Systems, methods, and devices for sealing LED light sources in a light module
US-9052070-B2 · Jun 9, 2015 · US
US12439522B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12439522-B2 |
| Application number | US-202318117101-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 3, 2023 |
| Priority date | Mar 4, 2022 |
| Publication date | Oct 7, 2025 |
| Grant date | Oct 7, 2025 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Embodiments are directed to optics, light modules with such optics, and methods of assembling such light modules such that the optics are attached and sealed directly to a printed circuit board, thereby eliminating the need for gaskets and a frame and reducing the number of component parts of the light module. In some embodiments, the optics are discrete optics that can each be attached to the printed circuit board independent of the other optics.
Opening claim text (preview).
What is claimed is: 1. A light module comprising: a printed circuit board comprising at least one light source provided on an upper surface of the printed circuit board, wherein the printed circuit board comprises at least one board orienting feature; and an optic adhered directly to the upper surface of the printed circuit board and over the at least one light source, wherein the optic comprises at least one optic orienting feature and wherein the at least one optic orienting feature comprises a stand-off extending from the optic, wherein the optic is adhered to the upper surface of the printed circuit board so that the at least one optic orienting feature is located at a predetermined position relative to the at least one board orienting feature. 2. The light module of claim 1 , wherein the optic comprises a base having a lower surface, an optical cavity having a cavity opening in the lower surface of the base, and a wall that extends outwardly from the lower surface of the base, wherein the at least one light source is positioned to emit light into the optical cavity and wherein the wall engages the upper surface of the printed circuit board. 3. The light module of claim 2 , wherein the wall extends at least partially around the cavity opening. 4. The light module of claim 3 , wherein the wall extends entirely around the cavity opening. 5. The light module of claim 2 , wherein the upper surface of the printed circuit board comprises at least one groove that receives the wall. 6. The light module of claim 5 , wherein the groove and wall each comprises a shape and wherein the shape of the groove substantially matches the shape of the wall. 7. The light module of claim 1 , further comprising a conformal coating on the upper surface of the printed circuit board, wherein the conformal coating at least partially surrounds the optic. 8. The light module of claim 1 , wherein the optic comprises a plurality of optics and the at least one light source comprises a plurality of light sources, wherein each of the plurality of optics is positioned over a single one of the plurality of light sources. 9. The light module of claim 1 , wherein the optic comprises a plurality of optics and wherein at least some of the plurality of optics are adhered to the upper surface of the printed circuit board in different rotational orientations. 10. The light module of claim 1 , wherein the optic comprises a plurality of optics and wherein at least some of the plurality of optics are different. 11. The light module of claim 1 , wherein the at least one light source comprises at least one array of light sources. 12. An optic comprising: a base having a lower surface, at least one optical cavity having a cavity opening in the lower surface of the base, and a wall that extends outwardly from the lower surface of the base and at least partially around the cavity opening, wherein the at least one optical cavity is configured to extend over a light source provided on a printed circuit board such that the wall engages an upper surface of the printed circuit board, wherein the wall is configured to seat within a groove provided on the upper surface of the printed circuit board. 13. The optic of claim 12 , wherein the wall extends entirely around the cavity opening and is configured to seal the at least one optical cavity when the wall engages the upper surface of the printed circuit board. 14. The optic of claim 12 , wherein the groove and wall each comprises a shape and wherein the shape of the groove substantially matches the shape of the wall. 15. A method of assembling a light module comprising an optic having a base and a printed circuit board having at least one light source on an upper surface of the printed circuit board, the method comprising: adhering the base of the optic to the upper surface of the printed circuit board such that the optic is positioned over the at least one light source, wherein the upper surface of the printed circuit board comprises at least one groove that receives a wall extending from the base of the optic. 16. The method of claim 15 , wherein the base of the optic comprises a lower surface, an optical cavity having a cavity opening in the lower surface of the base, and the wall that extends outwardly from the lower surface of the base, wherein adhering the base of the optic to the upper surface of the printed circuit board such that the optic is positioned over the at least one light source comprises: adhering the base of the optic to the upper surface of the printed circuit board such that the at least one light source emits light into the optical cavity and the wall engages the upper surface of the printed circuit board to seal the optical cavity. 17. A light module comprising: a printed circuit board comprising at least one light source provided on an upper surface of the printed circuit board; and an optic adhered directly to the upper surface of the printed circuit board and over the at least one light source, wherein the optic comprises a plurality of optics and the at least one light source comprises a plurality of light sources and wherein each of the plurality of optics is positioned over a single one of the plurality of light sources. 18. A light module comprising: a printed circuit board comprising at least one light source provided on an upper surface of the printed circuit board; and an optic adhered directly to the upper surface of the printed circuit board and over the at least one light source, wherein the optic comprises a plurality of optics and wherein at least some of the plurality of optics are adhered to the upper surface of the printed circuit board in different rotational orientations. 19. A light module comprising: a printed circuit board comprising at least one light source provided on an upper surface of the printed circuit board; and an optic adhered directly to the upper surface of the printed circuit board and over the at least one light source, wherein the optic comprises a plurality of optics and wherein at least some of the plurality of optics are different.
Affixing by adhesive · CPC title
Optical component, e.g. opto-electronic component · CPC title
Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components · CPC title
Light emitting diode [LED] · CPC title
Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42) · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.