Facade system for thermally conditioning buildings

Patent metadata

Field	Value
Publication number	US-12435889-B2
Application number	US-202217871130-A
Country	US
Kind code	B2
Filing date	Jul 22, 2022
Priority date	Jul 28, 2021
Publication date	Oct 7, 2025
Grant date	Oct 7, 2025

Abstract

An architectural structure having: a wall of a room of the architectural structure; and a panel integrated into the wall, wherein the panel includes thermoelectric components (TECs) arranged as a TEC grid, thereby defining a radiant panel, wherein: the TECs, of the TEC grid, are thermally coupled to a common heat sink formed in part by an exterior surface of the wall; and the wall defines a wall surface area, the panel defines a panel surface area, and the panel surface area is between 5% and 20% of the wall surface area.

First claim

What is claimed is:

1. An architectural structure, comprising:
a wall of a room of the architectural structure; and a panel integrated into the wall, wherein the panel comprises thermoelectric components (TECs) arranged as a TEC grid, thereby defining a radiant panel,
wherein: the TECs, of the TEC grid, are thermally coupled to a common heat sink formed in part by an exterior surface of the wall; and the wall defines a wall surface area, the panel defines a panel surface area, and the panel surface area is between 5% and 20% of the wall surface area,
wherein the wall defines a panel aperture, and the panel is disposed within the panel aperture, wherein the wall defines a wall interior surface and a wall exterior surface that are depthwise spaced apart from each other, wherein the panel defines a panel exterior surface and a panel interior surface that are depthwise spaced apart from each other,
wherein: the wall exterior and interior surfaces and the panel exterior and interior surfaces are parallel to each other; and the panel exterior surface is flush with, or continuous with, the wall exterior surface to define the common heat sink for the TEC grid, and
wherein:
a panel depth of the panel is greater than a wall depth of the wall so that the panel interior surface is depthwise spaced apart from the wall interior surface.

2. A method of thermally controlling a room of an architectural structure, comprising:
determining, by a thermostat, that a room activation condition has been reached; and
activating, by the thermostat, the panel of claim 1 .

3. An architectural structure, comprising:
a wall of a room of the architectural structure; and a panel integrated into the wall, wherein the panel comprises thermoelectric components (TECs) arranged as a TEC grid, thereby defining a radiant panel,
wherein: the TECs, of the TEC grid, are thermally coupled to a common heat sink formed in part by an exterior surface of the wall; and the wall defines a wall surface area, the panel defines a panel surface area, and the panel surface area is between 5% and 20% of the wall surface area,
wherein the wall defines a panel aperture, and the panel is disposed within the panel aperture, wherein the wall defines a wall interior surface and a wall exterior surface that are depthwise spaced apart from each other, wherein the panel defines a panel exterior surface and a panel interior surface that are depthwise spaced apart from each other,
wherein: the wall exterior and interior surfaces and the panel exterior and interior surfaces are parallel to each other; and the panel exterior surface is flush with, or continuous with, the wall exterior surface to define the common heat sink for the TEC grid, and
wherein:
the panel defines a panel sandwich structure formed of a plurality of panel layers that are parallel to each other, wherein the TEC grid is a center panel layer located at or near a panel depthwise center of the panel, and
the plurality of panel layers are defined by:
the panel exterior surface and the panel interior surface, which define respective first and second heat sink panels;
first and second sets of heat fins, which are respectively coupled to the first and second heat sink panels;
first and second heat fin caps, which are respectively coupled to the first and second sets of heat fins; and
first and second conductors, which are respectively coupled between the first and second heat fin caps and the TEC grid,

wherein a thermal conductive circuit is defined between the panel exterior and interior surfaces, the first and second sets of heat fins, and the first and second heat fin caps.

4. A method of thermally controlling a room of an architectural structure, comprising:
determining, by a thermostat, that a room activation condition has been reached; and
activating, by the thermostat, the panel of claim 3 .

5. The architectural structure of claim 3 , wherein:
the TEC grid includes a plurality of rows and columns of the TECs that are spaced apart from each other, wherein the TECs are each thermally connected to each other via the thermal conductive circuit.

6. The architectural structure of claim 3 , wherein:
the wall defines a well depthwise center, depthwise between the wall interior surface and the wall exterior surface; and
the TEC grid is aligned with the wall depthwise center.

7. The architectural structure of claim 3 , wherein:
the first set of heat fins have a first fin depthwise span; and
the second set of heat fins have a second fin depthwise span that is less than the first fin depthwise span.

8. The architectural structure of claim 3 , wherein:
the first and second heat sink panels are, respectively, first and second rainscreens formed of aluminum; and
the first and second sets of heat fins are formed of aluminum.

9. The architectural structure of claim 3 , wherein:
the wall defines a wall sandwich structure formed of a plurality of wall layers that are parallel to each other, and the plurality of wall layers are defined by:
the wall interior surface, which is a first sheathing layer;
the wall exterior surface, which is at least in part formed of the same material as the panel exterior surface, and at least in part defines the common heat sink for the TEC grid;
a first insulation layer, which is disposed against the wall interior surface;
a second sheathing layer, which is disposed against the first insulation layer; and
a second insulation layer, which is disposed against the second sheathing layer, wherein:
a first airgap layer is defined between the wall interior surface and the first insulation layer; and
a second airgap layer is defined between the second insulation layer and the wall exterior surface.

10. The architectural structure of claim 9 , wherein the first and second sheathing layers are gypsum.

11. The architectural structure of claim 9 , comprising:
supports for the wall exterior surface that extend depthwise between the second insulation layer and the wall exterior surface.

12. The architectural structure of claim 9 , wherein:
the first insulation layer is batting and the second insulation layer is rigid foam, wherein:
the first insulation layer has a first insulation layer depth that is substantially three times a second insulation layer depth of the second insulation layer; and
a second airgap depth defined between the second insulation layer and the wall exterior surface is substantially the same as the second insulation layer depth.

13. The architectural structure of claim 12 , wherein:
a third insulation layer surrounds an outer boundary of the panel, depthwise between and extending perpendicularly to the wall exterior and interior surfaces, to thermally isolate the panel from the wall interior surface, the first insulation layer, the second sheathing layer, the second insulation layer, and the first and second airgap layers.

14. The architectural structure of claim 13 , wherein:
the third insulation layer is rigid foam having a thickness that is half of the second insulation layer depth.

15. The architectural structure of claim 3 , comprising:
a power source, controllable by a thermostat, connected to the first and second conductors to control a heating direction of the TEC grid.

Assignees

• Univ Massachusetts

Inventors

• Aksamija Ajla
• Aksamija Zlatan

Classifications

• H10N10/17

  characterised by the structure or configuration of the cell or thermocouple forming the device · CPC title

• E04B1/7654

  comprising an insulating layer, disposed between two longitudinal supporting elements, e.g. to insulate ceilings · CPC title

• F24F5/0089

  Systems using radiation from walls or panels · CPC title

• H02S20/26

  Building materials integrated with PV modules, e.g. façade elements (H02S20/25 takes precedence) · CPC title

• E04B1/762

  Exterior insulation of exterior walls · CPC title