Immersion compatible optical interconnect

Patent metadata

Field	Value
Publication number	US-12436345-B2
Application number	US-202117556326-A
Country	US
Kind code	B2
Filing date	Dec 20, 2021
Priority date	Dec 20, 2021
Publication date	Oct 7, 2025
Grant date	Oct 7, 2025

Abstract

A fluid compatible electro-optical packages and associated systems and devices are shown. For example, a fluid compatible electro-optical package includes integrated circuits with at least one photonic die and optical connections coupled with the integrated circuit. In an example, optical fibers are coupled with the optical connection. In an example fluid compatible electro-optical package, a fluid impermeable port is coupled with the optical connection and the optical fibers couple with the optical connection within the fluid impermeable port.

First claim

The claimed invention is:

1. An apparatus, comprising:
an integrated circuit comprising at least one photonic die;
an optical connection coupled with the integrated circuit;
optical fibers coupled with the optical connection;
a fluid impermeable port coupled with the optical connection, the fluid impermeable port comprising a polymer-based material and having a fluid impermeable port latch comprising the polymer-based material; and
an adapter coupled to the fluid impermeable port, the adapter comprising an adapter latch engaged with the fluid impermeable port, wherein the optical fibers couple with the optical connection within the fluid impermeable port.

2. The apparatus of claim 1 , wherein the polymer-based material comprises one of polypropylene, rubber, or synthetic rubber.

3. The apparatus of claim 1 , further comprising:
an integrated heat spreader covering the at least one photonic die, wherein the adapter is coupled to the integrated heat spreader.

4. The apparatus of claim 3 , further comprising:
a cutout, wherein the optical connection is coupled with the integrated circuit in the cutout.

5. The apparatus of claim 3 , wherein the fluid impermeable port latch and the adapter latch comprise a latching mechanism, the latching mechanism comprising one of a male-female engagement, a hook and eye engagement, opposing hooks, a bayonet-type fastener, a hook and roller fastener, or opposing T-shaped hooks.

6. The apparatus of claim 1 , further comprising:
an immersion cooling system, wherein the integrated circuit is immersed in the immersion cooling system.

7. An apparatus, comprising:
a photonic silicon die coupled to a substrate;
an integrated heat spreader covering the photonic silicon die and comprising a cutout;
optical fibers in communication with the photonic silicon die through the cutout;
a compressible seal surrounding the optical fibers at a communication point with the photonic silicon die, the compressible seal comprising a polymer-based material and having a fluid impermeable port latch comprising the polymer-based material; and
a latching mechanism engaged with the fluid impermeable port latch of the compressible seal, wherein the compression force provided to the compressible seal is a fluid barrier at the communication point.

8. The apparatus of claim 7 , wherein the polymer-based material comprises one of polypropylene, rubber, or synthetic rubber.

9. The apparatus of claim 7 , wherein the compressible seal is a port through which the optical fibers pass and connect with the photonic silicon die.

10. The apparatus of claim 7 , wherein the fluid impermeable port latch and the latching mechanism comprise a male-female coupling.

11. The apparatus of claim 7 , wherein the optical fibers are arranged vertically or horizontally.

12. The apparatus of claim 7 , further comprising:
an immersion cooling system, wherein the photonic silicon die, the integrated heat spreader, and the optical fibers are immersed in the immersion cooling system.

13. The apparatus of claim 7 , further comprising:
a processor coupled to the photonic silicon die.

14. An apparatus, comprising:
a photonic die coupled to a substrate;
an integrated heat spreader covering the die;
optical fibers in communication with the photonic die;
a port surrounding the optical fibers at a communication point with the photonic die, the port comprising a polymer-based material and having a first latch comprising the polymer-based material; and
an adapter coupled to the integrated heat spreader, the adapter comprising a second latch engaged with the first latch, wherein the port, the first latch, and the second latch provide a fluid barrier at the communication point.

15. The apparatus of claim 14 , wherein the polymer-based material comprises one of polypropylene, rubber, or synthetic rubber.

16. The apparatus of claim 14 , further comprising:
a cutout in the integrated heat spreader, wherein the port is coupled with the photonic die in the cutout.

17. The apparatus of claim 14 , wherein the first latch and the second latch comprise a latching mechanism, the latching mechanism comprising one of a male-female engagement, a hook and eye engagement, opposing hooks, a bayonet-type fastener, a hook and roller fastener, or opposing T-shaped hooks.

18. The apparatus of claim 14 , wherein the optical fibers are arranged vertically or horizontally at the communication point.

19. The apparatus of claim 14 , further comprising:
an immersion cooling system, wherein the photonic die, the integrated heat spreader, and the optical fibers are immersed in the immersion cooling system.

20. The apparatus of claim 14 , further comprising:
a processor coupled to the photonic die.

Assignees

• Intel Corp

Inventors

• Pratap Divya

Classifications

• G02B6/4261

  Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails · CPC title

• G02B6/4245

  Mounting of the opto-electronic elements · CPC title

• G02B6/4251

  Sealed packages (G02B6/4248 takes precedence) · CPC title

• G02B6/4268

  Cooling (of instruments G12B15/00; of electric apparatus H05K7/20; of semiconductor devices H10W76/47) · CPC title

• G02B6/4248

  Feed-through connections for the hermetical passage of fibres through a package wall (see provisionally also G02B6/4428) · CPC title