and electrically connected between the first PCB and the second PCB; and a heat transfer sheet including a first portion attached with the FPCB and a second portion configured to receive heat from a first component at the first PCB, and at least partially disposed between the hinge housing portion and the flexible display, wherein heat from the first component at the first PCB is at least partially transferred to the second housing portion via the heat transfer sheet.

2 . The foldable electronic device of claim 1 , wherein the first portion is laminated with at least a portion of the flexible printed circuit board.

3 . The foldable electronic device of claim 1 , wherein the heat transfer sheet comprises a copper material.

4 . The foldable electronic device of claim 1 , wherein the heat transfer sheet comprises a graphite sheet.

5 . The foldable electronic device of claim 1 , wherein the heat transfer sheet is thermally coupled with the first PCB.

6 . The foldable electronic device of claim 1 , wherein the first portion is substantially formed to have a same width as the flexible printed circuit board.

7 . The foldable electronic device of claim 1 , wherein the first portion is disposed on a folding portion of the flexible printed circuit board.

8 . The foldable electronic device of claim 1 , wherein the first portion is via the hinge housing portion.

9 . The foldable electronic device of claim 1 , wherein the second portion is thermally coupled to a first heat transfer member accommodated in the first housing portion.

10 . The foldable electronic device of claim 9 , wherein the second portion is thermally coupled to the first heat transfer member by a first thermal interfacing material (TIM).

11 . The foldable electronic device of claim 10 , wherein the heat transfer sheet includes a third portion thermally coupled to a portion of the second housing portion via the first portion.

12 . The foldable electronic device of claim 11 , wherein the third portion is thermally coupled to the second heat transfer member accommodated in the second housing portion.

13 . The foldable electronic device of claim 12 , wherein the third portion is thermally coupled to the second heat transfer member by a second TIM.

14 . The foldable electronic device of claim 1 , wherein the heat transfer sheet is formed of either a single material or a heterogeneous material.

15 . The foldable electronic device of claim 14 , wherein the heat transfer sheet is formed of multiple layers.

16 . The foldable electronic device of claim 15 , wherein the heat transfer sheet comprises;
a copper material layer formed on one surface; and at least one graphite layer formed on the other surface opposite to the one surface.

17 . The foldable electronic device of claim 16 , wherein the copper material layer has at least one first gap formed at a folding portion of the heat transfer sheet.

18 . The foldable electronic device of claim 17 , wherein the at least one graphite layer has at least one second gap formed at a folded portion of the heat transfer sheet.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Huh Jaeyoung
• Lim Jonghoon
• Kwon Ohhyuck
• Hwang Ahreum
• Park Sungchul

Classifications

• G06F2200/203

  Heat conductive hinge · CPC title

• G06F1/203 Primary

  for portable computers, e.g. for laptops · CPC title

• G06F1/1681

  Details related solely to hinges (hinge details related to the transmission of signals or power are classified in G06F1/1683) · CPC title

• G06F1/1652 Primary

  the display being flexible, e.g. mimicking a sheet of paper, or rollable · CPC title

• G06F2200/202

  Air convective hinge · CPC title