Solid state relay module heating system and methods

Patent metadata

Field	Value
Publication number	US-12451310-B2
Application number	US-202217706427-A
Country	US
Kind code	B2
Filing date	Mar 28, 2022
Priority date	Mar 26, 2021
Publication date	Oct 21, 2025
Grant date	Oct 21, 2025

Abstract

A solid state relay module configured to be coupled to an electronics enclosure. The solid state relay module includes a body with a first side and an opposite second side and two cable channels extending from the first side of the body. Each of the two cable channels is sized to receive a heating cable. The solid state module also includes a solid state relay platform defined between the two cable channels, where the solid state relay platform is sized to receive a solid state relay. The solid state relay module further includes a heat sink extending from the second side of the body.

First claim

The invention claimed is:

1. A solid state relay module configured to be coupled to an electronics enclosure and to receive a solid state relay, the solid state relay module comprising:
a base including a first side and an opposite second side, the base to be coupled to the electronics enclosure;
two cable channels extending from the first side of the base, each of the two cable channels sized to receive a heating cable;
a solid state relay platform defined on the base between the two cable channels, the solid state relay platform sized to receive a solid state relay; and
a heat sink extending from the second side of the base.

2. The solid state relay module of claim 1 , further comprising a cover coupled to the base around the heat sink.

3. The solid state relay module of claim 2 , wherein the cover includes a vented opening.

4. The solid state relay module of claim 2 , wherein the cover is coupled to the base via fasteners and insulated spacers.

5. The solid state relay module of claim 2 , wherein the cover includes a front and two ends extending perpendicular from the front.

6. The solid state relay module of claim 5 , wherein the cover includes an open top and an open bottom.

7. The solid state relay module of claim 1 , wherein the heat sink comprises a plurality of fins extending from the second side of the base.

8. The solid state relay module of claim 1 , wherein a single heating cable is routed through both of the two cable channels.

9. The solid state relay module of claim 1 , wherein the base is to be coupled to a wall of the electronics enclosure so that the two cable channels extend into the electronics enclosure and the heat sink extends out of the electronics enclosure.

10. The solid state relay module of claim 9 , further comprising a gasket to be positioned between the base and the wall.

11. The solid state relay module of claim 1 , wherein the heating cable is configured to heat the solid state relay to a baseline operating temperature.

12. A solid state relay module configured to be coupled to an electronics enclosure and to receive a solid state relay, the solid state relay module comprising:
a base including a first side and an opposite second side, the base to be coupled to the electronics enclosure;
a cable channel extending from the first side of the base, the cable channel sized to receive a heating cable;
a solid state relay platform positioned on the base adjacent to the cable channel, the solid state relay platform sized to receive a solid state relay; and
a heat sink extending from the second side of the base.

13. The solid state relay module of claim 12 , wherein the base is to be coupled to a wall of the electronics enclosure so that the cable channel extends into the electronics enclosure and the heat sink extends out of the electronics enclosure.

14. The solid state relay module of claim 13 , further comprising a gasket to be positioned between the base and the wall.

15. The solid state relay module of claim 12 , wherein the solid state relay platform and the heat sink are formed integrally as a single base.

16. A system comprising:
an electronics enclosure;
a solid state relay module coupled to the electronics enclosure, the solid state relay module including:
a solid state relay and a heating cable positioned within the electronics enclosure, and
a heat sink positioned outside the electronics enclosure; and

a control system configured to:
receive a first signal representing a temperature within the electronics enclosure,
operate the solid state relay when the temperature within the electronics enclosure is at or above a first temperature, and
operate the heating cable when the temperature within the electronics enclosure is below a second temperature.

17. The system of claim 16 , wherein the control system includes a controller and a mechanical thermostat, wherein the solid state relay is coupled to a power source via the mechanical thermostat.

18. The system of claim 17 , wherein the mechanical thermostat connects power from the power source to the solid state relay when the first temperature is reached.

19. The system of claim 16 , wherein the control system is located within the electronics enclosure.

20. The system of claim 16 , wherein the first temperature and the second temperature are equal.

Assignees

• Nvent Services Gmbh
• Chemelex Europe Gmbh

Inventors

• Cichocki Arkadiusz
• Koziol Artur
• Tuchorski Wojciech

Classifications

• H01H50/02

  Bases; Casings; Covers (frames for mounting two or more relays or for mounting a relay and another electric component H02B1/01, H04Q1/08, H05K) · CPC title

• H05K7/207

  Thermal management, e.g. cabinet temperature control · CPC title

• H05K7/20545

  Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards · CPC title

• H01H50/12 Primary

  Ventilating; Cooling; Heating (for operating electrothermal relays H01H61/013) · CPC title

• H05B1/023 Primary

  Industrial applications · CPC title