Microstrand interface layer for improved engineered wood products

Patent metadata

Field	Value
Publication number	US-12447646-B2
Application number	US-202318539775-A
Country	US
Kind code	B2
Filing date	Dec 14, 2023
Priority date	Nov 8, 2021
Publication date	Oct 21, 2025
Grant date	Oct 21, 2025

Abstract

An engineered wood based siding, cladding or panel with a microstrand interface layer (MIL) applied to the top of the main strand matrix layers to minimize telegraphing, add rigidity and strength, and provide an improved surface appearance. The MIL comprises microstrands applied to the surface of the strand matrix or mat during production, prior to deposition of a fines layer. The MIL prevents the loss of fines into the strand matrix, and helps prevent or eliminate strand telegraphing.

First claim

What is claimed is:

1. A method of producing an engineered wood product, comprising the steps of:
forming a strand matrix on a production line, said strand matrix comprising a top surface with strands of an average first length and an average first width;
applying a microstrand interface layer on the top surface of the strand matrix, said microstrand interface layer comprising microstrands with an average second length and an average second width, wherein the average second length is less than the average first length, said microstrand interface layer further comprising an upper surface opposite the strand matrix;
applying a fines layer on the upper surface of the microstrand interface layer; and
consolidating and bonding the strand matrix, the microstrand interface layer, and the fines layer together.

2. The method of claim 1 , wherein the fines layer comprises a pre-consolidated fines layer, said pre-consolidated fines layer comprising fines consolidated prior to application to the upper surface of the microstrand interface layer.

3. The method of claim 1 , wherein the fines layer comprises loose fines material deposited on the upper surface of the microstrand interface layer.

4. The method of claim 1 , wherein the microstrand interface layer is pre-formed.

5. The method of claim 4 , wherein the fines layer is laminated to said pre-formed microstrand interface layer prior to application to the top surface of the strand matrix.

6. The method of claim 1 , wherein the microstrands comprise wood-based cellular material.

7. The method of claim 1 , wherein the microstrands comprise non-wood-based cellular material in whole or in part.

8. The method of claim 1 , wherein the microstrand interface layer comprises a plastic film, or glue or adhesive film.

9. The method of claim 1 , wherein the microstrand interface layer partially or fully melts during the step of consolidating.

10. The method of claim 1 , wherein the microstrand interface layer comprises a stiffener.

11. The method of claim 1 , wherein the microstrand interface layer provides one or more of the following: fire resistance; fungal resistance; moisture resistance; and sound dampening.

12. The method of claim 1 , further comprising the step of an applying an overlay on the fines layer opposite the microstrand interface layer.

13. The method of claim 1 , wherein the step of consolidating and bonding comprises application of heat and pressure using a hot press.

14. The method of claim 1 , wherein the step of consolidating and bonding comprises application of pressure using a cold press.

15. The method of claim 1 , wherein the step of consolidating and bonding comprises application of microwaves with or without a heated platen.

16. The method of claim 1 , wherein the step of consolidating and bonding comprises application of super-heated steam.

17. The method of claim 1 , wherein the microstrands are deposited on the top surface in a particular orientation with respect to each other, and/or with respect to the strands in the strand matrix.

18. An engineered-wood product produced by the method of claim 1 .

19. The product of claim 18 , wherein the engineered-wood product is an Oriented-Strand Board (OSB) plank, board or panel.

20. The product of claim 18 , wherein the engineered-wood product is a structural panel or board, a siding panel or board, cladding, or a panel.

Assignees

• Louisiana Pacific Corp

Inventors

• Merrick Gareth Paul
• St Germain Brian

Classifications

• B32B21/02

  the layer being formed} of fibres, chips, or particles {, e.g. MDF, HDF, OSB, chipboard, particle board, hardboard · CPC title

• B27N3/24

  characterised by using continuously acting presses having endless belts or chains moved within the compression zone · CPC title

• B32B2262/067

  Wood fibres · CPC title

• B32B2607/00

  Walls, panels · CPC title

• B32B2307/7246

  Water vapor barrier · CPC title