Heatsink and communication device having the heatsink

Patent metadata

Field	Value
Publication number	US-12453039-B2
Application number	US-202118254252-A
Country	US
Kind code	B2
Filing date	Jan 4, 2021
Priority date	Jan 4, 2021
Publication date	Oct 21, 2025
Grant date	Oct 21, 2025

Abstract

A heatsink and a communication device having the heatsink are disclosed. The heatsink comprises a heatsink base and a plurality of heatsink fins. Each heatsink fin includes a fin bottom joined to the heatsink base and a fin top opposite to the fin bottom. A plurality of flow channels are formed in at least one of the heatsink fins to extend obliquely from the fin bottom towards the fin top. The plurality of flow channels merge into a public channel formed at the fin top.

First claim

What is claimed is:

1. A heatsink comprising a heatsink base and a plurality of heatsink fins, each heatsink fin including a fin bottom joined to the heatsink base and a fin top opposite to the fin bottom, wherein a plurality of flow channels are formed in at least one of the heatsink fins to extend obliquely from the fin bottom towards the fin top, and the plurality of flow channels merge into a public channel formed at the fin top.

2. The heatsink according to claim 1 , wherein the plurality of flow channels and the public channel are formed at a lower part of the at least one heatsink fin and are filled with refrigerant.

3. The heatsink according to claim 1 , wherein the public channel is communicated with an upper space of the at least one heatsink fin which is not filled with refrigerant.

4. The heatsink according to claim 1 , wherein the at least one heatsink fin is made from two halves which are soldered together, each half being formed from sheet metal.

5. The heatsink according to claim 1 , wherein the heatsink base has an internal space, a lower portion of which comprises multiple substantially closed zones, each zone being communicated with one or more of the plurality of flow channels in the at least one heatsink fin.

6. The heatsink according to claim 5 , wherein through holes for pressure balance are formed in a separator between each adjacent pair of substantially closed zones.

7. The heatsink according to claim 5 , wherein the substantially closed zones of the heatsink base are filled with refrigerant, and an upper portion of the internal space of the heatsink base is not filled with refrigerant.

8. The heatsink according to claim 1 , wherein the heatsink base has an internal space, a lower portion of the internal space is filled with refrigerant and is divided into substantially closed zones, and an upper portion of the internal space is not filled with refrigerant.

9. The heatsink according to claim 8 , wherein through holes for pressure balance are formed in a separator between each adjacent pair of substantially closed zones.

10. A communication device, comprising a plurality of heat sources and the heatsink according to claim 1 , wherein the heat sources contact the heatsink base at a side opposite to the heatsink fins.

11. The communication device according to claim 10 , wherein the heatsink is vertically mounted.

12. The communication device according to claim 10 , wherein distribution of the substantially closed zones of the heatsink base corresponds to distribution of the heat sources.

Assignees

• Ericsson Telefon Ab L M

Inventors

• Wang Haijiang
• Li Shuaijun

Classifications

• H05K7/20336

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• H05K7/20163 Primary

  the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels · CPC title

• H05K7/20245 Primary

  by natural convection; Thermosiphons · CPC title