Electronic Device Coatings for Reflecting Mid-Spectrum Visible Light
US-2021048565-A1 · Feb 18, 2021 · US
US12436330B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12436330-B2 |
| Application number | US-202117459843-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 27, 2021 |
| Priority date | May 3, 2021 |
| Publication date | Oct 7, 2025 |
| Grant date | Oct 7, 2025 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
An electronic device may include conductive structures with a light-reflecting coating. The coating may have a two or four-layer thin-film interference filter. The two-layer filter may have a CrN layer and an SiCrN layer. The four-layer filter may have two CrN layers and two SiCrN layers. The two-layer filter may be used to coat relatively small conductive components. The four-layer filter may be used to coat a conductive housing sidewall. Both types of interference filter may produce a relatively uniform light blue color despite variations in coating thickness produced on account of the geometry of the underlying conductive structure.
Opening claim text (preview).
What is claimed is: 1. Apparatus comprising: a conductive substrate; and a coating on the conductive substrate and having a color, the coating comprising: adhesion and transition layers, and a thin-film interference filter on the adhesion and transition layers, wherein the thin-film interference filter comprises an SiCrN layer and a CrN layer, the CrN layer being an uppermost layer of the thin-film interference filter and the SiCrN layer being a lowermost layer of the thin-film interference filter, and wherein, at a location of maximum thickness, the coating has an L* value greater than 60 in an L*a*b* color space, an a* value between −5 and 0 in the L*a*b* color space, and a b* value between −10 and −20 in the L*a*b* color space. 2. The apparatus of claim 1 , wherein the CrN layer contacts the SiCrN layer. 3. The apparatus of claim 2 , wherein the thin-film interference filter has a thickness between 0.05 and 0.15 microns. 4. The apparatus of claim 2 , wherein an atomic percentage of Cr atoms in the SiCrN layer is greater than 45% and less than 60% and wherein an atomic percentage of Si atoms in the SiCrN layer is greater than 15% and less than 25%. 5. The apparatus of claim 4 , wherein an atomic percentage of Cr atoms in the CrN layer is greater than 55% and less than 70%. 6. The apparatus of claim 5 wherein, at the location of maximum thickness, the coating has an L* value greater than 65 in the L*a*b* color space. 7. The apparatus of claim 2 , wherein the conductive substrate comprises a conductive structure selected from the group consisting of: a conductive button member and a subscriber identity module (SIM) card tray. 8. The apparatus of claim 1 , wherein the thin-film interference filter comprises: an additional CrN layer that contacts the SiCrN layer; and an additional SiCrN layer that contacts the CrN layer and that contacts the additional CrN layer. 9. The apparatus of claim 8 , wherein the conductive substrate comprises a conductive electronic device housing sidewall. 10. Apparatus comprising: a conductive substrate; and a coating on the conductive substrate and having a color, the coating comprising: adhesion and transition layers, and a four-layer thin-film interference filter on the adhesion and transition layers, wherein the four-layer thin-film interference filter has a first SiCrN layer, a first CrN layer that contacts the first SiCrN layer, a second SiCrN layer that contacts the first CrN layer, and a second CrN layer that contacts the second SiCrN layer, the first SiCrN layer being a lowermost layer of the four-layer thin-film interference filter, and wherein an atomic percentage of Cr atoms in the first SiCrN layer is greater than 45% and less than 60% and wherein an atomic percentage of Si atoms in the first SiCrN layer is greater than 15% and less than 25%. 11. The apparatus of claim 10 , wherein the coating has a first thickness at a first location on the conductive substrate and a second thickness that is less than the first thickness at a second location on the conductive substrate. 12. The apparatus of claim 11 wherein, at the first location on the conductive substrate, the coating has an L* value greater than 65 in an L*a*b* color space, an a* value between −5 and 0 in the L*a*b* color space, and a b* value between −10 and −20 in the L*a*b* color space. 13. The apparatus of claim 12 , wherein the atomic percentage of Si atoms in the first SiCrN layer is less than 20%, an atomic percentage of N atoms in the first SiCrN layer is less than 40%, an atomic percentage of Cr atoms in the second SiCrN layer is less than the atomic percentage of Cr atoms in the first SiCrN layer, an atomic percentage of N atoms in the second SiCrN layer is greater than the atomic percentage of N atoms in the first SiCrN layer, an atomic percentage of Cr atoms in the first CrN layer is greater than the atomic percentage of Cr atoms in the second SiCrN layer, and an atomic percentage of N atoms in the second CrN layer is less than the atomic percentage of N atoms in the second SiCrN layer. 14. The apparatus of claim 12 wherein at the second location on the conductive substrate, the coating has an additional L* value greater than 45 in the L*a*b* color space, an additional a* value between −3 and 3 in the L*a*b* color space, and an additional b* value between −5 and −20 in the L*a*b* color space. 15. The apparatus of claim 14 wherein the conductive substrate comprises a conductive electronic device housing sidewall.
including keys on side or rear faces · CPC title
for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate · CPC title
Component assemblies · CPC title
Structural details; Housings (constructional details of radio-controlled time-pieces, e.g. antennas G04R60/00) · CPC title
Details related to the display arrangement, including those related to the mounting of the display in the housing · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.