Flexible connecting member and electronic device including same

Patent metadata

Field	Value
Publication number	US-12453000-B2
Application number	US-202217879303-A
Country	US
Kind code	B2
Filing date	Aug 2, 2022
Priority date	Aug 5, 2021
Publication date	Oct 21, 2025
Grant date	Oct 21, 2025

Abstract

An electronic device is provided. The electronic device includes a housing, and a flexible connecting member disposed inside the housing, the flexible connecting member including a dielectric substrate, at least one signal wire disposed on one surface of the dielectric substrate, and at least one ground disposed on the other surface of the dielectric substrate adjacent to the signal wire. The at least one signal wire and the at least one ground is disposed to be spaced apart from each other when viewed from above the dielectric substrate. A flexible connecting member includes a dielectric substrate, a signal wire disposed on one surface of the dielectric substrate, and a ground disposed on the other surface of the dielectric substrate adjacent to the signal wire. The signal wire and the ground are disposed to be spaced apart from each other when viewed from above the dielectric substrate.

First claim

The invention claimed is:

1. An electronic device comprising:
a housing; and
a flexible connecting member disposed inside the housing, the flexible connecting member comprising:
a dielectric substrate,
at least one signal wire disposed on one surface of the dielectric substrate, and
at least one ground disposed on another surface of the dielectric substrate adjacent to the at least one signal wire,

wherein the at least one ground and the at least one signal wire are arranged in parallel, and
wherein the at least one signal wire and the at least one ground are disposed to be spaced apart from each other when viewed from above the dielectric substrate.

2. The electronic device of claim 1 , wherein the flexible connecting member further includes a coverlay disposed to cover the at least one signal wire, the at least one ground, and the dielectric substrate.

3. The electronic device of claim 1 , wherein a horizontal distance between the at least one ground adjacent to the at least one signal wire and the at least one signal wire is less than or equal to 60 μm.

4. The electronic device of claim 1 , wherein the at least one signal wire has a width of less than or equal to 200 μm.

5. The electronic device of claim 1 ,
wherein the flexible connecting member comprises at least two grounds disposed on the other surface of the dielectric substrate, and
wherein the at least one signal wire is disposed between the at least two grounds when viewed from above the dielectric substrate.

6. The electronic device of claim 5 ,
wherein the flexible connecting member further comprises at least one bridge disposed between the at least two grounds, and
wherein the bridge is configured to connect the at least two grounds.

7. The electronic device of claim 6 ,
wherein the flexible connecting member comprises at least two bridges, and
wherein a spacing between the at least two bridges is less than or equal to ½ of a predetermined frequency wavelength.

8. The electronic device of claim 1 , wherein the dielectric substrate has a thickness of 10 μm to 20 μm.

9. The electronic device of claim 1 , wherein the flexible connecting member has an impedance of less than or equal to 50Ω.

10. The electronic device of claim 1 , further comprising:
a first non-conductive member disposed on an outer surface of a coverlay.

11. A flexible connecting member comprising:
a dielectric substrate;
at least one signal wire disposed on one surface of the dielectric substrate; and
at least one ground disposed on another surface of the dielectric substrate adjacent to the at least one signal wire,
wherein the at least one ground and the at least one signal wire are arranged in parallel, and
wherein the at least one signal wire and the at least one ground are disposed to be spaced apart from each other when viewed from above the dielectric substrate.

12. The flexible connecting member of claim 11 , further comprising:
a coverlay disposed to cover the at least one signal wire, the at least one ground, and the dielectric substrate.

13. The flexible connecting member of claim 11 , wherein a horizontal distance between the at least one ground adjacent to the at least one signal wire and the at least one signal wire is less than or equal to 60 μm.

14. The flexible connecting member of claim 11 , wherein the at least one signal wire has a width of less than or equal to 200 μm.

15. The flexible connecting member of claim 11 , further comprising:
at least two grounds disposed on the other surface of the dielectric substrate,
wherein the at least one signal wire is disposed between the at least two grounds when viewed from above the dielectric substrate.

16. The flexible connecting member of claim 15 , further comprising:
at least one bridge disposed between the at least two grounds,
wherein the bridge is configured to connect the at least two grounds to each other.

17. The flexible connecting member of claim 16 , further comprising:
at least two bridges,
wherein a spacing between the at least two bridges is less than or equal to ½ of a predetermined frequency wavelength.

18. The flexible connecting member of claim 17 , wherein the at least two bridges are disposed at central portions of the at least two grounds in a longitudinal direction of the at least two grounds.

19. The flexible connecting member of claim 18 , wherein the at least two bridges are disposed at one of an upper portion or a lower portion of the at least two grounds in a longitudinal direction of the at least two grounds.

20. The flexible connecting member of claim 19 , wherein, when the at least two bridges comprise four bridges, the four bridges are disposed between five grounds, and left two bridges of the four bridges are disposed at upper ends of the at least two grounds and right two bridges of the four bridges are disposed at the lower ends of the at least two grounds.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Park Sungwon
• Kim Sunyoung
• Seong Younghun
• Shin Yongjin

Classifications

• H01B7/08

  Flat or ribbon cables · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H05K1/0253

  Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings (H05K1/0251 takes precedence) · CPC title

• G06F1/1683

  for the transmission of signal or power between the different housings, e.g. details of wired or wireless communication, passage of cabling · CPC title

• H05K3/28

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title