Hypersonic leading-edge heat pipe with porous wick, and methods of making and using the same
US-11535360-B1 · Dec 27, 2022 · US
Loop heat pipe, cooling system, electronic equipment, and wick
US12453049B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12453049-B2 |
| Application number | US-202217685409-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 3, 2022 |
| Priority date | Mar 12, 2021 |
| Publication date | Oct 21, 2025 |
| Grant date | Oct 21, 2025 |
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- Title
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Abstract
Official abstract text for this publication.
Disclosed is a loop heat pipe having an evaporator, a condenser, a vapor line connected between the evaporator and the condenser through which a vapor-phase working fluid flows, a liquid line connected between the condenser and the evaporator through which a liquid-phase working fluid flows, and a wick having an elasticity and provided inside the evaporator in a compressed and deformed state. The liquid-phase working fluid permeates into the wick, and a boundary between the liquid phase working fluid and the vapor phase working fluid is formed in the wick. A stress generated in the wick due to compressive deformation is greater than a pressure loss that occurs during circulation of the working fluid from the vapor-phase side of the boundary via the condenser back to the liquid-phase side of the boundary.
First claim
Opening claim text (preview).
What is claimed is: 1. A loop heat pipe comprising: an evaporator that changes a phase of a working fluid from a liquid phase to a vapor phase; a condenser that changes the phase of the working fluid from the vapor phase to the liquid phase; a vapor line connected between the evaporator and the condenser, through which the vapor-phase working fluid flows; a liquid line connected between the condenser and the evaporator, through which the liquid-phase working fluid flows; and…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Physics · mapped topic
Physics · mapped topic
- H05K7/20336Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US12453049B2 cover?
- Disclosed is a loop heat pipe having an evaporator, a condenser, a vapor line connected between the evaporator and the condenser through which a vapor-phase working fluid flows, a liquid line connected between the condenser and the evaporator through which a liquid-phase working fluid flows, and a wick having an elasticity and provided inside the evaporator in a compressed and deformed state. T…
- Who is the assignee on this patent?
- Endoh Takeshi, Hirasawa Tomoyasu, Ricoh Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H05K7/20336. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 21 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).