Multilayer electronic component having external electrode which includes resin layer and conductive resin layer

Patent metadata

Field	Value
Publication number	US-12444538-B2
Application number	US-202318119391-A
Country	US
Kind code	B2
Filing date	Mar 9, 2023
Priority date	Nov 21, 2022
Publication date	Oct 14, 2025
Grant date	Oct 14, 2025

Abstract

A multilayer electronic component includes: a body having a dielectric layer and first and second internal electrodes alternately disposed with each other while having the dielectric layer interposed therebetween in a first direction; and an external electrode including a connection portion and a band portion extending from the connection portion onto first and second surfaces of the body, wherein the external electrode further includes an electrode layer connected to one of the first and second internal electrodes, a resin layer in contact with the first and second surfaces, and a conductive resin layer disposed on the electrode layer and extending to the resin layer, and L 1 ′≥L 1 when L 1 indicates a second-directional size of the resin layer in the band portion, and L 1 ′ indicates a second-directional size of the conductive resin layer in the band portion.

First claim

What is claimed is:

1. A multilayer electronic component comprising:
a body including a dielectric layer and first and second internal electrodes alternately disposed with each other while having the dielectric layer interposed therebetween, and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion onto the first and second surfaces; and
a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion onto the first and second surfaces,
wherein the first external electrode includes a first electrode layer connected to the first internal electrode, a first resin layer including separated, in a cross-section of the body taken along the first and second directions, first and second portions respectively in contact with the first and second surfaces, and a first conductive resin layer disposed on the first electrode layer and extending to the first resin layer,
the second external electrode includes a second electrode layer connected to the second internal electrode, a second resin layer including separated, in the cross-section of the body taken along the first and second directions, first and second portions respectively in contact with the first and second surfaces, and a second conductive resin layer disposed on the second electrode layer and extending to the second resin layer, and
L 1 ′≥L 1 when L 1 indicates a second-directional size of the first resin layer in the first band portion, and L 1 ′ indicates a second-directional size of the first conductive resin layer in the first band portion.

2. The multilayer electronic component of claim 1 , wherein L 1 and L 1 ′ are measured from the third surface of the body to respective ends of the first resin layer and the first conductive resin layer in the second direction.

3. The multilayer electronic component of claim 1 , wherein L 2 ′≥L 2 when L 2 indicates a second-directional size of the second resin layer in the second band portion, and L 2 ′ indicates a second-directional size of the second conductive resin layer in the second band portion, wherein L 2 and L 2 ′ are measured from the fourth surface of the body to respective ends of the second resin layer and the second conductive resin layer in the second direction.

4. The multilayer electronic component of claim 1 , wherein the first and second resin layers include no metal.

5. The multilayer electronic component of claim 1 , wherein the first and second resin layers further include one or more of silica, alumina, glass, or zirconium dioxide (ZrO 2 ).

6. The multilayer electronic component of claim 1 , wherein the first and second conductive resin layers include metal and resin.

7. The multilayer electronic component of claim 1 , wherein T 1 ′≥T 1 when T 1 indicates an average thickness of the first resin layer in the first band portion, and T 1 ′ indicates an average thickness of the first conductive resin layer in the first band portion, wherein T 1 and T 1 ′ are measured from the first surface to respective upper surfaces, or from the second surface to respective lower surfaces, of the first resin layer and the first conductive resin layer in the first direction.

8. The multilayer electronic component of claim 7 , wherein T 1 is 9 μm or less.

9. The multilayer electronic component of claim 1 , wherein the body includes a 1 - 3 -th corner connecting the first surface and the third surface to each other, a 2 - 3 -th corner connecting the second surface and the third surface to each other, and
ends of the first electrode layer are disposed on the 1 - 3 -th corner and the 2 - 3 -th corner.

10. The multilayer electronic component of claim 9 , wherein the first electrode layer and the first resin layer overlap each other on the 1 - 3 -th corner and the 2 - 3 -th corner.

11. The multilayer electronic component of claim 10 , wherein at least one of the 1 - 3 -th or 2- 3 -th corner is rounded.

12. The multilayer electronic component of claim 1 , wherein ends of the first electrode layer are disposed on the first and second surfaces, and
the first resin layer in the first band portion extends between the first electrode layer and the first conductive resin layer.

13. The multilayer electronic component of claim 12 , wherein L 1 is larger than or equal to a second-directional size of the first electrode layer in the first band portion, which is measured from the third surface to one end of the first electrode in the second direction.

14. The multilayer electronic component of claim 1 , wherein an end of the first electrode layer is disposed on the third surface.

15. The multilayer electronic component of claim 14 , wherein the end of the first electrode layer is in contact with an end of the first resin layer on the third surface, without overlapping each other.

16. The multilayer electronic component of claim 15 , wherein an average thickness of the first electrode layer is larger than an average thickness of the first resin layer in the first connection portion.

17. The multilayer electronic component of claim 14 , wherein the first electrode layer includes no glass.

18. The multilayer electronic component of claim 1 , wherein the first external electrode further includes a plurality of island-shaped first interface resin portions arranged between the first electrode layer and the first conductive resin layer in the first connection portion, and
the second external electrode further includes a plurality of island-shaped second interface resin portions arranged between the second electrode layer and the second conductive resin layer in the second connection portion.

19. A multilayer electronic component comprising:
a body including a dielectric layer and first and second internal electrodes alternately disposed with each other while having the dielectric layer interposed therebetween, and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
a first external electrode including a first electrode layer disposed on the third surface, a first resin layer in contact with the first and second surfaces, and a first conductive resin layer disposed on the first electrode layer and extending to the first resin layer; and
a second external electrode including a second electrode layer disposed on the fourth surface, a second resin layer in contact with the first and second surfaces, and a second conductive resin layer disposed on the second electrode layer and extending to the second resin layer,
wherein the first and second resin layers include no metal,
the first and second conductive resin layers include metal and resin,
the first conductive resin layer covers an end portion of the first resin layer in contact with the first or second surface, and
the second conductive resin layer covers an end portion of the second resin layer in contact with the first or second su

Assignees

• Samsung Electro Mech

Inventors

• Kang Byung Woo
• Kim Jung Min
• Choi Hong Je
• Han Ji Hye
• Park Hye Jin
• Yun Su Yun
• Lee Sang Wook

Classifications

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G2/065

  for surface mounting, e.g. chip capacitors · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/232 Primary

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title