Bearing substrate, binding assembly and binding method thereof

Patent metadata

Field	Value
Publication number	US-12447712-B2
Application number	US-202117630670-A
Country	US
Kind code	B2
Filing date	Jan 25, 2021
Priority date	Jan 25, 2021
Publication date	Oct 21, 2025
Grant date	Oct 21, 2025

Abstract

The present disclosure relates to the technical field of display, and provides a bearing substrate, a binding assembly, and a binding method thereof. The bearing substrate may be bound to an integrated substrate. A thermal expansion coefficient of the bearing substrate is greater than a thermal expansion coefficient of the integrated substrate. The integrated substrate includes a plurality of second binding terminals distributed at equal intervals in a same direction. The bearing substrate includes a plurality of first binding terminal sets distributed at equal intervals in a first direction, and each of the first binding terminal sets includes a plurality of first binding terminals distributed at equal intervals in the first direction for binding with the plurality of the second binding terminals one-to-one.

First claim

What is claimed is:

1. A bearing substrate for being bound to an integrated substrate, wherein a thermal expansion coefficient of the bearing substrate is greater than a thermal expansion coefficient of the integrated substrate, and the integrated substrate comprises a plurality of second binding terminals distributed at equal intervals in a same direction, and wherein the bearing substrate comprises:
a plurality of first binding terminal sets distributed at equal intervals in a first direction, each of the first binding terminal sets comprising a plurality of first binding terminals distributed at equal intervals in the first direction for binding with the plurality of the second binding terminals one-to-one;
wherein a distance between any adjacent two of the first binding terminal sets is smaller than a distance between adjacent two of the first binding terminals in each of the first binding terminal sets, and the distance between adjacent two of the first binding terminals in each of the first binding terminal sets is equal to a distance between adjacent two of the second binding terminals.

2. The bearing substrate of claim 1 , wherein each of the first binding terminal sets includes n first binding terminals, where n is a positive integer greater than 1; and
wherein S 1 is the distance between adjacent two of the first binding terminal sets, S 2 is the distance between adjacent two of the first binding terminals in each of the first binding terminal sets, a is the thermal expansion coefficient of the bearing substrate, W is a size of any one of the first binding terminals in the first direction, and S 1 =S 2 −a*n*(S 2 +W).

3. The bearing substrate of claim 2 , wherein a value of n is 5-35.

4. The bearing substrate of claim 1 , wherein
any one of the second binding terminals is in an elongated strip shape, and an arrangement direction of the second binding terminals is perpendicular to extending directions of the second binding terminals; and
any one of the first binding terminals is in an elongated strip shape, and an arrangement direction of the first binding terminals is perpendicular to extending directions of the first binding terminals.

5. The bearing substrate of claim 1 , wherein
any one of the first binding terminals is in an elongated strip shape, a straight line where an extending direction of any one of the first binding terminals is located forms a first acute angle with respect to a straight line in the first direction, and a value of the first acute angle is 69°-85°; and
any one of the second binding terminals is in an elongated strip shape, a straight line where an extending direction of any one of the second binding terminals is located forms a second acute angle with respect to a straight line where a distribution direction of the second binding terminals is located, and the second acute angle and the first acute angle have the same value.

6. The bearing substrate of claim 1 , wherein the bearing substrate is a flexible display panel, and the integrated substrate is an on-chip film.

7. The bearing substrate of claim 1 , wherein the bearing substrate is a flexible display panel.

8. A bearing substrate, comprising:
a plurality of first binding terminal sets distributed at equal intervals in a first direction, each of the first binding terminal sets comprising a plurality of first binding terminals distributed at equal intervals in the first direction;
wherein a distance between any adjacent two of the first binding terminal sets is smaller than a distance between adjacent two of the first binding terminals in each of the first binding terminal sets.

9. The bearing substrate of claim 8 , wherein each of the first binding terminal sets includes n first binding terminals, where n is a positive integer greater than 1;
wherein S 1 is the distance between adjacent two of the first binding terminal sets, S 2 is the distance between adjacent two of the first binding terminals in each of the first binding terminal sets, a is a thermal expansion coefficient of the bearing substrate, W is a size of any one of the first binding terminals in the first direction, and S 1 =S 2 −a*n*(S 2 +W).

10. The bearing substrate of claim 9 , wherein a value of n is 5-35.

11. The bearing substrate of claim 8 , wherein any one of the first binding terminals is in an elongated strip shape, and an arrangement direction of the first binding terminals is perpendicular to extending directions of the first binding terminals.

12. The bearing substrate of claim 8 , wherein any one of the first binding terminals is in an elongated strip shape, a straight line where an extending direction of any one of the first binding terminals is located forms a first acute angle with respect to a straight line in the first direction, and a value of the first acute angle is 69°-85°.

13. A binding assembly, comprising:
a bearing substrate, comprising:
a plurality of first binding terminal sets distributed at equal intervals in a first direction, each of the first binding terminal sets comprising a plurality of first binding terminals distributed at equal intervals in the first direction, wherein a distance between any adjacent two of the first binding terminal sets is smaller than a distance between adjacent two of the first binding terminals in each of the first binding terminal sets;
an integrated substrate having a thermal expansion coefficient smaller than a thermal expansion coefficient of the bearing substrate, and comprising a plurality of second binding terminals for binding with the plurality of first binding terminals one-to-one, the plurality of second binding terminals being distributed at equal intervals in the first direction.

14. The binding assembly of claim 13 , wherein each of the first binding terminal sets comprises n first binding terminals, and a value of n is 5-35.

15. The binding assembly of claim 13 , wherein
any one of the second binding terminals is in an elongated strip shape, and an arrangement direction of the second binding terminals is perpendicular to extending directions of the second binding terminals; and
any one of the first binding terminals is in an elongated strip shape, and an arrangement direction of the first binding terminals is perpendicular to extending directions of the first binding terminals.

16. The binding assembly of claim 13 , wherein
any one of the first binding terminals is in an elongated strip shape, a straight line where an extending direction of any one of the first binding terminals is located forms a first acute angle with respect to a straight line in the first direction, and a value of the first acute angle is 69°-85°; and
any one of the second binding terminals is in an elongated strip shape, a straight line where an extending direction of any one of the second binding terminals forms a second acute angle with respect to a straight line in the first direction, and the second acute angle and the first acute angle have the same value.

17. The binding assembly of claim 13 , wherein the binding assembly is a display device, the bearing substrate is a flexible display panel, and the integrated substrate is an on-chip film.

Assignees

• Boe Technology Group Co Ltd
• Beijing Boe Technology Dev Co Ltd

Inventors

• Gao Zhan
• Zhang Xing
• Xu Pan
• Liu Wei
• Han Ying
• Wang Guoying
• Lin Yicheng
• Wang Tangxiang

Classifications

• B32B2457/20

  Displays, e.g. liquid crystal displays, plasma displays · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• B32B7/027

  Thermal properties · CPC title

• B32B3/085

  spaced apart pieces on the surface of a layer · CPC title

• B32B2307/546

  Flexural strength; Flexion stiffness · CPC title