Developing apparatus and substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-12436457-B2
Application number	US-202318333570-A
Country	US
Kind code	B2
Filing date	Jun 13, 2023
Priority date	Jun 16, 2022
Publication date	Oct 7, 2025
Grant date	Oct 7, 2025

Abstract

The present application relates to a developing apparatus. The developing apparatus comprises a housing; a wafer support disposed within the housing and for holding a wafer; a semipermeable diaphragm disposed within the housing and separating the housing into an upper housing defining an upper chamber and a lower housing defining a low chamber, wherein the semipermeable diaphragm is semipermeable to moisture such that moisture is allowed to move from the lower chamber to the upper chamber, but liquid drops are prohibited to move from the upper chamber to the lower chamber; and a nozzle assembly disposed above the wafer support and for spraying at least developer to the wafer support.

First claim

The invention claimed is:

1. A developing apparatus, comprising:
a housing;
a wafer support disposed within the housing and for holding a wafer;
a semipermeable diaphragm disposed within the housing and separating the housing into an upper housing defining an upper chamber and a lower housing defining a low chamber, wherein the semipermeable diaphragm is semipermeable to moisture such that moisture is allowed to move from the lower chamber to the upper chamber, but liquid drops formed from the moisture are prohibited to move from the upper chamber to the lower chamber; and
a nozzle assembly disposed above the wafer support and for spraying at least developer to the wafer support;
wherein the upper housing comprises an opening, and the semipermeable diaphragm comprises an opening corresponding to the opening of the upper housing, wherein the developing apparatus further comprises:
a support arm that passes through the openings of the upper housing and the semipermeable diaphragm and for mounting the nozzle assembly.

2. The developing apparatus of claim 1 , further comprising:
a hydrophilic coating disposed on an inner surface of the upper housing.

3. The developing apparatus of claim 1 , wherein the semipermeable diaphragm includes polyethylene, polyurethane, polypropylene or any combination thereof.

4. The developing apparatus of claim 1 , wherein the semipermeable diaphragm is shaped as a dome.

5. A developing apparatus comprising:
a housing;
a wafer support disposed within the housing and for holding a wafer;
a semipermeable diaphragm disposed within the housing and separating the housing into an upper housing defining an upper chamber and a lower housing defining a low chamber, wherein the semipermeable diaphragm is semipermeable to moisture such that moisture is allowed to move from the lower chamber to the upper chamber, but liquid drops formed from the moisture are prohibited to move from the upper chamber to the lower chamber; and
a nozzle assembly disposed above the wafer support and for spraying at least developer to the wafer support;
wherein the semipermeable diaphragm comprises a periphery along which it is attached to the housing, and at least one outlet is positioned at the periphery such that water can be drained out of the upper chamber through the at least one outlet.

6. The developing apparatus of claim 5 , wherein the at least one outlet is not directly above the wafer when it is held by the wafer support.

7. The developing apparatus of claim 5 , further comprising:
a hydrophilic coating disposed on an inner surface of the upper housing.

8. The developing apparatus of claim 5 , wherein the semipermeable diaphragm includes polyethylene, polyurethane, polypropylene or any combination thereof.

9. The developing apparatus of claim 5 , wherein the semipermeable diaphragm is shaped as a dome.

Assignees

• Stats Chippac Pte Ltd

Inventors

• Nam Giwoong
• Kwak Jin
• Lee Jaeseung
• Choi Taekyu
• Son Inho
• Park Sanghyun
• Kang Yeongwon

Classifications

• G03F7/30 Primary

  Imagewise removal using liquid means · CPC title

• G03F7/3021 Primary

  from a wafer supported on a rotating chuck · CPC title

• G03F7/0025 Primary

  characterised by means for coating the developer · CPC title

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title