Light-emitting device package for back light and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-12433076-B2
Application number	US-202217721052-A
Country	US
Kind code	B2
Filing date	Apr 14, 2022
Priority date	Apr 22, 2021
Publication date	Sep 30, 2025
Grant date	Sep 30, 2025

Abstract

A light-emitting device package includes an LED chip including a substrate having an upper surface, a semiconductor laminate structure formed under the substrate, and a first conductive connection pad and a second conductive connection pad formed under the semiconductor laminate structure, a wavelength conversion member having one surface in contact with the upper surface of the substrate, a light transmitting member covering a side surface of the LED chip and one surface of the wavelength conversion member adjacent to the side surface, and a reflector including at least one first region covering a side surface of the wavelength conversion member and the light transmitting member, and at least one second region covering the light transmitting member and exposing the side surface of the wavelength conversion member.

First claim

What is claimed is:

1. A method of manufacturing a light-emitting device package comprising:
preparing a plurality of LED chips comprising a substrate having an upper surface, a semiconductor laminate structure formed under the substrate, and a first conductive connection pad and a second conductive connection pad formed under the semiconductor laminate structure;
forming a wavelength conversion sheet directly on an upper surface of a temporary support sheet from a mixture comprising a fluorescent substance and an encapsulant;
arranging upper surfaces of the plurality of LED chips on the wavelength conversion sheet;
forming a light transmitting member between a side surface of each of the plurality of LED chips and one surface of the wavelength conversion sheet adjacent to the side surfaces of the plurality of LED chips by an injection method;
cutting the wavelength conversion sheet between the plurality of LED chips to form a plurality of wavelength conversion members arranged at predetermined intervals on the temporary support sheet;
filling a reflective material between the plurality of LED chips and the plurality of wavelength conversion members;
forming a reflector comprising
a first region covering a side surface of each of the wavelength conversion members and the light transmitting member and
a second region covering the light transmitting member and exposing the side surface of each of the wavelength conversion members; and

after forming the reflective material, removing the temporary support sheet by which the plurality of LED chips are individually separated,
wherein the maximum height of the filled reflective material corresponds to a distance between the upper surface of the temporary support sheet and the exposed surfaces of the first and second conductive connection pads formed on the LED chips, and
wherein forming the reflector comprises:
cutting the wavelength conversion members to form the first regions of the reflective material that cover the side surfaces of the wavelength conversion members and the light transmitting members; and
removing portions of the reflective material between the wavelength conversion members that do not form the first regions to create the second regions that cover the light transmitting members and expose the side surfaces of the wavelength conversion members.

2. The method of claim 1 , wherein a width of each of the plurality of wavelength conversion members is greater than a width of a corresponding LED chip selected from the plurality of LED chips.

3. The method of claim 1 , wherein a width of the reflector corresponding to the second region is the same as a width of a portion of each of the plurality of wavelength conversion members which protrudes from a corresponding LED chip selected from the plurality of LED chips.

4. The method of claim 1 , wherein one surface of the light transmitting member connecting the side surface of each of the plurality of LED chips and the one surface of a corresponding wavelength conversion member selected from the plurality of the wavelength conversion members is formed as a curved surface.

5. The method of claim 1 , wherein one surface of the light transmitting member is a concave surface facing the LED chip and the wavelength conversion member.

6. The method of claim 1 , wherein, when filling the reflective material, a portion of the semiconductor laminate structure between the first conductive connection pad and the second conductive connection pad is exposed without being covered by the reflective material.

7. A method of manufacturing a light-emitting device package comprising:
forming a wavelength conversion sheet directly on a temporary support sheet;
arranging a plurality of LED chips on the wavelength conversion sheet, each of the plurality of LED chips comprising a substrate, a semiconductor laminate structure, a first conductive connection pad, and a second conductive connection pad;
after arranging the plurality of LED chips on the wavelength conversion sheet, injecting a light transmitting member between a side surface of each of the plurality of LED chips and the wavelength conversion sheet;
cutting the wavelength conversion sheet to form a plurality of wavelength conversion members on the temporary support sheet at a predetermined interval;
filling a reflective material between each of the plurality of LED chips and each of the plurality of wavelength conversion members to form a reflector comprising:
a first region covering a side surface of each of the plurality of wavelength conversion members and the light transmitting member; and
a second region covering the light transmitting member and exposing the side surface of each of the plurality of wavelength conversion members; and

after forming the reflector, removing the temporary support sheet to individually separate the plurality of LED chips,
wherein the maximum height of the reflector is the same as a distance between the upper surface of the temporary support sheet and the exposed surfaces of the first and second conductive connection pads of the LED chips, and
wherein filling the reflective material further comprises:
cutting the plurality of wavelength conversion members to form the first region that covers the side surface of each of the plurality of wavelength conversion members and the light transmitting member; and
removing portions of the reflective material between the wavelength conversion member that does not form the first region to form the second region that covers the light transmitting member and exposes the side surface of each of the plurality of wavelength conversion members.

8. The method of claim 7 , wherein a width of each of the plurality of wavelength conversion members is greater than a width of a corresponding LED chip selected from the plurality of LED chips.

9. The method of claim 7 , wherein a width of the reflector corresponding to the second region is the same as a width of a portion of each of the plurality of wavelength conversion members which protrudes from a corresponding LED chip selected from the plurality of LED chips.

10. The method of claim 7 , wherein each of the light transmitting members connecting each of the plurality of LED chips and each of the wavelength conversion members comprises a curved surface.

11. The method of claim 7 , wherein each of the light transmitting members comprises a concave surface.

12. The method of claim 7 , wherein filling the reflective material comprises exposing a portion of the semiconductor laminate structure between the first conductive connection pad and the second conductive connection pad from the reflective material.

13. The method of claim 7 , wherein the wavelength conversion sheet is formed on the temporary support sheet from a mixture comprising a fluorescent substance and an encapsulant.

Assignees

• Lumens Co Ltd

Inventors

• Jo Sung Sik
• Kim Pyeong Guk

Classifications

• H10H20/0363

  of optical field-shaping means · CPC title

• H10H20/0361

  of wavelength conversion means · CPC title

• H10H20/851

  Wavelength conversion means · CPC title

• H10H20/018

  Bonding of wafers · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title