Systems and methods for cooling datacenters

US12432889B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12432889-B2
Application numberUS-202318126866-A
CountryUS
Kind codeB2
Filing dateMar 27, 2023
Priority dateMar 27, 2023
Publication dateSep 30, 2025
Grant dateSep 30, 2025

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A thermal management system includes an air handling unit (AHU) configured to receive outside air (OA) from an OA intake, and water from a water source, where the AHU is configured to direct conditioned air toward a cold aisle and the AHU includes a modular adiabatic layer containing an evaporative media, and the modular adiabatic layer includes a plurality of subregions configured to be wetted by the evaporative media independently of one another.

First claim

Opening claim text (preview).

What is claimed is: 1. A thermal management system comprising: an air handling unit (AHU) configured to receive outside air (OA) from an OA intake, and water from a water source, wherein: the AHU is configured to direct conditioned air toward a cold aisle and the AHU includes a modular adiabatic layer containing an evaporative media, and the modular adiabatic layer includes a plurality of subregions configured to be wetted by the evaporative media independently of one another. 2. The thermal management system of claim 1 , further comprising: at least one datacenter sensor; at least one environmental sensor; and a supervisory control system (SCS) in data communication with at least the AHU, the at least one datacenter sensor, and the at least one environmental sensor and configured to control at least one operating condition of the AHU. 3. The thermal management system of claim 2 , wherein the environmental sensor includes at least one of an environmental temperature sensor, a humidity sensor, a water source temperature sensor; and a barometer. 4. The thermal management system of claim 2 , wherein the datacenter sensor includes at least one of a component temperature sensor, a component humidity sensor, a datacenter temperature sensor, a datacenter humidity sensor, and a processing load sensor. 5. The thermal management system of claim 1 , wherein the modular adiabatic layer includes an evaporative substrate including a plurality of substrate materials. 6. The thermal management system of claim 1 , wherein the SCS controls at least water flow to the subregions of the modular adiabatic layer. 7. The thermal management system of claim 6 , wherein the SCS is in data communication with a plurality of evaporative media valves configured to control delivery of the evaporative media to the plurality of subregions of the modular adiabatic layer. 8. The thermal management system of claim 1 , wherein the modular adiabatic layer includes an evaporative substrate with a porosity less than 1 micrometer. 9. The thermal management system of claim 1 , wherein the SCS controls at least one operating condition of the AHU including at least one of water pump speed, fan speed, and a wetted subregion of the modular adiabatic layer. 10. The thermal management system of claim 1 , wherein the water source is a fuel cell. 11. The thermal management system of claim 1 , wherein the SCS is in data communication with an allocator. 12. A thermal management system for thermal management of a datacenter comprising: an outside air (OA) intake; a water storage tank in fluid communication with a pre-cooling chiller; the air handling unit (AHU) of claim 1 , configured to receive water from the water storage tank; at least one datacenter sensor; at least one environmental sensor; and a supervisory control system (SCS) in data communication with at least the AHU, the at least one datacenter sensor, the at least one environmental sensor, and a control service of the datacenter and configured to control at least one operating condition of the pre-cooling chiller and the AHU. 13. A method of thermal management in a datacenter, the method comprising: at a supervisory control system (SCS), obtaining thermal demand information; obtaining water source information; obtaining power source information; and based at least partially on the thermal demand information, the water source information, and the power source information: setting a water flowrate through an evaporative media valve to a first subregion of a modular adiabatic layer of an air handling unit (AHU), measuring at least one property of a conditioned air conditioned with the AHU, and setting a fan speed of a fan in communication with the conditioned air. 14. The method of claim 13 , further comprising obtaining datacenter temperature information at a plurality of zones in the datacenter; and determining an affected zone of the plurality of zones affected by the first subregion of the modular adiabatic layer. 15. The method of claim 13 , wherein the water source information includes water source availability. 16. The method of claim 13 , wherein the power source information includes utility grid pricing information. 17. The method of claim 13 , wherein setting the fan speed of a fan includes selecting at least one of an upstream fan or downstream fan, wherein the upstream fan is upstream of the modular adiabatic layer and the downstream fan is downstream of the modular adiabatic layer. 18. The method of claim 13 , wherein the fan is in the AHU. 19. The method of claim 13 , wherein setting a water flowrate is further based on a weather forecast. 20. The method of claim 13 , wherein setting a water flowrate is based at least partially on a relative humidity of air in the datacenter.

Assignees

Inventors

Classifications

  • within rooms for removing heat from cabinets, e.g. by air conditioning device · CPC title

  • Thermal management, e.g. server temperature control · CPC title

  • Evaporators · CPC title

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Frequently asked questions

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What does patent US12432889B2 cover?
A thermal management system includes an air handling unit (AHU) configured to receive outside air (OA) from an OA intake, and water from a water source, where the AHU is configured to direct conditioned air toward a cold aisle and the AHU includes a modular adiabatic layer containing an evaporative media, and the modular adiabatic layer includes a plurality of subregions configured to be wetted…
Who is the assignee on this patent?
Microsoft Technology Licensing Llc
What technology area does this patent fall under?
Primary CPC classification H05K7/20836. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 30 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).