Curative free joint sealant

US12448537B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12448537-B2
Application numberUS-202117455489-A
CountryUS
Kind codeB2
Filing dateNov 18, 2021
Priority dateMay 31, 2019
Publication dateOct 21, 2025
Grant dateOct 21, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A curative free sealant composition for sealing joints between male and female parts, the sealant composition comprising a solid resin component, a solid (meth)acrylate polyurethane component, and an ethoxylated bisphenol-A (meth)acrylate component.

First claim

Opening claim text (preview).

The invention claimed is: 1. A curative free sealant composition for sealing joints between male and female parts, the sealant composition comprising: (a) a solid resin component, (b) a solid (meth)acrylate polyurethane component, and an ethoxylated bisphenol-A (meth)acrylate component, wherein the solid (meth)acrylate polyurethane component is one or more of 2. The composition of claim 1 wherein the composition consists of: (c) a solid resin component, (d) a solid (meth)acrylate polyurethane component, and an ethoxylated bisphenol-A (meth)acrylate component, wherein the solid (meth)acrylate polyurethane component is one or more of 3. The composition of claim 1 wherein the composition is free of cure inducing components. 4. The composition of claim 1 wherein the composition is free from cure accelerators. 5. The composition according to claim 1 wherein the solid resin component has a molecular weight of about 2,000 g/mol or higher. 6. The composition according to claim 1 wherein the solid resin component has a melting temperature range from about 55° C. to about 80° C. and a re-solidification temperature range of from 25° C. to 55° C. as measured by differential scanning calorimetry according to ISO 11357-1:2016. 7. The composition according to claim 1 wherein the composition has a melting point of from about 15° C. to about 100° C. 8. The composition according to claim 1 wherein the solid (meth)acrylate polyurethane component has a melting point in the range of from about 30° C. to about 100° C. and a molecular weight of about 1,000 g/mol or lower. 9. The composition according to claim 1 wherein the composition has a re-solidification point in the range from about 10° C. to about 50° C. 10. The composition according to claim 1 wherein the solid resin component is present in an amount of from about 10% to about 60% by weight based on the total weight of the composition, based on the total weight of the composition. 11. The composition according to claim 1 wherein the solid (meth)acrylate polyurethane component is present in an amount of from about 10% to about 45% by weight based on the total weight of the composition. 12. The composition according to claim 1 wherein the solid (meth)acrylate polyurethane component has a molecular weight in the range of about 100 g/mol to about 500 g/mol. 13. The composition according to claim 1 wherein the ethoxylated bisphenol-A (meth)acrylate component is present in an amount of from about 10% to about 40% by weight based on the total weight of the composition. 14. The composition according to claim 1 wherein the composition is solvent-free comprising less than 1% solvent by weight based on the total weight of composition and wherein the solvent is organic solvent or water. 15. The composition according to claim 1 wherein the composition is provided in solid form. 16. A method of sealing joints between male and female mating parts by: a. providing a composition according to claim 1 ; b. applying the composition to at least one mating part by melting; and c. subsequently, and optionally after active or passive cooling, joining the mating parts so as form a joint between the male and female mating parts wherein the joint between the male and female mating parts is sealed. 17. The method according to claim 16 comprising the steps of heating the mating part of an article to be sealed to a temperature sufficient to melt the composition. 18. The method according to claim 16 wherein at least one of the female mating part or the male mating part or both mating parts are formed from a metal. 19. A system comprising a sealed joint wherein the joint is sealed by the method according to claim 16 , optionally wherein the sealed joint permits the passage of fluid or gas through the male and female mating parts. 20. A sealed joint comprising a male mating part and a female mating part and the composition according to claim 1 . 21. The sealed joint according to claim 20 wherein at the male mating part or the female mating part or both are formed from a metal. 22. The sealed joint according to claim 20 wherein the joint remains sealed when exposed to internal pressure of 0.8 MPa for 5 minutes as measured in accordance with British Standard BS EN 751-2. 23. The sealed joint according to claim 20 wherein the joint remains sealed when exposed to internal pressure of 0.8 MPa for 5 minutes after the mating parts are turned back as measured in accordance with British Standard BS EN 751-2, optionally wherein the joint remains sealed when exposed to internal pressure of 0.8 MPa for 5 minutes after the mating parts are turned back up to 72 hours as measured in accordance with British Standard BS EN 751-2. 24. The sealed joint according to claim 20 wherein the joint remains sealed when exposed to internal pressure of 0.8 MPa for 5 minutes after the sealed joint is exposed to a temperature of 130° C. for 168 hours as measured in accordance with British Standard BS EN 751-2. 25. The sealed joint according to claim 20 wherein the joint remains sealed when exposed to internal pressure of 0.8 MPa for 5 minutes after the sealed joint is temperature cycled as measured in accordance with British Standard BS EN 751-2 wherein the sealed joint has been: a. heated to 100° C. for 22 hours and cooled to 20° C. for 2 hours, b. repeated (a) 5 times, c. subsequently cooled to −20° C. for 4 hours, and d. heated to 20° C. for 2 hours. 26. The composition of claim 1 , wherein the solid (meth)acrylate polyurethane component has a melting point in the range of from about 30° C. to about 100° C. and a molecular weight of about 1,000 g/mol or lower. 27. The composition of claim 1 , wherein the solid resin component is a polyester polyol; the solid resin component has a melting temperature range from 55° C. to 80° C. and a resolidification temperature range of from 25° C. to 55° C. as measured by differential scanning calorimetry according to ISO 11357-1:2016; and the solid resin component is present in an amount of from 30% to 45% by weight, the solid (meth)acrylate polyurethane component is present in an amount of from 30% to 45% by weight, and the ethoxylated bisphenol-A (meth)acrylate component is present in an amount of from 10% to 40% by weight, based on the total weight of the composition.

Assignees

Inventors

Classifications

  • with additional sealings · CPC title

  • Compositions for sealing or packing joints · CPC title

  • Polyurethanes or derivatives thereof · CPC title

  • C08L75/16Primary

    having terminal carbon-to-carbon unsaturated bonds · CPC title

  • Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen · CPC title

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Frequently asked questions

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What does patent US12448537B2 cover?
A curative free sealant composition for sealing joints between male and female parts, the sealant composition comprising a solid resin component, a solid (meth)acrylate polyurethane component, and an ethoxylated bisphenol-A (meth)acrylate component.
Who is the assignee on this patent?
Henkel Ag & Co Kgaa
What technology area does this patent fall under?
Primary CPC classification C08L75/16. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 21 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).