Combined MOS/MIS capacitor assembly

US12446299B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12446299-B2
Application numberUS-202217969835-A
CountryUS
Kind codeB2
Filing dateOct 20, 2022
Priority dateNov 1, 2021
Publication dateOct 14, 2025
Grant dateOct 14, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A combined metal-oxide-semiconductor (MOS) and metal-insulator-semiconductor (MIS) capacitor assembly is provided. The capacitor assembly includes a substrate comprising a semiconductor material; an oxide layer formed on a surface of the substrate; and an insulator layer formed over at least a portion of the oxide layer. The capacitor assembly further includes first and second conductive terminals, and a third terminal connected with the substrate. The oxide layer is connected in series between the substrate and the first conductive layer to form a first capacitor between the first terminal and the third terminal. The insulator layer is connected in series between the substrate and the second conductive layer to form a second capacitor between the second terminal and the third terminal.

First claim

Opening claim text (preview).

What is claimed is: 1. A capacitor assembly comprising: a substrate comprising a semiconductor material; an oxide layer formed on a surface of the substrate; an insulator layer formed over at least a portion of the oxide layer; a first conductive layer formed over at least a portion of the oxide layer; a second conductive layer formed over at least a portion of the insulator layer; a first terminal connected with the first conductive layer; a second terminal connected with the second conductive layer; and a third terminal connected with the substrate; wherein the oxide layer is connected in series between the substrate and the first conductive layer to form a first capacitor between the first terminal and the third terminal; and wherein the insulator layer is connected in series between the substrate and the second conductive layer to form a second capacitor between the second terminal and the third terminal. 2. The capacitor assembly of claim 1 , wherein the insulator layer is formed from a dielectric material that is different from the oxide layer. 3. The capacitor assembly of claim 1 , wherein the insulator layer comprises a nitride layer. 4. The capacitor assembly of claim 3 , wherein the insulator layer comprises silicon nitride or silicon oxynitride. 5. The capacitor assembly of claim 1 , wherein the first terminal and the second terminal each have a length in an X-direction, further wherein a ratio of the length of the first terminal to the length of the second terminal is about 1:1. 6. The capacitor assembly of claim 5 , wherein the first terminal and the second terminal each have a width in a Y-direction perpendicular to the X-direction, further wherein a ratio of the width of the first terminal to the width of the second terminal is about 1:1. 7. The capacitor assembly of claim 1 , wherein the third terminal is connected with the substrate at a location that is spaced apart from the surface of the substrate in a Z-direction. 8. The capacitor assembly of claim 1 , wherein: the first terminal is spaced apart from the second terminal in a X-direction and/or a Y-direction. 9. The capacitor assembly of claim 1 , wherein: the insulator layer covers a first portion of the oxide layer that is distinct from a second portion of the oxide layer that is free of the insulator layer. 10. The capacitor assembly of claim 1 , wherein the first terminal comprises an electrically conductive material that directly contacts the oxide layer. 11. The capacitor assembly of claim 1 , wherein the first terminal comprises an electrically conductive material that directly contacts the insulator layer. 12. The capacitor assembly of claim 1 , wherein the semiconductor material of the substrate comprises silicon. 13. The capacitor assembly of claim 1 , wherein the oxide layer comprises silicon oxide. 14. The capacitor assembly of claim 1 , wherein first terminal and the second terminal have a same shape and size, wherein the first capacitor has a first capacitance value and the second capacitor has a second capacitance value, wherein the first capacitance value and the second capacitance value are unequal. 15. The capacitor assembly of claim 1 , further comprising an additional terminal formed over the oxide layer or the insulator layer. 16. The capacitor assembly of claim 15 , wherein the additional terminal is spaced apart from both the first terminal and the second terminal.

Assignees

Inventors

Classifications

  • Electrodes · CPC title

  • of only capacitors · CPC title

  • H10D84/217Primary

    of only conductor-insulator-semiconductor capacitors · CPC title

  • H10D1/66Primary

    Conductor-insulator-semiconductor capacitors, e.g. MOS capacitors · CPC title

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What does patent US12446299B2 cover?
A combined metal-oxide-semiconductor (MOS) and metal-insulator-semiconductor (MIS) capacitor assembly is provided. The capacitor assembly includes a substrate comprising a semiconductor material; an oxide layer formed on a surface of the substrate; and an insulator layer formed over at least a portion of the oxide layer. The capacitor assembly further includes first and second conductive termin…
Who is the assignee on this patent?
Kyocera Avx Components Corp
What technology area does this patent fall under?
Primary CPC classification H10D84/217. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 14 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).