Current spreading structure for light-emitting diode

Patent metadata

Field	Value
Publication number	US-12446378-B2
Application number	US-202217936802-A
Country	US
Kind code	B2
Filing date	Sep 29, 2022
Priority date	Sep 29, 2022
Publication date	Oct 14, 2025
Grant date	Oct 14, 2025

Abstract

An apparatus has a current spreading base with an n-contact. The current spreading base has a small n-type resistivity to promote lateral electron flow. A current spreading cap is on top of the current spreading base. The current spreading cap has a large n-type resistivity to suppress vertical electron flow and promote lateral electron flow. An active region is on top of the current spreading cap. A p-type structure is on top of the active region with a p-contact. Sheet resistance of the current spreading base is experimentally established, the half width xF of a mesa is selected and the current spreading cap thickness hc is selected to collectively promote uniform current injection into the active region.

First claim

The invention claimed is:

1. An apparatus, comprising:
a current spreading base with at least one n-contact, the current spreading base having a small n-type resistivity to promote lateral electron flow;
a current spreading cap on top of the current spreading base, the current spreading cap with a large n-type resistivity to suppress vertical electron flow and promote lateral electron flow, wherein the current spreading cap has a resistivity of a few tens to thousands of Ωcm and the current spreading cap includes multiple layers of different bandgaps;
a light-emitting active region on top of the current spreading cap; and
a p-type structure on top of the light-emitting active region with a p-contact.

2. The apparatus of claim 1 wherein the resistivity of the current spreading cap is at least 1000 times of that of the current spreading base.

3. The apparatus of claim 1 wherein the current spreading base includes a high bandgap layer and a low bandgap layer, and the n-contact is formed on the low bandgap layer of the current spreading base.

4. The apparatus of claim 3 , wherein the bandgap of the current spreading cap is larger than that of the low bandgap layer of the current spreading base.

5. The apparatus of claim 1 wherein the p-contact defines a light-emitting mesa of width 2x F formed in-between two n-contacts, the sheet resistance of the current spreading base is experimentally established, the half width x F of the mesa is selected and the current spreading cap thickness h c is selected to collectively promote uniform current injection into the active region.

6. The apparatus of claim 1 wherein the p-contact defines a light-emitting region facing at least two n-contacts, the separation of the at least two n-contacts projecting a width of 2x F to the p-contact, the sheet resistance of the current spreading base is experimentally established, the half width x F of the separation of the at least two n-contacts projecting to the p-contact is selected and the current spreading cap thickness h c is selected to collectively promote uniform current injection into the active region.

7. The apparatus of claim 5 wherein minimum resistivity of the current spreading cap is proportional to the sheet resistance of the current spreading base and x F 2 .

8. The apparatus of claim 5 wherein minimum resistivity of the current spreading cap is inversely proportional to the current spreading cap thickness h c .

9. The apparatus of claim 6 wherein minimum resistivity of the current spreading cap is proportional to the sheet resistance of the current spreading base and x F 2 .

10. The apparatus of claim 6 wherein minimum resistivity of the current spreading cap is inversely proportional to the current spreading cap thickness h c .

11. The apparatus of claim 1 wherein the current spreading cap is formed of GaN.

12. The apparatus of claim 1 wherein the current spreading cap is formed of AlGaN.

13. The apparatus of claim 1 configured as a group-III nitride light-emitting diode.

14. An apparatus, comprising:
a current spreading base with at least one n-contact, the current spreading base having a small n-type resistivity to promote lateral electron flow;
a current spreading cap on top of the current spreading base, the current spreading cap with a large n-type resistivity to suppress vertical electron flow and promote lateral electron flow;
a light-emitting active region on top of the current spreading cap;
a p-type structure on top of the light-emitting active region with a p-contact;
a template layer attached to the current spreading base; the template layer has a roughened surface for light extraction; and,
n-contacts extending from the template layer into the current spreading base.

15. The apparatus of claim 14 wherein the current spreading cap is doped with impurities to increase resistivity.

16. The apparatus of claim 15 , wherein the impurities are silicon (Si), carbon (C) or iron (Fe).

17. The apparatus of claim 1 wherein the current spreading base includes multiple layers.

18. The apparatus of claim 4 wherein the bandgap is affected by Al-content and Al-content differences between the current spreading cap and the low bandgap layer of the current spreading base is at least 10%.

19. The apparatus of claim 4 wherein the current spreading base and current spreading cap are made of AlGaN, and the Al-content of the current spreading cap is more than 70%.

20. The apparatus of claim 1 , wherein there is a heavily n-type doped layer in-between the current spreading cap and the light-emitting active-region.

Assignees

• Bolb Inc

Inventors

• Zhang Jianping
• Gao Ying
• Zhou Ling

Classifications

• H10H20/852

  Encapsulations · CPC title

• H10H20/825

  containing nitrogen, e.g. GaN · CPC title

• H10H20/857 Primary

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/816 Primary

  having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures · CPC title