Method for manufacturing a circuit carrier
US-2018301354-A1 · Oct 18, 2018 · US
Power module
US12444670B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12444670-B2 |
| Application number | US-202117909471-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 8, 2021 |
| Priority date | Mar 9, 2020 |
| Publication date | Oct 14, 2025 |
| Grant date | Oct 14, 2025 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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- CPC / IPC classifications
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Abstract
Official abstract text for this publication.
A power module ( 2 ) including a rigid insulated substrate ( 10 ) mounted on a baseplate ( 4 ) is disclosed. An additional circuit carrier ( 6, 8 ) is mounted on the baseplate ( 4 ) adjacent to the rigid insulated substrate ( 10 ). The additional circuit carrier ( 6, 8 ) has a rigidity which is less than that of the rigid insulated substrate ( 10 ).
First claim
Opening claim text (preview).
The invention claimed is: 1. A power module comprising a rigid insulated substrate mounted on a baseplate, wherein an additional circuit carrier is mounted on the baseplate adjacent to the rigid insulated substrate, wherein the additional circuit carrier has a rigidity which is less than that of the rigid insulated substrate. 2. The power module according to claim 1 , wherein the additional circuit carrier is a printed circuit board (PCB). 3. The power module according to claim 1 , wherein the additional circuit carrier is a flexible circuit board. 4. The power module according to claim 1 , wherein the additional circuit carrier is bonded directly on the baseplate. 5. The power module according to claim 1 , wherein the rigid insulated substrate covers less than 90% of the area of the baseplate. 6. The power module according to claim 1 , wherein the additional circuit carrier is thinner than the rigid insulated substrate. 7. The power module according to claim 1 , wherein the additional circuit carrier comprises a portion that is L-shaped or C-shaped portion extending at least partly along a first side and a second side of the rigid insulated substrate. 8. The power module according to claim 1 , wherein the additional circuit carrier comprises one or more connection structures provided in the distal end of the additional circuit carrier. 9. The power module according to claim 1 , wherein at least a portion of the additional circuit carrier is non-planar. 10. The power module according to claim 1 , wherein the additional circuit carrier comprises several layers. 11. The power module according to claim 1 , wherein the rigid insulated substrate is a direct bonded copper (DBC) substrate.
Assignees
Inventors
Classifications
having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title
Die-attach connectors and bond wires · CPC title
multiple bond wires connected to common bond pads at both ends of the wires · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
between a chip and a laterally-adjacent insulating package substrate, interpose or RDL · CPC title
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- What does patent US12444670B2 cover?
- A power module ( 2 ) including a rigid insulated substrate ( 10 ) mounted on a baseplate ( 4 ) is disclosed. An additional circuit carrier ( 6, 8 ) is mounted on the baseplate ( 4 ) adjacent to the rigid insulated substrate ( 10 ). The additional circuit carrier ( 6, 8 ) has a rigidity which is less than that of the rigid insulated substrate ( 10 ).
- Who is the assignee on this patent?
- Danfoss Silicon Power Gmbh
- What technology area does this patent fall under?
- Primary CPC classification H10W90/701. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 14 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).