Machine measurement metrology frame for a lithography system

Patent metadata

Field	Value
Publication number	US-12443116-B2
Application number	US-202018000035-A
Country	US
Kind code	B2
Filing date	Jun 15, 2020
Priority date	Jun 15, 2020
Publication date	Oct 14, 2025
Grant date	Oct 14, 2025

Abstract

The present disclosure relates to apparatus and methods for performing maskless lithography processes. A substrate processing apparatus includes a slab with a plurality of guiderails coupled to and extending along the slab. A first shuttle is disposed on the plurality of guiderails, a second shuttle is disposed on the first shuttle, and a metrology bar is coupled to the second shuttle. The metrology bar includes a first plurality of sensors coupled to the metrology bar. A second plurality of sensors coupled to the metrology bar are disposed laterally inward of the first plurality of sensors.

First claim

What is claimed is:

1. A substrate processing apparatus, comprising:
a slab;
at least one guiderail coupled to and extending along the slab;
a first shuttle disposed on the at least one guiderail;
a second shuttle disposed on the first shuttle; and
a metrology bar coupled to a bottom of a chuck that is disposed on the second shuttle, wherein each distal end of the metrology bar extends laterally beyond a perimeter of the chuck, the metrology bar comprising:
at least one first sensor coupled to at least one distal end of the metrology bar; and
at least one second sensor laterally inward of the at least one first sensor.

2. The apparatus of claim 1 , wherein air bearings are disposed on opposite sides of the metrology bar.

3. The apparatus of claim 2 , further comprising:
a second scale coupled to the chuck.

4. The apparatus of claim 3 , wherein the second scale is disposed opposite the at least one second sensor.

5. The apparatus of claim 1 , further comprising:
a processing unit coupled to the slab by a support.

6. The apparatus of claim 5 , further comprising:
a first scale coupled to the support opposite the at least one guiderail.

7. The apparatus of claim 1 , wherein the at least one second sensor is recessed within the metrology bar and the at least one first sensor extends from the metrology bar.

8. The apparatus of claim 1 , wherein the first shuttle comprises one or more first motors and the second shuttle comprises one or more second motors.

9. The apparatus of claim 8 , wherein the first motors are configured to move the first shuttle in a first direction and the second motors are configured to move the second shuttle in a second direction normal to the first direction.

10. The apparatus of claim 9 , wherein the second motors are configured to move the second shuttle a magnitude of between about 1 mm and about 300 mm in the second direction.

11. The apparatus of claim 1 , wherein the at least one first sensor and the at least one second sensor comprise optical sensors.

12. A substrate processing apparatus, comprising:
a slab;
at least one guiderail coupled to and extending along the slab;
a processing unit coupled to the slab by a support;
a first shuttle disposed on the at least one guiderail;
a second shuttle disposed on the first shuttle;
a chuck disposed on the second shuttle; and
a metrology bar coupled to a bottom of the chuck, wherein each distal end of the metrology bar each extends laterally beyond a perimeter of the chuck, the metrology bar comprising:
at least one first scale coupled to the metrology bar; and
at least one second scale coupled to the metrology bar laterally inward of the at least one first scale.

13. The apparatus of claim 12 , further comprising:
a first sensor coupled to the support opposite the at least one guiderail.

14. The apparatus of claim 12 , wherein air bearings are disposed on opposite sides of the metrology bar.

15. The apparatus of claim 12 , wherein the first shuttle comprises one or more first motors and the second shuttle comprises one or more second motors.

16. The apparatus of claim 15 , wherein the first motors are configured to move the first shuttle in a first direction and the second motors are configured to move the second shuttle in a second direction normal to the first direction.

17. The apparatus of claim 13 , wherein a second sensor is coupled to the chuck.

18. The apparatus of claim 17 , wherein the first sensor and second sensor comprise optical sensors.

19. A substrate processing method, comprising:
positioning a substrate on a chuck, wherein the chuck is coupled to a second shuttle disposed on a first shuttle;
determining, via a metrology bar coupled to a bottom of the chuck comprising one of a first sensor or scale and one of a second sensor or scale coupled to the metrology bar laterally inward of the first sensor or scale, a position of the substrate within a processing unit, wherein each distal end of the metrology bar extends laterally beyond a perimeter of the chuck; and
in response to determining the position of the substrate, moving one or both of the first shuttle and the second shuttle to position the substrate relative to the processing unit.

Assignees

• Applied Materials Inc

Inventors

• Mueller Ulrich
• Markle David Arthur
• Sporer Stephen F

Classifications

• G03F7/70791

  Large workpieces, e.g. glass substrates for flat panel displays or solar panels · CPC title

• G03F7/70775

  Position control, e.g. interferometers or encoders for determining the stage position · CPC title

• G03F7/70725

  control · CPC title

• G03F7/70508 Primary

  Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus · CPC title

• G03F7/70275

  Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems · CPC title