Temperature adjusting device, electronic component handling apparatus, and electronic component test apparatus

Patent metadata

Field	Value
Publication number	US-12436185-B2
Application number	US-202318163056-A
Country	US
Kind code	B2
Filing date	Feb 1, 2023
Priority date	Mar 16, 2022
Publication date	Oct 7, 2025
Grant date	Oct 7, 2025

Abstract

A temperature adjusting device includes: a fluid connector connected to a fluid supply source; a heat exchanger thermally connected to a DUT or a carrier holding the DUT being pressed against a socket; a first flow path passing through an inside of the heat exchanger; a first swirl flow forming part that supplies a first swirl flow to the first flow path, the first swirl flow swirling along an inner surface of the first flow path around a first central axis of the first flow path; and a second flow path disposed on an upstream side of the first flow path and connected to the first flow path. The second flow path has a second central axis not intersecting the first central axis, and the first swirl flow forming part is a first connection part where the first and second flow paths are connected to each other.

First claim

What is claimed is:

1. A temperature adjusting device that adjusts a temperature of a device under test (DUT) electrically connected to a socket, the temperature adjusting device comprising:
a fluid connector connected to a fluid supply source that supplies a fluid;
a heat exchanger thermally connected to the DUT or a carrier holding the DUT in a state that the DUT or the carrier is pressed against the socket;
a first flow path passing through an inside of the heat exchanger;
a first swirl flow forming part that swirls a flow of the fluid to form a first swirl flow and supplies the first swirl flow to the first flow path;
a second flow path disposed on an upstream side of the first flow path and connected to the first flow path, wherein
the first swirl flow swirls along an inner surface of the first flow path around a first central axis of the first flow path,
the second flow path has a second central axis that does not intersect the first central axis, and
the first swirl flow forming part is a first connection part where the first flow path and the second flow path are connected to each other.

2. The temperature adjusting device according to claim 1 , wherein
a cross section of the first flow path along a radial direction of the first flow path has a circular shape,
the first flow path includes a first opening that is formed in an inner circumferential surface of the first flow path,
the second flow path includes a second opening that is formed at a first end of the second flow path, and
the first opening and the second opening are connected to each other in the first connection part.

3. The temperature adjusting device according to claim 1 , wherein
a part of an inner surface of the second flow path is connected with a part of the inner circumferential surface of the first flow path in the first connection part in a flush shape.

4. The temperature adjusting device according to claim 1 , wherein
an intersection angle between a first virtual straight line and a second virtual straight line is 90° to 120°,
the first virtual straight line is a virtual straight line obtained by projecting the first central axis onto a first virtual plane,
the second virtual straight line is a virtual straight line obtained by projecting the second central axis onto the first virtual plane, and
the first virtual plane is a virtual plane that is parallel to the first central axis and the second central axis.

5. The temperature adjusting device according to claim 1 , further comprising:
a third flow path disposed on an upstream side of the second flow path and connected to the second flow path; and
a second swirl flow forming part that swirls a flow of the fluid to form a second swirl flow and supplies the second swirl flow to the third flow path, wherein
the second swirl flow swirls along an inner surface of the third flow path around a third central axis of the third flow path.

6. The temperature adjusting device according to claim 5 , wherein
a cross section of the third flow path along a radial direction of the third flow path has a circular shape,
the second flow path includes a third opening that is formed at a second end of the second flow path,
the third flow path includes a fourth opening that is formed in an inner circumferential surface of the third flow path, and
the third opening and the fourth opening are connected to each other.

7. The temperature adjusting device according to claim 5 , wherein
an intersection angle between a third virtual straight line and a fourth virtual straight line is 90° to 120°,
the third virtual straight line is a virtual straight line obtained by projecting the second central axis onto a second virtual plane,
the fourth virtual straight line is a virtual straight line obtained by projecting the third central axis onto the second virtual plane, and
the second virtual plane is a virtual plane that is parallel to the second central axis and the third central axis.

8. The temperature adjusting device according to claim 5 , further comprising:
a fourth flow path disposed on an upstream side of the third flow path and connected to the third flow path, wherein
the fourth flow path has a fourth central axis that does not intersect the third central axis, and
the second swirl flow forming part is a second connection part where the third flow path and the fourth flow path are connected to each other.

9. The temperature adjusting device according to claim 8 , wherein
a cross section of the third flow path along a radial direction of the third flow path has a circular shape,
the third flow path includes a fifth opening that is formed in an inner circumferential surface of the third flow path,
the fourth flow path includes a sixth opening that is formed at a third end of the fourth flow path, and
the fifth opening and the sixth opening are connected to each other in the second connection part.

10. The temperature adjusting device according to claim 1 , wherein
an intersection angle between a fifth virtual straight line and a sixth virtual straight line is 90° to 120°,
the fifth virtual straight line is a virtual straight line obtained by projecting the third central axis onto a third virtual plane,
the sixth virtual straight line is a virtual straight line obtained by projecting the fourth central axis onto the third virtual plane, and
the third virtual plane is a virtual plane that is parallel to the third central axis and the fourth central axis.

11. The temperature adjusting device according to claim 5 , further comprising:
a plurality of first flow paths each passing through the inside of the heat exchanger; and
a plurality of second flow paths each disposed on the upstream side of each of the first flow paths and connected to each of the first flow paths, wherein
the second flow paths are connected to the third flow path.

12. The temperature adjusting device according to claim 1 , wherein
the first flow path has a spiral wall disposed on the inner surface of the first flow path and extending in a spiral shape, and
a female thread is formed by the spiral wall on the inner surface of the first flow path.

13. The temperature adjusting device according to claim 1 , wherein
the fluid is mist-like or liquid-like nitrogen.

14. An electronic component handling apparatus that handles a DUT or a carrier holding the DUT, the electronic component handling apparatus comprising:
a pushing device that:
comprises the temperature adjusting device according to claim 1 , and presses the DUT or the carrier against a socket.

15. An electronic component test apparatus that tests a DUT, the electronic component test apparatus comprising:
the electronic component handling apparatus according to claim 14 ; and
a tester that comprises the socket.

Assignees

• Advantest Corp

Inventors

• Yamada Yuya
• Kikuchi Aritomo
• Kato Yasuyuki

Classifications

• F28F13/125

  by stirring · CPC title

• G01R31/2886

  Features relating to contacting the IC under test, e.g. probe heads; chucks (G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06) · CPC title

• G01R31/2863

  Contacting devices, e.g. sockets, burn-in boards or mounting fixtures (in general G01R1/04) · CPC title

• G01R31/2889

  Interfaces, e.g. between probe and tester (G01R31/31905 and G01R1/07364 take precedence) · CPC title

• G01R31/2868

  Complete testing stations; systems; procedures; software aspects · CPC title