Sensing device and electronic device

Patent metadata

Field	Value
Publication number	US-12433053-B2
Application number	US-202418676702-A
Country	US
Kind code	B2
Filing date	May 29, 2024
Priority date	Jun 11, 2021
Publication date	Sep 30, 2025
Grant date	Sep 30, 2025

Abstract

A sensing device is provided. The sensing device includes a driving substrate, a sensing module, and a plurality of bonding pads. The driving substrate includes a first substrate and a plurality of driving circuits disposed on the first substrate. Each of the driving circuits includes a plurality of thin-film transistors. The sensing module is bonded to the driving substrate, and the sensing module includes a second substrate and a plurality of sensing elements disposed on the second substrate. The sensing module is bonded to the driving substrate through the bonding pads. In addition, each of the driving circuits is electrically connected to at least one of the sensing elements. The wavelength of light penetrating the first substrate is greater than or equal to 4 μm and less than or equal to 10 μm. An electronic device including the sensing device is also provided.

First claim

What is claimed is:

1. A sensing device, comprising:
a driving substrate, comprising a first substrate and a plurality of driving circuits disposed on the first substrate, each of the plurality of driving circuits comprising a plurality of thin-film transistors, wherein a material of the first substrate comprises glass or polyimide;
a sensing module bonded to the driving substrate, the sensing module comprising a second substrate, a plurality of sensing elements and a passivation layer disposed on the second substrate, wherein the second substrate is an epitaxial substrate;
a plurality of bonding pads, wherein the sensing module is bonded to the driving substrate through the plurality of bonding pads; and
a plurality of first electrodes disposed on the driving substrate and a plurality of second electrodes disposed on the sensing module, wherein the plurality of bonding pads are disposed between the plurality of first electrodes and the plurality of second electrodes,
wherein each of the plurality of driving circuits is electrically connected to at least one of the plurality of sensing elements,
wherein the bonding pad has a first width, the first electrode has a second width, and the second electrode has a third width, and the first width is greater than or equal to the second width, and the first width is greater than or equal to the third width,
wherein a pitch between the plurality of sensing elements is greater than or equal to 15 μm and less than or equal to 20 μm,
wherein a wavelength of light penetrating the first substrate is greater than or equal to 4 μm and less than or equal to 10 μm,
wherein the second electrode has a first portion disposed on a surface of the passivation layer and a second portion disposed in a through-hole of the passivation layer, and both the first portion and the second portion have a rounded corner.

2. The sensing device as claimed in claim 1 , wherein the plurality of thin-film transistors comprise a first thin-film transistor and a plurality of second thin-film transistors, the first thin-film transistor is electrically connected to the plurality of sensing elements through the plurality of second thin-film transistors, respectively.

3. The sensing device as claimed in claim 2 , wherein the plurality of second thin-film transistors are transfer transistors.

4. The sensing device as claimed in claim 1 , wherein at least one of the plurality of sensing elements comprises a semiconductor material, and the semiconductor material comprises one of indium phosphide (InP), indium antimonide (InSb), indium gallium arsenide (InGaAs), lead sulfide (PbS), lead selenide (PbSe), mercury cadmium telluride (HgCdTe), or a combination thereof.

5. The sensing device as claimed in claim 1 , wherein the first substrate and the second substrate are curved substrates.

6. The sensing device as claimed in claim 1 , comprising a plurality of sensing modules, wherein the plurality of sensing modules are bonded to the driving substrate.

7. The sensing device as claimed in claim 1 , wherein the plurality of sensing elements are used for absorbing light in an infrared wavelength range.

8. The sensing device as claimed in claim 7 , wherein the infrared wavelength range is greater than or equal to 750 nm and less than or equal to 1500 nm.

9. An electronic device, comprising:
a display panel having a display side; and
a sensing device attached to a side of the display panel opposite to the display side, the sensing device comprising:
a driving substrate, comprising a first substrate and a plurality of driving circuits disposed on the first substrate, each of the plurality of driving circuits comprising a plurality of thin-film transistors, wherein a material of the first substrate comprises glass or polyimide;
a sensing module bonded to the driving substrate, the sensing module comprising a second substrate, a plurality of sensing elements and a passivation layer disposed on the second substrate, wherein the second substrate is an epitaxial substrate; and
a plurality of bonding pads, wherein the sensing module is bonded to the driving substrate through the plurality of bonding pads;
wherein each bonding pad of the plurality of bonding pads has a first width, the first electrode has a second width, and the second electrode has a third width, and the first width is greater than or equal to the second width, and the first width is greater than or equal to the third width,
wherein each of the plurality of driving circuits is electrically connected to at least one of the plurality of sensing elements,
wherein the plurality of sensing elements are closer to the display panel than the plurality of driving circuits,
wherein the display panel comprises a display layer and a light source, and the display layer and the light source do not overlap in a normal direction of the display layer,
wherein a wavelength of light penetrating the first substrate is greater than or equal to 4 μm and less than or equal to 10 μm,
wherein the second electrode has a first portion disposed on a surface of the passivation layer and a second portion disposed in a through-hole of the passivation layer, and both the first portion and the second portion have a rounded corner.

10. The electronic device as claimed in claim 9 , wherein the light source provides light in an infrared wavelength range.

11. The electronic device as claimed in claim 10 , wherein the infrared wavelength range is greater than or equal to 750 nm and less than or equal to 1500 nm.

12. The electronic device as claimed in claim 9 , wherein the display panel further comprises a cover plate disposed on the display layer.

13. The electronic device as claimed in claim 9 , further comprising an adhesive layer disposed between the display panel and the sensing device.

14. The electronic device as claimed in claim 9 , wherein at least one of the plurality of sensing elements comprises a semiconductor material, and the semiconductor material comprises one of indium phosphide (InP), indium antimonide (InSb), indium gallium arsenide (InGaAs), lead sulfide (PbS), lead selenide (PbSe), mercury cadmium telluride (HgCdTe), or a combination thereof.

Assignees

• Innolux Corp

Inventors

• Liu Yu-Tsung
• Lee Te-Yu

Classifications

• H10F39/811

  Interconnections · CPC title

• H10F39/198

  Contact-type image sensors [CIS] · CPC title

• G06F3/0421

  by interrupting or reflecting a light beam, e.g. optical touch-screen · CPC title

• G06V40/1318

  using electro-optical elements or layers, e.g. electroluminescent sensing · CPC title

• G06F3/04164

  Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads · CPC title